Interconnects
Links between systems, networks,nodes, equipment, devices, components and circuits.
See Also: Mass Interconnect, Connectors, Cable Assemblies, Interfaces
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RF COMPONENTS
If space is an issue and you are looking for high quality RF Components, ETL's wide range is designed and manufactured at the ETL factory. Covering DC to 40GHz, these are at the heart of many of our 19" Rack Systems.A key feature of many of ETL components is the ability to pass or block a 10 MHz signal or DC voltage through the products, which can be used to power interconnecting components or pass a stable frequency reference to a LNB or BUC within the system.
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PC104 Switches
Curtiss-Wright Defense Solutions
Our PC104 switches provide systems integrators with a fast and powerful way to interconnect chassis, cards, and CPUs through switched Fast and Gigabit Ethernet links. These PC/104 Ethernet switches, optimized for size, weight, and power (SWaP)-sensitive embedded military and civilian computer network systems applications, enable reliable local area network (LAN) switching in extended operating temperature ranges and extreme shock/vibration environments.
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SMP Connectors
Pasternack SMP connector (sub-miniature push-on connectors) category contains mostly RoHS and REACH compliant product varieties. The SMP connector category includes dozens of configurations including coaxial sub-miniature push-on connectors, PCB mounted, non-sealed and hermetically sealed terminals and shrouds. Our subminiature push-on SMP connectors are built to precise microwave and RF industry specifications and are part of over 40,000 in-stock RF products. Connectors in SMP series from Pasternack are manufactured in male or female gender with a 50 Ohm impedance. Pasternack's SMP subminiature connector are available in straight or right angle versions as well as bulkhead or mount-less options. These connector designs include solder or solder/solder attachment methods. Pasternack’s SMP connectors are miniaturized push-on interconnects commonly used in high density, blind-mate systems that can operate up to 40 GHz. Standard sub-miniature push on connector items are offered in a high frequency 40 GHz version as well as a low frequency 8 GHz version and are also available in smooth bore, limited detent and full detent styles. As with the other over 40,000 RF, microwave and millimeter wave products from Pasternack, this SMP connector series is in-stock. Not just in stock, these subminiature push on connectors will also ship the same day as they are purchased.
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High Volume Semiconductor Substrate Interconnect Tester
GATS-2100
Pre-align *load *CCD camera alignment *electrical test * unload * sort of pass, opens, shorts, and alignment errors.The GATS-2100 concurrent approach provides unmatched volume capability... 2.5 seconds per device. As with all Nidec-Read Test systems, the GATS-2100 offers you the most test technologies for your requirements
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Wafer Bonding Systems
ith over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions. Multiple bonding methods including anodic, thermo compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a unique modular bond chamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production.
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Modular Multilevel Converter (MMC) Test Bench
Research into innovative HVDC interconnections and FACTS applications requires a flexible hardware architecture that allows testing of new topologies and switch configurations.
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PXI 5A Fault Insertion Switch 5-Channel
40-196-101
The 40-196 is a 10 Channel 5A Fault Insertion Switch, primarily designed for the simulation of fault conditions in automotive & avionics applications involving the reliability testing of safety critical controllers. It is designed to be able to insert different fault conditions between the test fixture and the equipment under test: Open-Circuit, Short-Circuit between signal pairs, Short-Circuit between signal pairs and user applied fault conditions e.g. Power or GND. Shorting relays on each channel enable UUT signals to be subjected to external user applied fault conditions or to be shorted to the adjacent signal in the same channel. Relays in line with the signal allow open circuit conditions to be simulated on either side or both sides of a channel signal pair. The switching topology of the 40-196 allows channels to be interconnected so that complex fault insertion systems can be constructed.
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IBM PC-XT, Vectorbord Plugbord
4613
VECTOR Electronics and Technology, Inc.
62 contacts (31 each side) on 0.100" centers. 3-Hole Solder Pads for interconnecting multiple component leads.I/O mounting area for 37-pin D-sub and ribbon cable connectors. Mounting bracket and hardware kit included (P/N HD36B).
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Embedded Components
Teledyne Labtech prides itself in being at the forefront of RF/Microwave PCB development. Teledyne Labtech were also one of the first companies to successfully develop techniques for embedding SMD resistors and capacitors within multilayer structures and the embedding of connector pins in buried stripline circuits.The advantages of such a structures ensures a much higher density of interconnect. This then removes the need for via-hole connections to the board surface or the need to create access pockets to the inner layers. Consequently you finish with a board with that exhibits much lower RF/Microwave losses. This is particularly important when designing large RF feed networks or 16:1 power dividers.
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Contacts
VPC offers a wide array of contacts with a variety of connection options that are configurable for virtually any interconnect requirement.
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USB-8506 , LIN Interface Device
784664-01
1- or 2-Port, USB LIN Interface Device—The USB‑8506 is a Local Interconnect Network (LIN) interface for developing applications with the NI‑XNET driver. The USB‑8506 is powered over the USB bus and does not require external power. The USB‑8506 excels in applications requiring logging or manipulation of hundreds of LIN frames and signals, such as in-vehicle data logging, bus monitoring, automation control, and more. The NI‑XNET device-driven DMA engine enables the onboard processor to move LIN frames and signals between the interface and the user program without CPU interrupts, minimize message latency, and free host processor time. The USB‑8506 is available with a three‑pin COMBICON synchronization connector for triggering and synchronizing the internal hardware timebase with other devices.
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CompactPCI Boards
*CompactPCI (cPCI) boards are 3U or 6U boards connected via a passive PCI (Peripheral Component Interconnect). Up to 8 boards can be connected together in a segment. Segments can be connected through bridges. *They are grouped into four categories: CPU, Communication, Input/Output, PMC carrier.
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AGC Coaxial Connectors
Teledyne Marine AG Geophysical Products
Coaxial Inline and Bulkhead Cables and ConnectorsWaterproof electrical coaxial interconnect for high shock, extreme applications
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High-Density Matrix Switch Card
1260-43
The Astronics 1260-43 is a high-density matrix switch card. Each module consists of three 8x24 single-wire matrices, which are interconnected via a 10-lane, single-wire bus. On-board configuration relays allow software control of the matrix configuration.
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6TL29 Semi-Automated Test Platform
AQ377
- Compact, transportable and modular test platform.- Ready for ICT, FCT, Boundary Scan, HiPot, Vision or any combination of the previous technologies.- Mass interconnect 9025 Receiver from Virginia Panel.- 100% Compatibility with Inline Test Fixtures (P/N: AT799, AN133 and EB773).- Free available rack space: 47U height- Multi-stage pressure at 3 levels.- FastATE Technology & YAV Modules compatible.- Phi6 Dispatcher Interface.- CE Compliant.
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WAVEPULSER-40IX + WAVEPULSER-SI-STUDIO-NRZ + Adaptors and Calibration Kit
WAVEPULSER-40iX-BUNDLE
High-speed Interconnect Analyzer, 4-port, S-par @40 GHz, <1 mm Res., 4 phase matched cables, bundle.
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PWB Interconnect Stress Test
PWB Interconnect Solutions Inc.
Services to test the reliability of Printed Circuit Boards. PCBs).Coupon Inspection and Electrical Prescreen. Coupon Testing. Failure Location via I/R Photo Imagery. Failure Analysis.
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Products & Retail
As the global leader in testing, inspection and certification, it is our business to be at the forefront of the safe execution and delivery of products to their intended markets. Our capabilities in a variety of industries—electrical and electronic products, medical devices, IT and telecoms, toys and games, juvenile products, textiles and apparel, food and more—offer an interconnected knowledge base that brings solutions to everything from regulatory issues to supply chain challenges, and beyond. Intertek delivers the expertise you need to get your products safely, efficiently, and effectively to market anywhere in the world.
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VPC Receiver Frame
ABex REC21-84TE-EXT
Robust and flexible interconnect solution for test fixtures. Designed for the use with ABex PXIe Rack 18 it provides support to equip all 21 slots with VPC interconnect modules. In addition, it offers 6 more slots on the bottom, below the ABex rack to feed through signals from external measurement devices.The interface uses the well-known Virginia Panel connectors with more than 20.000 guaranteed mating cycles. To build DUT specific test fixture, we also provide the corresponding ITA mounting frame (ITA = Interchangable Test Adapter).
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ITA, S6, 6 Module, With Protective Cover
410122100
The S6 ITA Frame has a powder coated finish adding an extra layer protection against the elements. It is an integral part of this rugged Mass InterConnect system. The S6 ITA has module positions screened on top for ease of module placement. Protective Cover included.
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Switch Probes
A Switch Probe is a spring contact probe and receptacle combination that is normally open, and after a designated travel the switch probe closes. The most common use for switch probes is in the cable harness testing industry. The switch probe is used to verify the correct location of a terminal in a connector while checking the retention force as well. Switch probes also verify the presence of nonconductive components such as caps for connectors or devices on a circuit board. Smiths Interconnect offers three standard sizes of switch probes.
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Intermittent Fault Detection & Isolation System
IFDIS
The IFDIS™ uses patented Intermittent Fault Detector technology that simultaneously and continuously monitors every circuit path within a Unit Under Test (UUT) - such as a Line Replaceable Unit (LRU) chassis' interconnects - for intermittent continuity failures that occur for as short as 50 nanoseconds. This state of the art technology is combined with an environmental chamber and vibration table, which simulate the UUT’s operational environment and cause intermittent faults to manifest, creating a system that is unsurpassed in intermittent fault detection.
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Signal, Module, Receiver, QuadraPaddle, 480 Position, Fully Loaded With Twin Female Contacts And Round Posts (610138200 And 610138117)
510150135
QuadraPaddle modules are molded on .1” (2.54 mm) centers to meet the need for high-density I/O in a compact assembly. Allowing flexible configuration options with standard commercial connectors, QuadraPaddle modules are designed to fit any VPC pin and socket-based mass interconnect system. Available in 192 and 480 contact positions, QuadraPaddle modules accept standard .1” (2.54mm) pitch headers, breadboards, and connectors for direct PCB, ribbon cable, and other connections as well as discrete wiring.
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Media Gateway
A Media Gateway is a networking device that provides valuable and essential functions for organizations, service providers, and network operators. When interconnecting traditional time-division-multiplexed (TDM) telephony systems with modern voice-over-internet protocol (VoIP) systems, a VoIP media gateway works by providing protocol conversion (translation) and interoperability between the two network technologies. Also known as an IP media gateway or SIP media gateway, the device converts a traditional analog plain-old-telephone-system (POTS) voice signal or related digital telephony signals such as T1, DS3, STM1 or OC3 into packets for transmission over a data network such as the Internet, private IP Network or a corporate LAN. When the legacy system is based on digital integrated services digital network (ISDN) technology, the device may be called a digital VoIP gateway or ISDN media gateway. Some manufacturers combine gateway functionality with WAN-access (internet-access) capability into a single device or network appliance. Such a dual-purpose device may be known as an access media gateway.
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G2- 2 Module Solution
The G2 offers the reliability of VPC interconnect technology in a compact, high-density two-module package. While simultaneously engaging a wide range of interconnect options in multiple configurations, the G2 provides a rapid alternative to repeated connect and disconnect of individual leads and connectors in a rugged, reliable system.
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Tilera GX72 Processor, 72 Core, Mid-size, AMC
AMC741
The AMC741 is ideal for packet filtering, intelligent networking, multimedia, video transcoding, cloud and other applications. The device includes 72 identical processor cores (tiles) interconnected with Tilera’s iMesh™ on-chip network.
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Socket Accessories (Thru-Hole Options)
The male pin adapter consists of standard high temperature FR4 with pressed in terminal pins and threaded inserts for mounting the socket. The top side of adapter has gold plated pads to receive socket interconnect and the bottom side has 0.006″ to 0.018″ diameter pin tails. These pins can be soldered to the plated thru holes in the target board. Then socket can be mounted to the threaded insert.
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YAV Modules
All YAV modules from 6TL Engineering are matching the most widely used mass interconnect (MIC) systems from Virginia Panel Corporation. It is easy and fast mounting a standard VPC 90 series connector module.
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Optical Connectors
Radiall's full range of optical interconnect solutions includes standard interfaces, optical termini, optical connectors and custom optical assemblies and subsystems. Suitable for harsh environments and designed for demanding applications where reliability and high performance are required, our cost-effective optical connectors are adapted to the specific requirements for the telecom, industrial, aerospace and defense markets.
