X-ray Inspection Systems
See Also: Inspection Systems, Automated Fiber Optical inspection Systems
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Scienlab Battery Test System – Pack Level, 220 KW
SL1730A
Keysight’s SL1700A Scienlab Battery Test System – Pack Level Series allows to realistically emulate the environment of the future battery pack application in order to test the high-power battery pack comprehensively and improve its functions and safety. The growing demand of e-mobility increases the need of vast battery test labs for EV battery development. Keysight developed the SL1700A Series to accelerate the development and validation of batteries. It offers a voltage range of up to 1500 V and power options between 100 and 300 kW including a Performance Bundle to increase the power up to 330 kW. The new high-voltage SiC (silicon carbide) technology provides a high energy efficiency on a small footprint and helps to minimize your operating costs.
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Anritsu DualX Inspection Systems
The new DualX inspection system from Anritsu offers unsurpassed detection of high-density foreign material, including small bone fragments. Built on Anritsu's groundbreaking, field-proven original model, the DualX gives you the best detection capability available in the industry, along with a significantly lower total cost of ownership (TCO).
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Smart Factory Inspection System
API, recognizing manufacturing industry’s increasing demand for part measurement automation, with a higher degree of accuracy, has developed its Smart Factory Inspection System with true 6 Degrees of Freedom (6DoF) real-time 3D robotic measurement incorporating its proven metrology technology and calibration components.SFIS can be delivered as a customized integrated solution or as a standard production inspection cell.
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X-ray Fluorescence Measuring System
FISCHERSCOPE X-RAY/XDV-SDD
Premium model for universal use for the inspection of very thin or complex layers up to RoHS screening at very low detection limits.
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Vison Inspection System
High Speed stroboscopic 2D vision inspection system for die attached and wirebond quality in back-end semiconductor processes. User friendly HMI for easy recipe creation and management. Able to configure with various defect identification module. (Strip Mapping, Inker, Scriber, Pucher, Bristle, Laser wire cutter and Laser clip bonding cutter.)
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Automated Gage Measurement System
AGMS
Our Automated Gage Measurement System for Sand Screen (AGMS) provides accurate and repeatable optical measurements for all wire-wrapped gaps along the full screenlength. This inspection machine enables oil field sand screen manufacturers to meet the measurement requirements of API Spec 19S1 and ISO 17824:2009.
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Automatic Flight Inspection Systems
AT-940
The AT-940 is a mobile and deployable flight inspection system providing high performance in the smallest possible package.
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Automatic and Accurate Inspecting Systems
Circuit AOI
The Circuit AOI system is designed to perform automatic and accurate inspecting systems. It integrates rigid mechanical system with advanced vision technology and manufactured and tested by strict is standards. It is suitable for circuit inspection for PCB/FPC, verification and repair. Innovation and unique inspection algorithms are applied to inspect open, short, protrusion, nick, scratch, pin hole, island, line width/space violation, object missing and others defects. AOI system can use offline setup project and check results. It will improve the throughput.Compare to halogen lighting, the full angle LED lighting of Circuit AOI can obtain the best image contrast and is good for different panel type inspection.
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X-ray sources / X-ray optics
X-ray sources are the heart of every X-ray analytical instrument. In combination with advanced X-ray optics, they generate the required X-ray radiation for structure analysis in various fields of material and life sciences. X-ray sources must offer perfect thermal constancy for excellent position stability of the X-ray beam as well as high intensity, even at low power levels. The design has to guarantee easy integration into advanced X-ray equipment paired with straightforward operation to keep uptimes high and to guarantee maximum radiation safety for operators and equipment.
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Defect Inspection System
F30
The F30 System boasts a five-objective turret that enables the resolution-throughput flexibility required by today’s multi-process inspection applications. Equipped with an advanced productivity suite (waferless recipe creation, simultaneous FOUP, recipe server and tool matching), the F30 System redefines inspection cost of ownership expectations.
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Semiconductor Wafer Microscope Inspection System
MicroINSPECT
MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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Test System Optimized for High Throughput, Low Cost of Test for Single Site, Multi-site and Index Parallel Applications
ETS-88RF
Targeting the needs of power amplifier (PA) and front-end-module (FEM) semiconductor manufacturers, the ETS-88RF test system is aligned with the test challenges associated with these direct RF radio wave interface components. The precision with which the ETS-88RF can measure high-gain, wideband frequency performance, adjacent channel leakage and power supply efficiency makes this test system the most cost-effective alternative to bench set-ups. Teradyne routinely provides timely updates to a substantial library of RF Standards (such as 802.11xx and 3GPP) targeted for PA and FEM test.
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Solder Joint Inspection System
DMC developed the software to inspect the solder joints of automotive power door lock switches.
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X-ray Fluorescence
XRF analysis – one of the best analytical techniques to perform elemental analysis in all kinds of samples, no matter if liquids, solids or loose powders must be analyzed.
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X-Ray Detectors
With the need to always reduce the inspection time to the strict minimum, the NDT world is slowly reducing its dependency on films and jumping straight into the Digital Radiography (DR) revolution. While saving tremendous amount of time and money not developing films, digital radiography also enables you to edit, record and send your inspections to whomever, whenever and wherever you want.
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Measuring And Inspection Systems For Rubber And Tires
The rubber processing industry, as well as the tire production process is supported by Micro-Epsilon with a range of systems for inspection, monitoring and control of miscellaneous processes.
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Image Sensor Test System
IP750
Teradyne's IP750 series dominates the image sensor tester market with its superior performance and low cost of test. The IP750 delivers high throughput and high parallel test efficiency, broad device test coverage from CCD and CIS, analog and digital capture, and concurrent image sensor and logic testing. In addition, Teradyne's IG-XL software environment provides easy, shorter test program development and easy maintenance.
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Semiconductor Test System
TS-960e
The GENASYS Semi TS-960e PXI Express Semiconductor Test System is an integrated test platform that offers comparable system features and capabilities found in proprietary ATE systems. Available as a bench top system or with an integrated manipulator, the TS-960e takes full advantage of the PXI architecture to achieve a cost-effective and full-featured test solution for device, SoC and SiP test applications.
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X-ray Fluorescence Measuring system
FISCHERSCOPE® X-RAY 4000 Series
Inline measuring with maximum endurance. Robust inline device for measuring on solid strips, punched grids with measuring structures from a few millimeters up to coated membranes or solid strips up to one meter wide.
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X-ray Fluorescence Measuring System
FISCHERSCOPE X-RAY 5000
Inline measuring with highest precision for thin films. Robust XRF instrument for measuring and analyzing thin films and layer systems in the running process with connection to the production control system.
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Inspection System for Die Casting
X-eye 7000BS
Appropriate for medium•large size component inspection and detecting surface structure and defects(inside voids and cracks etc).Due to high-energy, high-power Micro-focus X-ray Open Tube, maintenance cost's reduced significantly and enables long-term use with only replacing consumables.Customization is available with selecting main parts by customers depends on their needs for size and material.
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X5 Pack X-Ray Inspection
Designed to be integrated into line with built-in automatic reject and available in 300, 500 and 600 mm belt width models, the X5 Pack is perfect for a variety of unpackaged and packaged products.
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X-Ray Cameras
A range of scientific camera solutions optimized for high energy / X-Ray detection.
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Inspection System
X-eye 7000B
Appropriate for the inspection of medium•large size components and detection of surface structure and defects (inside voids and cracks etc).Due to high-energy, high-power Micro-focus X-ray Open Tube, maintenance cost's significantly reduced and long-term use possible with only replacing consumables.Customization is available with selecting main parts by customers depends on their needs for size and material.
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Backplane Profiling & Inspection System
603d
A major problem in the backplane industry is detecting bent connector pin defects. The most difficult being when the pin bends underneath the shroud rather than going into the hole. Many times this defect cannot be detected electrically as the connector pin is touching the conductive annular ring of the hole, allowing electrical test to pass. Unfortunately, it is an intermittent connection and will fail later on as there is not an actual mechanical connection.
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Wafer Inspection System
INSPECTRA® Series
INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
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Dimensional Inspection (3D Inspection)
The 3D measurement data from our scanners and PCMMs offers a comprehensive definition of a physical object that is used for measurement, inspection, comparison and reporting. When a part is defined by millions of points, you can see subtle deviations, slight variations and fine details, which gives you the confidence that a part (or mold) meets your specifications. To deliver the best of both worlds, we combine 3D scanning with our contact, touch-probe measurement tools to deliver precise dimensions on geometric shapes.
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Inspection Tools
Deca XG1040
SATA 3.0 Gbps interface supportedSATA 3.0 Gbps supported. Up to 144PB HDD is supported.Register and edit inspection details (operation modes)Operation modes can be registered and edited using script files in text format.More accurate inspections can be performed using various types of inspections.Provides high speed data transfer at 8GB/minute.(* Varies according to performance of connected HDD.)Deletion and quick diagnostics functionEquipped with overwrite deletion using specified values and DoD (Department of Defense) conforming deletion method.Quick inspections such as SMART status, random seek inspection, entire area read/write inspection can be performed.HDDs connected to each port can be executed, terminated, attached or removed individually.Multiple channels supportedUp to 16 HDDs can be operated by attaching 4 devices.
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Wafer Inspection System
JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
