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PLD/PED Components
Neocera offers a variety of components that can be fitted and combined into new or existing PLD and PED systems to provide improved functionality and enhanced capability. Components include:*Oxygen-compatible substrate heaters for epitaxial oxide film depositions..*Automated Target Carousels for preparing multilayer heterostructures.*Deposition chambers design specifically for PLD and PED systems.*Manual and automated laser window-change Accessories.*Pulsed Electron Deposition (PED) sources for laser transparent materials.*Ideal for retrofitting existing systems or construction of new systems.
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Ozone Gas Generators
SEMOZON® Ozone gas generators and subsystems are the industry standard for compact, high concentration, ultra-clean ozone gas generation. Applications include Atomic Layer Deposition (ALD), Atomic Layer Etch (ALE), Chemical Vapor Deposition (CVD) and Wet Cleaning.
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Dynamic Scale Deposition Loop System
Dynamic Scale Deposition Loop fully automated systems includes hardware and software to measure and evaluate the performance of scale inhibitors under high pressure and high temperature conditions.
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High Power Microwave Plasma Source
The High Power Microwave Plasma Source can be combined with a 6kW microwave generator for a high concentration of radicals providing a high productivity manufacturing solution. The High Power Microwave Plasma source is capable of igniting in multiple process gases, over a wide operating range with performance benefits in current and emerging applications such as, high throughput photoresist removal, advanced surface cleaning and conditioning, as well as, advanced deposition applications at the atomic level.
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Vaporizers
Vaporizers are the backbone of gas phase processes, serving as the catalyst for converting liquids into essential gases. This transformative process is indispensable in a myriad of applications, ranging from precision thin film deposition to critical procedures like metal etching and doped epitaxial growth.
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ICP Plasma System
The AXIC IsoLok® Inductively Coupled Plasma (ICP) Load-Locked Processing System from AXIC, Inc. defines a new concept in Deep Reactive Ion Etch (DRIE) and low temperature-low damage Plasma Enhanced Chemical Vapor Deposition (ICP-PECVD) plasma processing. The system is based on a modular design starting with a universal chamber and cabinet unit with ICP etch or deposition bottom electrodes available for easy installation into the chamber unit combined with a load-lock. We are confident you will find the ease of use, variety of plasma processes, serviceability and attractive pricing unsurpassed by any other plasma product in the market.
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Process Sense™ NDIR End Point Detector For Chamber Clean
The Process Sense endpoint sensor is a small, low-cost SiF4 sensor specifically designed for Remote Plasma Chamber Clean Endpoint detection for silicon-based CVD deposition chambers. Process Sense is based on infrared absorption, the only technique applicable to all plasma cleaning processes (in-situ and remote). It gets mounted onto a bypass on the rough line, ensuring no effect on deposition hardware. The signal level reported by the Process Sense, which is proportional to SiF4 concentration, can be used to determine the completion of the chamber clean process.
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Burnbox & Scrubber Systems
MODEL BBS-10-LM
Safe, low costing, and minimal maintenance exhaust gas abatement equipment designed for years of continuous operation. Systems designed to significantly diminish toxic, corrosive, flammable, and pyrophoric gas exhaust to safe levels. Ideal for treating the exhaust effluents from process systems such as a deposition and etch reactor. Burnboxes, scrubbers and combinations are available, tailored to suit your exact requirements.
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Ozone Generators & Systems
MKS offers a wide range of ozone generators and modular delivery systems which produce ultra-pure, reliable ozone gas. In the clean semiconductor environment, Ozone reacts with a wide range of precursor gases resulting in the creation of Al2O3, ZrO2, HfO2, and La2O3 metal oxides to enable thin film deposition processes like Atomic Layer Deposition (ALD) and Etch (ALE). MKS’ generator uses Grade 6 gas, enabling the creation of higher film density improving product yield. Photovoltaic and Display manufacturing leverage semiconductor best practices and utilize ozone to create enhanced thin film barriers, improving product performance and reliability.
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Metal-Organic Compound Chemical Vapor Deposition
Model MOCVD-500-A
For Experimental growth of quality epitaxial layers III-V, II-VI compounds. Multi-Layer structures. Directly heated silicon carbide coated, high purity graphite or PBN susceptor. Low mass thermocouple probe immersed into susceptor. Broad temperature and pressure application. Highest quality materials utilized throughout.
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Pulsed-DC Systems
Extend process innovation with Advanced Energy’s comprehensive pulsed-DC suite. Minimize arcing, enhance deposition rate, improve film flatness and packing density.
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Chemical Vaper Deposition R&D System
MODEL CVD-300-M
High Temperature, 1080 C (24" Hot Zone: 126 Cubic In.) High Purity Quartz Tube with Water Cooled End Caps. Broad Pressure Range of Atmosphere to 10-3 Torr. Upgradable to High Vacuum. Computer Interfaceable. Small Footprint (26" x 48"), Portable with caster mounts.
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Thin-film deposition
Plasma Source
SPECS Surface Nano Analysis GmbH
Thin-film deposition covers any technique for depositing material onto a bulk or thin film substrate. Elemental alloy or compound films are produced by non-reactive or reactive (co-)deposition. Often functionalization or tailoring of device interfaces by predeposition or deposition assisting surface treatment with atoms or ions is necessary.
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Plasma Emission Controller
RU-1000
The optical technology developed by HORIBA and the gas control technology offered by HORIBA STEC have been combined to make further advances in plasma control technology. The plasma emission controller RU-100 offers; faster deposition by controlling the transition region, optimized distribution in a large-area, high-capacity chamber, plasma stabilization in a long sputtering process (stable deposition), and mixture optimization of compounds for reactive sputtering.
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A Highly Versatile R&D Bell Jar Thin Film Coating System.
MODEL VES-3000
TEK-VAC's VES-3000 coater station model offers a modular concept for thin film deposition. Common PVD techniques which can be employed in this compact unit include thermal and electron beam evaporation. A 2KVA SCR controlled filament evaporation power supply is provided. Optional ion deposition and magnetron sputtering devices can be incorporated in the system.
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PLD Systems
Pulsed Laser Deposition
Is a versatile thin film deposition technique. A pulsed laser (~20 ns pulse width) rapidly evaporates a target material forming a thin film that retains target composition. This unique ability of stoichiometeric transfer of target composition into the film was realized first by the research team led by Dr. Venkatesan at Bell Communications Research, NJ, USA, nearly 30 years ago while depositing high temperature superconducting (YBa2Cu3O7) thin films. Since then, PLD has become the preferred depo...show more -
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2 MHz RF Plasma Generators
NOVA® Series
The NOVA ; RF Plasma Generators are ideally suited for Plasma Enhanced Chemical Vapor Deposition (PECVD), High Density Plasma CVD (HDPCVD), etching and other thin film applications during the manufacture of integrated circuits, flat panel displays, and data storage devices.
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Handheld Ultrafine Particle Size Distribution Measurement.
partector 2 Pro
Naneos Particle Solutions gmbh
The naneos partector 2 Pro version is a further development of the well-established Partector 2. The Pro version of the partector 2 can additionally switch through different deposition voltage levels and therefore scan an 8-channel size distribution of an aerosol of interest.
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High-grade type Gas Monitor for Chamber Cleaning End Point Monitoring
IR-400
The IR-400 offers real-time monitoring of the chamber cleaning end point during the deposition process. By optimizing the cleaning process, the IR-400 reduces cleaning time and gas usage. This reduction in cleaning gas usage leads to a reduction in chamber damage and increases the life times of all the systems components.
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Plasma CVD & Etching Systems
MODEL DRIE-1000
A High Quality Plasma Deposition & Etch System, Ideal for R&D and Small Scale Production. Modified designs with capabilities of 12" wafers. Substrate heating to 500 C. Top loading / Optional loadlock. Multifunctional plasma network. Diversified pumping configurations. Variable electrode spacing. Customized features and components for specific applications.
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Copper PCB
The Amitron process is capable of producing 20 plus ounces of finished copper and reliably spray coat a protective and consistent solder mask with imaged nomenclature. Amitron utilizes a unique process referred to as "Laminated Deposition". This combination of processes allows extreme copper thickness requirements to become very practical and cost effective. The process utilizes heavy base copper that when placed in our plating and etching systems will deliver consistent and reliable high power circuits.
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Parylene Deposition Equipment
SCS offers Parylene deposition systems that range from a portable laboratory unit to production models for high-volume manufacturing applications. SCS Parylene deposition systems are designed for accurate and repeatable operation, featuring closed-loop monomer pressure control, which ensures deposition of the polymer film at a precise rate. Whether researching new coating applications or developing structures out of Parylene in the laboratory, or coating components in a production environment, SCS leads the industry with its state-of-the-art Parylene deposition systems.
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Matrix Vapor Deposition System
iMLayer
The iMLayer matrix vapor deposition system is sample pretreatment (application of matrix) in order to perform MALDI-MS imaging using an analysis system such as the iMScope imaging mass microscope or the MALDI-7090. With the iMLayer, the deposition method has been adopted as a pretreatment method to achieve high spatial resolution. By using this method, fine matrix crystal can be produced. Also, thanks to automated control, the coating thickness is reproducibly controlled as users configure.
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Dimensional Metrology
Stand-Alone Metrology Family
Nova Measuring Instruments Inc.
Nova’s stand-alone metrology platforms are utilized to characterize critical dimensions such as width, shape and profile with high precision and accuracy and are used in multiple areas of the fab such as photolithography, etch, CMP and deposition in the most advanced technology nodes, across all semiconductor leading customers.
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High Temperature Absolute Pressure Transducers
Our high temperature Baratron® capacitance manometers are controlled to temperatures of 150°C or higher for use use in demanding semiconductor manufacturing vacuum processes such as metal etching and nitride film chemical vapor deposition (CVD).
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Vapor Concentration Monitor
IR-300 Series
Metal-Organic Chemical Vapor Deposition (MOCVD) is widely used in the manufacture of LEDs, optical devices and other components. Liquid and solid precursors are delivered to the reaction chamber by controlling the temperature, pressure and the carrier gas flow rate (bubbling method). Process results can be affected by changes especially in temperature and liquid level. The in-line IR-300 Series measures and reports the precursor concentration in real time.
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Metrology System
Aspect
Memory density increases with both layer-pair scaling and tier stacking for memory stacks well over 200 pairs. The Aspect metrology system was designed with these future architectures and scaling strategies in mind. Aspect metrology is demonstrating performance superior to X-ray systems across multiple customer devices through a revolutionary infrared optical system providing full profiling capability to enable critical etch and deposition control, with the speed and process coverage that customers require.
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Grid Electrode
Grid electrode is produced by the deposition of the platinum, gold or carbon onto the quartz glass. The dimension of the glass is 8 x 27 mm, with a 1 mm of the thickness, and the grid line is 100 m width with a distance of the 150 m between lines.
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kSA RateRat Pro
kSA RateRat Pro is a compact, convenient and easy-to-use optical metrology tool for thin-film characterization. Its unique capability is to measure, in situ and in real-time, optical constants (n and k), deposition rate and film thickness.
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Excitation Sources
SPECS Surface Nano Analysis GmbH
o our customers in research and industry we offer a variety of sources for deposition, excitation and charge neutralization as well as analyzers and monochromators. Most of our sources originate from product lines which we have taken over from Leybold AG, Cologne, and from VSI GmbH. The X-ray monochromator Focus 500 and the UV monochromator TMM 302 are original developments by SPECS.
