Teledyne DALSA
DALSA Corporation is an international high performance semiconductor and electronics company that designs, develops, manufactures and markets digital imaging products and solutions, in addition to providing specialized wafer foundry services.
- 519 886 6000
- 519 886 8023
- sales.americas@dalsa.com
- 605 McMurray Road
Suite 142
Waterloo, Ontario N2V 2E9
Canada
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Product
Xcelera Frame Grabber
Xtium-CLHS PX4
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Building on the field proven capability of Teledyne DALSA’s Xcelera frame grabber series, the Xtium™-CLHS PX4 is based on AIA’s CameraLink HS standard and uses PCI Express™ Gen 2.0 expansion bus to deliver high speed image acquisition and image transfer to the host memory. Xtium-CLHS uses industry standard CX4 cable to delivery up to 2.1 GB/s of image acquisition over a single cable to go beyond 15m and host transfer speeds of up to 1.7GB/sec - all in a compact, half-length, single slot solution.
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Product
Smart Vision System
VICORE
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This versatile system offers excellent performance for inspection applications using traditional 2D imaging, thermal imaging, 3D imaging or a combination thereof. Its small, book style format consumes minimal cabinet space and provides convenient, front-accessible connections for cameras, I/O and system components. This includes a dedicated industrial Ethernet port that offers efficient communication with complementary factory devices using Ethernet/IP or Profinet.
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Product
CCD Foundry Services
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Teledyne DALSA Semiconductor’s 150mm CCD process offers surface or buried channel operation at up to 15V with two or three layers of polysilicon and one, two or three layers of metal. A modular processing approach allows our foundry customers to adjust process parameters to meet the most demanding requirements for CTE (>99.999%), charge storage capacity, and dark current (<1nA/cm2). The base process uses 1X projection lithography with 2.5µm design rules, allowing die sizes of up to 100mm X 100mm. Where required, tighter alignment tolerances and smaller feature sizes can be obtained by using 5X lithography, using a mix and match or all-stepper approach. The maximum die size attainable with the stepper is 22mm X 22mm, but larger sensors can be fabricated using stitching.
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Product
Long Wave Infrared Cameras
Calibir DXM640 Series
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The Calibir uncooled Long Wave Infrared camera platform offers outstanding shutterless imaging performance and is optimized for Size, Weight and Power (SWAP). The Calibir DXM640 series features both shutter and shutterless operation and rapid image output on power up while delivering uniform response over the entire operating temperature range, making it ideal for thermal imaging applications requiring uninterrupted image acquisition. ULIS’s gen2 sensor offers an improved NETD and the updated calibration include customized gain correction on a per lens basis to offer even better image performances and response uniformity.
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Product
Large-Area CMOS X-Ray Detector
Rad-icon
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Teledyne DALSA’s Rad-icon product family of large-area digital x-ray cameras offers users a high-speed, high-performance x-ray imaging detector with a fast, reliable PC interface (either GigE or CameraLink) for easy integration.
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Product
Industrial X-Ray
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Teledyne DALSA offers powerful, innovative CCD and CMOS X-Ray detectors combining industry-leading performance with cutting-edge features for industrial and scientific applications such as NDT (non destructive testing) in evaluation, troubleshooting, research, and quality control.
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Product
Complete Vision System
BOA2
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Introducing BOA2: a complete vision system in one smart camera. Featuring our highest smart camera resolution yet, BOA2 combines lighting, image capture, processing, and easy-to-use embedded vision software into a convenient single device with a variety of I/O and mounting options.
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Product
Mixed-Signal Design
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Teledyne DALSA’s mixed-signal group, formerly known as Axiom IC, delivers high-performance, high-quality data-converter designs and IP blocks for the industrial, professional, scientific, imaging and audio markets. Based in the Kennispark business and science park in Enschede, The Netherlands, the group works in close cooperation with the University of Twente and supports PhD students and trainees to stay involved in the newest CMOS design methodologies and technologies.
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Product
CL PX4 Dual Frame Grabber
Xcelera-CL PX4 Dual
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Building on the field proven technology and performance of Teledyne DALSA’s X64 frame grabbers the new Xcelera Series leverages the PCI Express (PCIe) platform to bring traditional image acquisition and processing technology to new levels of performance and flexibility. The PCIe host interface is a point to point host interface allowing simultaneous image acquisition and transfer without loading the system bus and involving little intervention from the host CPU. The X64 Xcelera-CL PX4 Dual is a highly versatile PCIe frame grabber capable of acquiring images from two independent Camera Link™ Base cameras and performing image transfers at rates up to 1024MB/s. Its low cost, combined with its ability to support multiple tap configurations from area and linescan monochrome/RGB cameras simultaneously; in addition to its onboard FPGA Bayer decoding and real-time shading correction makes the X64 Xcelera-CL PX4 Dual an ideal solution to a wide variety cost-sensitive applications.
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Product
Area Scan Camera
Genie Nano-CXP
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Introducing Genie Nano-CXP, a camera designed for full-throttle performance. Genie Nano-CXP builds on Nano's proven, industry leading reputation and leverages a CoaXPress 6Gbps interface to deliver the maximum throughput from leading edge high resolution CMOS image sensors.

































































