Teledyne DALSA
DALSA Corporation is an international high performance semiconductor and electronics company that designs, develops, manufactures and markets digital imaging products and solutions, in addition to providing specialized wafer foundry services.
- 519 886 6000
- 519 886 8023
- sales.americas@dalsa.com
- 605 McMurray Road
Suite 142
Waterloo, Ontario N2V 2E9
Canada
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Product
CoalXPress Frame Grabber
Xtium-CXP PX8
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The Xtium™-CXP is based on the industry standard PCI Express™ Gen 2.0 expansion bus to deliver high speed access to host memory. The Xtium series offers high performance frame grabbers for CameraLink, CameraLink HS and CoaXPress interface standards. The Xtium Series takes full advantage of PCIe Gen 2.0 platform to deliver bandwidth up to 3.4 GB/s using PCIe x8 slots. By enabling maximum sustained throughput and ready-to-use image data, the Xtium series minimizes CPU usage and improves processing times for the host applications. In addition, the Xtium series offers enhanced memory architecture to handle area and line scan, monochrome and color cameras. In addition, the Xtium-CXP series support image acquisition rate of up to 6.25 Gb/s from four input channels.
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Product
Line Scan Camera
Piranha4 Polarization
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The Piranha4 Polarization™ camera is a breakthrough in the machine vision industry. This high-speed polarization camera features three native polarization states plus an unfiltered channel.The Piranha4 polarization camera extends detection capability in machine vision and is ideal for detecting stresses, surface roughness, film thickness, alloy composition, and 3D profiles.
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Product
CCD Foundry Services
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Teledyne DALSA Semiconductor’s 150mm CCD process offers surface or buried channel operation at up to 15V with two or three layers of polysilicon and one, two or three layers of metal. A modular processing approach allows our foundry customers to adjust process parameters to meet the most demanding requirements for CTE (>99.999%), charge storage capacity, and dark current (<1nA/cm2). The base process uses 1X projection lithography with 2.5µm design rules, allowing die sizes of up to 100mm X 100mm. Where required, tighter alignment tolerances and smaller feature sizes can be obtained by using 5X lithography, using a mix and match or all-stepper approach. The maximum die size attainable with the stepper is 22mm X 22mm, but larger sensors can be fabricated using stitching.
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Product
Multi-Interface Frame Grabber
Xtium 2 CLHS PX8 LC
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The Xtium™ 2 CLHS PX8 features CameraLink HS standard on the PCI Express™ Gen 3.0 platform. This single cable, single slot solution supports up to 4-CLHS lanes, each operating at 10.3 Gbits/s, to acquire images at up to 5.0 GBytes/s and transfer them using PCIe x8 slots to the host memory. The Xtium2-CLHS supports Active Optical Cable (AOC) to extend the cable length beyond 100 meters. Built-in data-forwarding and multi-board sync capabilities deliver a platform for distributed processing for high-speed, computational intensive machine vision applications.
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Product
3D Sensors
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Teledyne DALSA offers powerful, innovative 3D sensors combining industry-leading performance with cutting-edge feature sets and value.
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Product
Compact Uncooled LWIR Cores
MicroCalibir
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The latest advances in the integration of our in-house 12 μm microbolometer pixel technology with a deep-ADC ROIC circuit have resulted in the development of the small and lightweight MicroCalibir™. This compact, low-power uncooled thermal camera platform features the smallest VGA IR core module on the market making it ideal for OEM drones, handhelds, helmet-mounted and vehicular integration products.
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Product
Line Scan Camera
Linea SWIR
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Teledyne DALSA’s short-wave infrared (SWIR) GigE line scan camera features a cutting-edge InGaAs sensor in a compact package for a wide variety of machine vision applications.This high speed, high resolution camera is the first product in DALSA’s SWIR family. Linea SWIR features a cutting-edge InGaAs sensor in a compact package that is suitable for a wide variety of applications. With exceptional responsivity and low noise, this camera allows customers to see their products like never before. Linea SWIR is available as a 1k resolution camera with highly responsive 12.5 µm pixels, or a 512 resolution camera with larger 25 µm pixels
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Product
CL+ PX8 Full Frame Grabber
Xcelera-CL+ PX8 Full
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The X64 Xcelera-CL+ PX8 Full has been built within Teledyne DALSA’s Trigger-to-Image Reliability technology framework. Trigger-to-Image Reliability leverages Teledyne DALSA’s hardware and software innovations to control, monitor and correct the image acquisition process from the time that an external trigger event occurs to the moment the data is sent to the host, providing traceability when errors do occur and permitting recovery from those errors.
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Product
Microbolometer Sensors
Calibir GX Family
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The Calibir GX camera family features our latest microbolometer sensor, designed, fabricated, and packaged in our own foundry. With great sensitivity in longwave infrared range (8-12 µm), it features both shutter and shutterless operation and rapid image output on power up while delivering uniform response over the entire operating temperature range, making it an ideal component for thermal imaging systems requiring uninterrupted image acquisition. The GX series also offers our own advanced 21-bit ADC design for unparalleled intra-scene dynamic range without the need for a gain reduction, allowing for the best possible NETD over a vast range of temperature (>600C).
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Product
Integrated Vision System
GEVA 312T
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The GEVA-312T is an integrated vision system complete with a 12” touch screen display, 1.6GHz dual core processor and two Gigabit Ethernet camera ports. The slim-line form factor maximizes control panel real estate for PLCs, motions controllers and non-vision related components. The GEVA-312T is a good choice for customers who are looking for a complete system that is low-cost, expandable and applicable for a wide range of vision applications.
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Product
CL LX1 Base Frame Grabber
Xcelera-CL LX1 Base
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Building on the field proven technology and performance of DALSA’s X64 frame grabbers, the X64 Xcelera™ Series leverages the PCI Express (PCIe) platform to bring traditional image acquisition and processing technology to new levels of performance and flexibility.The PCIe point-to-point host interface allows simultaneous image acquisition and transfer with little intervention from the host CPU.The X64 Xcelera -CL LX1 Base is a cost effective frame grabber based on the PCI Express x1 interface. Fully compliant with Camera Link (V. 1.20) specifications, the Xcelera-CL LX1 supports single Base cameras and can acquire images from a wide variety of multi-tap area and line scan, color and monochrome cameras.
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Product
Industrial X-Ray
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Teledyne DALSA offers powerful, innovative CCD and CMOS X-Ray detectors combining industry-leading performance with cutting-edge features for industrial and scientific applications such as NDT (non destructive testing) in evaluation, troubleshooting, research, and quality control.
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Product
Smart Vision System
VICORE
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This versatile system offers excellent performance for inspection applications using traditional 2D imaging, thermal imaging, 3D imaging or a combination thereof. Its small, book style format consumes minimal cabinet space and provides convenient, front-accessible connections for cameras, I/O and system components. This includes a dedicated industrial Ethernet port that offers efficient communication with complementary factory devices using Ethernet/IP or Profinet.
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Product
Cameras
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Teledyne DALSA offers powerful, innovative CCD and CMOS cameras combining industry-leading performance with cutting-edge feature sets and value
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Product
Xineos Large Area Detectors
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As a leader in CMOS innovation, Teledyne DALSA developed the Xineos to deliver three times more sensitivity and five times more signal-to-noise performance than other standard technologies at equal X-ray dose conditions. CMOS image detectors offer numerous advantages including the ability to record smaller image details with higher resolutions – allowing for the diagnostics of medical anomalies at earlier stages, and significantly increasing the probability of early intervention, patient recovery, and reduced treatment costs.





































































