Wafer Level
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High Voltage 50 Ω Pulse Generator
TLP-8010C
High Power Pulse Instruments GmbH
*Wafer and package level TLP/VF-TLP/HMM testing*Combines TLP-8010A and TLP-4010C into one system*Can be operated together with TLP-8012A5 and TLP-3011C pulse width extenders*Ultra fast 50 Ω high voltage pulse output with typical rise time 100 ps (0-40 A) and 300 ps (> 40 A)*Up to 80 kW peak output power into 50 Ω load*Built-in HMM pulse up to ±15 kV with 50 Ω configuration*High pulse output current up to ±80 A (short circuit) with minimum 6 dB reflection suppression*High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)*6 GPIB programmable pulse rise times: 100 ps to 50 ns*8 programmable pulse widths: 1 ns to 100 ns (0-40 A), 1 built-in pulse width: 100 ns (> 40 A)*The optional pulse width extender TLP-3011C enables pulse width up to 1.6 µs in 68 GPIB programmable steps (0-40 A)*Optional external pulse width extensions from 5 ns to 500 ns (> 40…80 A) using the external pulse width extender TLP-8012A5*Built-in pulse reflection suppression*Fast measurement time, typically less than 0.2 s per pulse including one-point DC measurement between pulses*Efficient software for system control and waveform data management*The software can control automatic probers for fast measurements of complete wafers*High performance and high quality components
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High Voltage 50 Ω Pulse Generator
TLP-4010C
High Power Pulse Instruments GmbH
*Wafer and package level TLP/VF-TLP/HMM testing*Ultra fast 50 Ω high voltage pulse output with typical 100 ps rise time*Built-in HMM (IEC 61000-4-2) pulse up to ±10 kV*High pulse output current up to ±40 A*High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)*6 programmable pulse rise times: 100 ps to 50 ns*8 programmable pulse widths: 1 ns to 100 ns*Optional pulse width extender increases pulse width up to 1.6 µs in 68 programmable steps*Fast measurement time, typically 0.2 s per pulse including one-point DC measurement between pulses*Efficient software for system control and waveform data management*The software can control automatic probers for fast measurement of complete wafers*High performance and high quality components
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Probe Card
T90™ Series
The 90 mm tile was designed for mounting on a standard 4.5″ probe card holder for multi-site wafer level reliability testing. The 1.6 mm (0.062″) thick rails allow the chassis to slip into planarity adjustable probe card holders for most analytical probe stations.
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High Voltage 50 Ω Pulse Generator
TLP-8010A
High Power Pulse Instruments GmbH
*Wafer and package level TLP/HMM testing*Fast 50 Ω high voltage pulse output with typical 300 ps rise time*Up to 80 kW peak output power into 50 Ω load*Built-in HMM pulse up to ±15 kV with 50 Ω-configuration*High pulse output current up to ±80 A (short circuit) with 6 dB reflection suppression*High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)*6 GPIB programmable pulse rise times: 300 ps to 50 ns*1 built-in pulse width: 100 ns*Optional external pulse width extensions 5/10/50/100/200/500 ns using an external pulse width extender TLP-8012A5*Fast measurement time, typically 0.2 s per pulse including one-point DC measurement between pulses*Efficient software for system control and waveform data management*The software can control automatic probers for fast measurements of complete wafers*High performance and high quality components
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High Power Devices
SemiProbe configures our PS4L Adaptive Architecture into the Voltarus (TM) family of probe stations to fulfill the unique requirements of testing high power devices at wafer level prior to packaging. Voltarus probe stations are available in manual, semiautomatic, and fully automatic configurations that can test and characterize power devices up to 10 KV or 200 Amps (pulsed).
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Humidity Sensors
digital humidity sensor with integrated temperature sensor that provides excellent measurement accuracy at very low power. The device measures humidity based on a novel capacitive sensor. The humidity and temperature sensors are factory calibrated. The innovative WLCSP (Wafer Level Chip Scale Package) simplifies board design with the use of an ultra-compact package. The sensing element of the HDC1008 is placed on the bottom part of the device, which makes the HDC1008 more robust against dirt, dust, and other environmental contaminants. The HDC1008 is functional within the full 40C to +125C temperature range.
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Wafer & Die Inspection
SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Wafer Sorter and Inspection
SolarWIS Platform
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Level Measurement & Level Sensors
With so many technologies, products and parameters to consider, selecting the best technology for level measurement can be challenging. Choose from the comprehensive Rosemount portfolio of level devices for the best solution for your level application.
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Wafer Cathodoluminescence Microscope
Säntis 300
Attolight’s Quantitative CL-SEM offers “No Compromise” large field fast scanning simultaneous acquisition of SEM images, hyperspectral CL maps, and optical spectra. Smaller diameter wafers, or miscellaneously shaped substrates are manually loaded on intermediary 300mm susceptors subsequently handled automatically by the tool.
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Wafer Mapping Sensor
M-DW1
Panasonic Industrial Devices Sales Company of America
To provide better safety and improved sensing accuracy, Panasonic studied the requirements for future Wafer Mapping Sensors to ultimately develop the LED Beam Reflective Type Wafer Mapping Sensor, M-DW1. This Sensor uses LEDs as a light source for safe operation and a 2-segment receiving element for higher accuracy in wafer detection.
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Wafer Manufacturing
Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
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Contactless Wafer Geometry Gauge
MX 20x series
The E+H geometry gauges are based on two heavy plates mounted parallel to each other. Embedded in the plate are a set of capacitive distance sensors. The wafer will be moved manual or automatically between the plates and measured without any movement.
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Wafer Chucks
ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Wafer Thickness Measurement System
MPT1000
Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by Creden Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height, bow and warp measurements)
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Wafer Demounting And Cleaning Machines
Demounting and cleaning to high throughput fully automatic ingot after cutting in the slicing machine and wire saw.
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Signal Level Meter
T1125
Hangzhou Softel Optic Co., Ltd.
The signal level meter, SE828C is able to measure EQ, C/N, V/A and trunk volt in the CATV analog system, the number keys is designed to direct input frequency so that work would be easier. It can measure 2 channels at the same time.
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Wafer Flatness Measurement System
FLA-200
*Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)*Measures all materials including Si, GaAs, Ge, InP, SiC*Full 500 micron thickness measurement range without re-*calibration2-D /3-D Mapping software
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Sound Level Meters
Complies with IEC 61672-1 class 2 standard, Measures Leq, MaxL, MinL, SPL, 64,000 Records Data Logger, PC interface
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Level System
Universal II
The Universal II level transmitter offers increased reliability, low maintenance and an intrinsically safe design for dependable level measurements in all kinds of process liquids, slurries, granulars and interfaces.Universal IIThe Universal II is a two wire level transmitter that eliminates the need for line power in the field and saves costs for additional hardware. It provides reliable level measurements in all kinds of process liquids, slurries, granulars and interfaces.When powered from an approved source this level transmitter can be made intrinsically safe. Its rugged contruction resists corrosion and abraision. The no moving parts design eliminates break downs.The Universal II level transmitter utilizes RF Admittance technology with manual calibration and a 4 – 20 mA output signal. The patented Cote-Shield circuitry ensures accuracy and reliability regardless of product build-up on the level transmitter.This level system is unaffected by changes in the process material density, pressure, or temperature variations.
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Sound Level Monitor
McLennan Sound Monitoring, Inc
McLennan Sound Monitoring, Inc. offers two unique single-ranged instruments. For high sensitivity areas 41dBA – 101dBA range, and a standard range of 61dBA – 121dBA. A whisper from two feet will activate the 41dBA LED. Normal human conversation ranges from 60 – 80 dBA. Low level talk from two feet will activate the 61dBA LED.
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Specialty Level Instruments
As a comprehensive provider of level measurement products, ABB offers a variety of specialty level instruments that complement field instrumentation to provide the customer with the total level solutions.
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Continuous Level Measurement
Drexelbrook manufactures a full range of continuous level measurement instruments, providing the highest level of performance for liquids, slurries and bulk solids applications. With a wide variety of technology options, Drexelbrook is uniquely qualified to properly evaluate and recommend the very best solution for your application.
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Semiconductor Wafer Microscope Inspection System
MicroINSPECT
MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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Sound Level Meter
The Sound Level Meter is shown positioned near the top of the main Daqarta window. Like the Voltmeter and Frequency Counter, it can be positioned anywhere on the screen, and the size of the display font changes when you resize the meter by dragging its borders. You can fill the screen for a really big readout that can be seen from across the room.
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Wafer Auto Line Integration
The line is used for semiconductor wafer grinding. It carries out material matching and distribution, automatic loading and unloading, auto focusing and positioning and many other functions. The grinding precision is 2μm(3-sigma). It is also capable of collecting and analyzing real-time production data and interfacing with MES system.
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Contact Level Sensors
Contact level devices come in contact with the tank media and are used for point or cocntinious level measurement. Types include Float, Optical, RF Capacitence, Conductivity, Ultrasonic, Tuning Fork.
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Sound Level Meter
2310 SL
Standard Electric Works Co., Ltd
Max. & Min. function. Over & under range indication. 4-digit LCD with bar graph. Frequency weighting characteristic for 2 times per second. AC signal output. Low battery indication.
