Interconnects
Links between systems, networks,nodes, equipment, devices, components and circuits.
See Also: Mass Interconnect, Connectors, Cable Assemblies, Interfaces
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Product
Bulk Wire and Cable
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Teledyne Marine Cable Solutions
With 50 years of dedicated experience in providing cable and interconnect solutions, Teledyne Cable Solutions meets challenges for application-specific, multi-core cables for harsh environments and complex ruggedized cable assemblies and harnesses.
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Product
Software
Hole Shot
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The modern world is changing faster than ever before and most companies and governments are migrating away from older Windows based networking technologies to web-based networks that are endlessly interconnected making information easier to share and easier to access from any device at any time. Mustang adopted web-based technology in 2016 when it embarked on a new project to advance dynamometer technology and simplify its offerings. Mustang’s goal was to increase commonality and provide customers with a more powerful and easier to manage controls package. Mustang already offered a full menu of testing capabilities, so we turned our attention to increasing access and decreasing clutter. By adopting web-based systems, Mustang can better service thousands of customers world-wide from one location and keep all of our customers on the most up to date system available. All enhancements can be pushed to all of our customers at the same time making sure all installations are up to date. Our latest controls package, Hole Shot™ Software is designed to keep our customers constantly ahead of the curve and ensure that their valuable data is secure and backed up to a secured cloud database.
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Product
Off-Line Base Test Platforms
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To configure your Base Test Platform, the following parts can be added to the 6TL-19 bare half-rack:– Test Rack Manager, to control the test station.– Power Distribution Unit.– Uninterruptible Power Supply– Industrial PC or NI PXI to control the platform– 19’’ Monitor and keyboard with trackball– VPC Mass Interconnect Receiver (6 or 12 slots)– YAV Modules– Accessories: Beacon, Air inlet Pneumatic kit…– Any 19’ Instrument
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Product
Open Flanges Test Rig
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Flexible cell dimensions: cells of Ø 8 to Ø 80 mm (or square till 70x70 mm) can be successively installed Quick start of experiment: less than 20 minutes to remount a new cell with different dimension, thanks to the simple design without sealing Other SOFC components: the open flanges test rig is also useful for conductivity measurements (electrolyte, electrode material, interconnect etc.) and sealing tests End of broken cells and secure testing: the cell is squeezed by a soft alumina felt that prevents any damages, the excess fuel burns continuously in the alumina felt at the cell edges
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Product
Time Domain Reflectometer / TDR
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For testing cables and interconnects, we offer the ideal tool: A time domain reflectometer (TDR). Time domain reflectometry/transmission can be used to test network return loss (S11), propagation loss (S21), and crosstalk.Moreover, it can provide the impedance profile of an electrical channel. MultiLane supplies semi-automated solutions for the testing of direct-attach cables and TIAs.
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Product
USB
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The introduction of USB 3.2 and USB4 along with the Type-C connector ushers in a new era of unprecedented performance for consumer electronics that can now utilize this universal interface for power, data and display. Positioned as the primary high-performance interconnect for the next decade, developers are ramping up their USB3.2 / USB4 expertise. From engineering validation to compliance test, trust the experts at Teledyne LeCroy to help ensure product compatibility for next generation USB systems.
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Product
Micro Power 90 Series Modules
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VPC offers a wide array of modules with a variety of connection options that are configurable for virtually any interconnect requirement.
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Product
Linear Testfixture Testfixture for Mass Interconnect Cassette Interface Cassette and VPC ITA Frame Not Included, UUT 306 x 248 mm
MG-02-01 VPC G12
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FEATURES• Linear click system with ball bearings, using gas springs• 10 mm ESD-proof top cover with aluminium reinforcement bars• Steel base cabinet with detachable aluminium back and bottom panels• Detachable interchangeable case system with an 8 mm spring loaded probe protection cover• Base cabinet fitted with a telescopic guide rail and catchTECHNICAL SPECIFICATIONS• Max. number of probes (2000N) 1300 units• Max. PCB height: 60 mm• Linear travel: 12 mm• Max UUT: 306 x 248 mm (wxd)• Outer dimensions: 470 x 490 x 100 x 170 mm (wxdxh1xh2)• Designed for Mass interconnect changeable cassette• Up to a maximum of 8 interface blocks of 160 or 170 signals• All interface blocks can be customized
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Product
Network Delay Emulator
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BGP Network Delay Emulator. The Border Gateway Protocol or BGP is at the core of the modern Internet. Large corporate and government enterprise networks are increasing their use of BGP to interconnect different administrative and country specific regions
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Product
Connectivity & Products
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Enabling better, safer products and services in a more interconnected world.
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Product
Rectangular Connectors
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Smiths Interconnect offer a broad range of modular and rectangular connectors. Our modular solutions allow the user to customize, configure and combine signal, Power, Filter High Speed Data (coax, twinax, triax, quadrax, fiber optic) contacts into a single connector.
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Product
Interfacing Components
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Spring contacts and lands for PCB interconnection and a wide range of data, power and battery charging applications including: charging batteries in portable instruments power and data transfer pins in a docking station integral compliant contacts, such as for an antenna contact in a mobile phone board to board spring contacts for use in computerised gaming systems and telecommunications units
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Product
6-Port PCI Express
PEX 8624
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The ExpressLane™ PEX 8624 device offers 24 PCI Express Gen 2 (5.0 GT/s) lanes, capable of configuring up to 6 flexible ports. The switch conforms to the PCI Express Base Specification, rev 2.0. The 24-lane switch enables users to add scalable, high bandwidth, non-blocking interconnection to a wide variety of applications including workstations, communications, storage, and embedded systems as well as intelligent I/O modules and add-in cards.
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Product
12-Port PCI Express
PEX 8649
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The ExpressLane™ PEX 8649 device offers 48 PCI Express Gen 2 (5.0 GT/s) lanes, capable of configuring up to 12 flexible ports. The switch conforms to the PCI Express Base Specification, rev 2.0. The 48-lane switch enables users to add scalable, high bandwidth, non-blocking interconnection to a wide variety of applications including servers, communications, storage, blade servers, and embedded systems.
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Product
4-Port PCI Express
PEX 8616
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The ExpressLane™ PEX 8616 device offers 16 PCI Express Gen 2 (5.0 GT/s) lanes, capable of configuring up to 4 flexible ports. The switch conforms to the PCI Express Base Specification, rev 2.0. The 16-lane switch enables users to add scalable, high bandwidth, non-blocking interconnection to a wide variety of applications including workstations, communications, storage, and embedded systems as well as intelligent I/O modules and add-in cards.
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Product
Induced Signals Test
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The test relates to interfering signals that may be generated by interconnected equipment. Induced signal testing is used to determine if equipment will withstand various signals, such as might be introduced by failures in other equipment to which the test unit is connected.
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Product
Interconnect Test Leads
142-1
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This 64 inch pair of test leads connects with many different testing accessories and probes. Especially those found in typical test lead kits and assortments. The ends terminate in universal size 4mm banana plugs.
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Product
High-Density Matrix Switch Card
1260-43
Matrix Switch Module
The Astronics 1260-43 is a high-density matrix switch card. Each module consists of three 8x24 single-wire matrices, which are interconnected via a 10-lane, single-wire bus. On-board configuration relays allow software control of the matrix configuration.
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Product
Molded Interconnect Subtrate
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A substrate interposes between an IC chip and a motherboard to enable the IC chip to communicate with the motherboard effectively. Typically, the IC chip is attached onto the substrate and assembled into an IC package before connecting to the motherboard. It is an essential part of the IC package and is responsible for a successful packaging process. Also, it plays an important role in making the IC chip to become a real product and a real solution for end customers. In the past years, semiconductor technologies were highly driven by PC applications which follow Moore’s law in technology migration. In recent years, the emergence of mobile applications increasingly, become the main driver in the semiconductor industry. These mobile applications requires a new kind of substrate that have ability for making IC packages with smaller form factor, thin profile, better thermal, mechanical and electrical performance.
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Product
64x64 Matrix
TS202A
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Universal Switching Corporation
Designed from scratch to improve on the legacy Precision Filters Model 4164, the TS202A uses the absolute latest in component technology. Many engineers still use manual patch cords & patch panels to interconnect sensors, recorders, scopes and other instrumentation in test & evaluation labs.
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Product
Solar Array Simulator
Simulator
Among other things, solar array simulators are required for testing satellite power supplies. An SAS (Solar Array Simulator), consisting of an interconnection of several Solar Array Simulator modules, maps the solar panels and displays the individual strings connected in parallel. Optionally, the individual SAS modules are monitored by a Second Level Protection, so that the test object is not damaged in case of errors with the voltage sources. Additional circuitry is implemented via project-specific test modules. The signal path to the DUT can be separated, e.g. for dynamic current measurements.The Keysight Solar Array Simulators used were specially developed for satellite applications and cover the significantly higher requirements regarding the control speed of MPP tracking compared to terrestrial applications.
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Product
3U OpenVPX IP Router with 10GbE and 40GbE
ComEth4582a
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The 4582a implements a new generation of multi-layer Ethernet matrices for high speed embedded interconnect applications requiring low-power 10GbE and 40GbE connectivity. Designed in alignment with the SOSA™ standard.
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Product
Durable, Ultra Small & Flexible Test Assembly
StormFlex® 034
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Storm Flex® line of flexible cables, the 034 diameter cable offers the same superior mechanical benefits in a new miniature size.Its ruggedness and durability combined with its ultra-small size, very low weight, and extreme flexibility make Storm Flex® 034 cable assemblies the perfect fit for applications such as:- Test & Measurement ~ where flexibility and robustness minimize mating errors.- Systems ~ with complex installation or deployment that can compromise mechanical & RF stability.- Gimbal ~ with requirements for cables operating to 50 GHz.- Digital Test ~ needing minimized stress at the connector to connector interface.- High Density ~ utilizing multi-cable interconnects with centerline spacing as low as 0.07 inches.Storm Flex® 034 cable is also recommended as a semi-rigid replacement in applications where a sem-rigid cable is impractical to deploy and routing may result in assembly breakage or electrical failure.
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Product
Robust Modular Rectangular Connectors
B Series
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Smiths Interconnect addresses the industry’s need for reliable, low cost interconnections with the rectangular modular connectors B Series. B Series incorporates the highly reliability Hypertac® hyperboloid contact which provides optimum performance in harsh conditions such as extreme mechanical shock and high mating cycles.
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Product
Programmable Step Attenuator, DC to 4 GHz, 0 to 11 dB, 1 dB steps
8494G
Attenuator
The Keysight 8494G dc to 4 GHz programmable step attenuator offers exceptional repeatability and reliability. Attenuation is provided in 1 dB steps from 0 to 11 dB. Precision gold-plated leaf springs ensure long-life (over 5 million cycles) and very high attenuator repeatability (typically 0.01 dB). To improve measurement accuracy, NIST traceable data (SWR and attenuation) is available as Option UK6. A maximum switching time of 20 ms (including contact settling) speeds automatic testing. Custom step attenuator/switch combinations are possible. The Keysight 11716A/B/C interconnect kits provide quick connection of Keysight 8494/5/6/7 1 dB and 10 dB step attenuators in series for greater dynamic range with 1 dB steps.
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Product
Digital IO
PA64IX
Digital I/O
The PA64IX represents a new level of performance and capabilities for PXI-based digital instrumentation. Each card can function as a stand-alone digital subsystem or if required, multiple cards can be interconnected, supporting up to 1024 bi-directional pins (16 boards). The PA64IX also supports dee pattern memory by offering 32 M of on-board vector memory with static per pin direction control and with test rates up to 33 MHz.
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Product
Mini Modular, High Density Connector System
H Series
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The modular design of the Smiths Interconnect H Series allow custom configurations from standard off-the-shelf components without the cost and lead-time of custom tooling. The H Series offer a variety of designs to meet specific customer needs for extreme high density signal, power, and coaxial interconnect solutions.
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Product
8-Port PCI Express
PEX 8732
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The ExpressLane™ PEX 8732 is a 32-lane, 8-port, PCIe Gen 3 switch device developed on 40nm technology. PEX 8732 offers Multi-Host PCI Express switching capability that enables users to connect multiple hosts to their respective endpoints via scalable, high-bandwidth, non-blocking interconnection to a wide variety of applications including servers, storage, communications, and graphics platforms. The PEX 8732 is well suited for fan-out, aggregation, and peer-to-peer traffic patterns.
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Product
Signal 90 Series Modules
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Use VPC's high density signal modules for seamless integration with COTS products. VPC signal modules fit all standard VPC Interconnect Solutions and allow for consolidation of multiple instrument connections within the space of a single or double receiver interface position.
