BGA Inspection
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Product
Optical BGA Inspection
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Imaging hidden solder joints of BGA, IBGA, FlipChip, CSP, CGA and SMD components
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Product
Tool, Inspection Depth Gauge, Micro Coax, ITA
910121180
Inspection Tool
Tool, Inspection Depth Gauge, Micro Coax, ITA.
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Product
Tool, Inspection Depth Gauge, Micro Coax, Receiver
910121179
Inspection Tool
Tool, Inspection Depth Gauge, Micro Coax, Receiver
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Product
Tool, Inspection Depth Gauge, Mini Coax, ITA
910121157
Inspection Tool
Used to verify the depth setting of the center conductor of the ITA mini coax contacts.
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Product
BGA Socket Adapter Systems
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Advanced Interconnections Corp.
BGA Socket Adapter Systems convert surface mount device packages to through hole (pinned) assemblies, making it easy to plug and unplug SMT devices whether you are planning for future device upgrades, field programming at point of use, or need the ability to quickly swap out device packages in the field or the test lab. Protects valuable PC boards and saves time by eliminating the need to desolder packages during device removal.
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Product
Inspection Kits
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Elcometer offers one of the widest ranges of inspection equipment available. Our products are used across numerous industry sectors. In all cases, there is always a need to undertake a number of specific inspections during quality control assessments - as one parameter can affect another.
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Product
Inspection Microscope/Video
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Connector end face contamination is a big problem with fiber optic cables and patch cords and it causes network issues. If you are a professional technician, you need a quality optical microscope. The magnification of connector end faces will allow you to discover any quality problems such as scratches. You need to make sure you have a clean connection with no dirt and debris. Visual inspection is fast, easy and simple. Using this test equipment can help avoid problems.
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Product
BGA SMT Adapters
Giga-snaP™
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Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
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Product
Field Inspections
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MISTRAS Group has evolved into an asset protection industry leader on the backbone of our expansive non-destructive testing (NDT) and field-testing portfolio.
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Product
Inspection System
Pixie
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3-D Metrology for automation. Pixie is a standard system for automated optical quality inspection. Pixie can be configured with 2 to 5 servo driven axis movement and the high-speed measurement capabilities make it suitable for inline and stand-alone solutions.
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Product
Inspection scope
KI-TK1012
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Inspection scope & cleaning materials. Interchangeable MPO SC LC connectors
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Product
BGA Socket And BGA Adapter Systems
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Mill-Max's BGA Socket/Adapter Systems are used for both socketing BGA devices and interconnecting circuit boards. Systems are available to fit 1mm, .050" and .8mm grid footprints.
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Product
DDR4 BGA Interposers, DDR4 DRAM X4/x8 Packages
N2114A
Interposer
The N2114A DDR4 BGA interposers provide signal access to the clock, strobe, data, address and command signals to the DDR4 BGA package for making electrical and timing measurements with an Infiniium oscilloscope. With the DDR4 JEDEC specification defined at the DRAM ballout, the BGA probe adapter provides direct signal access to BGA package for true compliance testing.
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Product
Wafer Inspection System
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JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
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Product
Biofuels Testing and Inspection
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Intertek delivers assurance, testing, inspection and certification services to refiners, producers, blenders, distributors, consumers and research institutes across the world.
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Product
Test & Inspection
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Our test and inspection products support maintenance, product quality testing, diagnostics, and quality control. The extensive range of products covers almost any application need you to have.
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Product
Automated Inspection Systems
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Our systems utilize phased array and eddy current array to inspect the full volume and surface of various products and profiles in many manufacturing industries, such as metal, aerospace, transportation, power generation, and oil & gas.
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Product
CT Inspection System
FF35 CT
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The YXLON FF35 CT computed tomography system is designed to achieve extremely precise inspection results for a wide range of applications. Available in a single or dual tube configuration, it is perfect for very small to medium size parts inspection in the automotive, electronics, aviation, and material science industries.
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Product
BGA Sockets
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Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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Product
Thickness and Flaw Inspection
NORTEC 600
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Olympus converges its latest advancements in high-performance digital circuitry and eddy current flaw detection into one compact and durable portable unit—the new NORTEC® 600. With its crisp and vivid 5.7 inch VGA display and true full-screen mode, the NORTEC 600 is capable of producing highly visible and contrasting eddy current signals in any lighting condition.
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Product
X-ray Inspection System
TruView Prime
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The TruView Prime is a fully motorized radiography system developed to meet the stringent requirements of electronics assembly and component inspection. The TruView Prime is professionaly built - something hard to find in entry level systems in the TruView Prime's price range.
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Product
Conformal Coating Inspection
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Conformal coating plays a key role especially when electronic assemblies are used in products and systems that perform safety-relevant tasks. The coatings applied to the circuit board protect against environmental influences such as dirt, dust, moisture, condensation, and varying temperatures. Increasing packing densities and the trend toward miniaturization are also making conformal coatings essential. The insulating effect of the coating allows reductions in the distance between conductor paths while also boosting the performance of terminal devices.
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Product
Connector Inspection
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The USB Connector Inspection System features easy focusing with high resolution imaging. The system includes standard software that provides image display, image capture, digital zoom, auto calibration, and basic analysis tools. Pass/Fail analysis and reporting features are optional software features. The Inspection System scope is fully compatible with the FiberWarrior Pro OTDR as well as other FiberWarrior Pro test sets, providing a full fiber optic testing solution.
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Product
Inspection System
X-eye 7000B
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Appropriate for the inspection of medium•large size components and detection of surface structure and defects (inside voids and cracks etc).Due to high-energy, high-power Micro-focus X-ray Open Tube, maintenance cost's significantly reduced and long-term use possible with only replacing consumables.Customization is available with selecting main parts by customers depends on their needs for size and material.
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Product
Vison Inspection System
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High Speed stroboscopic 2D vision inspection system for die attached and wirebond quality in back-end semiconductor processes. User friendly HMI for easy recipe creation and management. Able to configure with various defect identification module. (Strip Mapping, Inker, Scriber, Pucher, Bristle, Laser wire cutter and Laser clip bonding cutter.)
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Product
IPC Inspection
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Customers of MASER Engineering that are designing electronic products and thereby using bare and assembled Printed Circuit Boards (PCB's) are interested in the manufacturing quality of the PCB and assembling quality of the PCBA.
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Product
Inspection Toolkit
OTK-4000
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The Inspection Toolkit contains selected tools for verifying the existence of threatening electronic surveillance devices.
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Product
In-Line Inspection
Mapvision | Q
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Inspect ALL features for EACH part you manufature within your Takt time – even for the most complex components with hundreds of features.
