Showing results: 181 - 195 of 434 items found.
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Creative Design Engineering, Inc.
*Type: Table Top*Wafer load: open cassette*Wafer size: 4" to 8"*Mini Environment: N/A *Probe Changer: N/A *Aligner: N/A*Size: 12" x 28" x 10"*Range: 1m/ to 10M/*Accuracy: 0.5%*Repeatability: 0.02% *Static Repeatability: 0.1% dynamic
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S-1160 -
Signatone Corp.
S-1160 Probe Station 100mm, 150mm and 200mm wafer stage's completely manual and user friendly.
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MTI Instruments
Multi-channel thickness, TTV and bow measurement module for in-process monitoring of solar/photovoltaic wafers and other materials.
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Model 656 -
OAI
OAI Model 656 Meter is designed for use with all mask aligners and flood exposure systems. For over 45 years, OAI is a world leader in UV Light & Energy Measurement Instrumentation used for reliable accurate calibrated control of the photolithography processes in the Semiconductor, MEMS, Wafer Packaging and Wafer Bumping Industries.
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Direct Dock -
SV Probe, Inc.
Direct dock style wafer probing allows for a higher bandwidth, increased pin density and testing more devices in parallel. Direct dock probe cards also support the growing movement of traditional final test to wafer probe which allows for known good die (KGD) and reduced cost of ownership.
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FilmTek 2000 PAR -
Scientific Computing International
A low-cost solution for high-throughput, fully-automated mapping of patterned wafers for development and production environments. Utilizes patented parabolic mirror technology to measure wavelengths from DUV to NIR with a spot size as small as 13µm. Fully user-customizable wafer mapping capabilities rapidly generate 2D and 3D data maps of any measured parameter.
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T300 ButtonTile™ -
Celadon
The Celadon T300™ probe cards are designed for long-term, multi-site, high-density wafer level reliability or burn-in tests up to 400°C. In today’s economic environment, conventional reliability data is needed quickly while eliminating the cost, electrical stress, and delay of parts packaging while maintaining a wafer performance map.
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Creative Design Engineering, Inc.
*Type: Table Top*Wafer load: Manual *Wafer size: 2" to 8", 152mm x 152mm*Mini Environment: N/A*Probe Changer: N/A*Aligner: N/A*Size: 12" x 19" x 10"*Range: 1m/ to 10M/*Accuracy: 0.5%*Repeatability: 0.02% *Static Repeatability: 0.1% dynamic
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AX2600 And AX2700 -
MKS Instruments
The AX2600 and AX2700 Microwave Plasma Delivery Subsystems are complete and highly reliable solutions for the cost-effective generation and safe delivery of atomic species to the wafer. Available in 3 kW, these highly reliable, field-proven plasma delivery subsystems deliver highly concentrated atomic species. Suitable for multiple chemistries, the high speed and precision of this plasma system’s automatic tuning guarantees immediate ignition and fast transition from plasma conditions for high productivity. Robust closed-loop control ensures high accuracy, precision, and optimal repeatability of the process from wafer to wafer and system to system.
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WCT-120 -
Sinton Instruments
Best available lifetime measurement accuracy. Measure lifetime and surface recombination for a wafer of any quality or crystallinity.
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MTI Instruments
Full wafer surface scanning for thickness, thickness variation, bow, warp, sori, site and global flatness
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YieldStar -
ASML
Our YieldStar optical metrology solutions for the semiconductor industry can quickly and accurately measure the quality of patterns on a wafer.
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Integrated Metrology Family -
Nova Measuring Instruments Inc.
Nova is the market leader in the space of integrated metrology platforms with multiple generations of products. Our integrated metrology platforms enable advanced process control (APC) to monitor and control wafer to wafer variations of complex high-end CMP and Etch applications with high productivity and reliability required for the most advanced logic and memory technology nodes.
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CSE Co.,Ltd
* Resistor Calibration Substrate * Mili Ohm ~ Giga Ohm * Wafer type size 6, 8, 12 inch.
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Precision Micro Diamond Scriber MR200 -
Optik Elektronik Gerätetechnik GmbH
Precision micro diamond scriber MR 200 for exact manual scribing for defined cutting of structured silicon wafers.