Showing results: 1 - 15 of 56 items found.
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Plasma Source -
SPECS Surface Nano Analysis GmbH
Thin-film deposition covers any technique for depositing material onto a bulk or thin film substrate. Elemental alloy or compound films are produced by non-reactive or reactive (co-)deposition. Often functionalization or tailoring of device interfaces by predeposition or deposition assisting surface treatment with atoms or ions is necessary.
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Specialty Coating Systems
SCS offers Parylene deposition systems that range from a portable laboratory unit to production models for high-volume manufacturing applications. SCS Parylene deposition systems are designed for accurate and repeatable operation, featuring closed-loop monomer pressure control, which ensures deposition of the polymer film at a precise rate. Whether researching new coating applications or developing structures out of Parylene in the laboratory, or coating components in a production environment, SCS leads the industry with its state-of-the-art Parylene deposition systems.
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Veeco Instruments Inc
Create ultra-precise, high-purity, thin film layer devices with maximum uniformity and repeatability with Ion Beam Deposition (IBD) Systems.
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Veeco Instruments Inc
Physical Vapor Deposition Systems offer maximum flexibility for a wide range of thin film deposition applications with advanced process capabilities, unsurpassed uniformity and multiple deposition modes.
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iMLayer -
Shimadzu Corp.
The iMLayer matrix vapor deposition system is sample pretreatment (application of matrix) in order to perform MALDI-MS imaging using an analysis system such as the iMScope imaging mass microscope or the MALDI-7090. With the iMLayer, the deposition method has been adopted as a pretreatment method to achieve high spatial resolution. By using this method, fine matrix crystal can be produced. Also, thanks to automated control, the coating thickness is reproducibly controlled as users configure.
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Chandler Engineering
Dynamic Scale Deposition Loop fully automated systems includes hardware and software to measure and evaluate the performance of scale inhibitors under high pressure and high temperature conditions.
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Model MOCVD-500-A -
TEK-VAC INDUSTRIES Inc.
For Experimental growth of quality epitaxial layers III-V, II-VI compounds. Multi-Layer structures. Directly heated silicon carbide coated, high purity graphite or PBN susceptor. Low mass thermocouple probe immersed into susceptor. Broad temperature and pressure application. Highest quality materials utilized throughout.
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MODEL CVD-300-M -
TEK-VAC INDUSTRIES Inc.
High Temperature, 1080 C (24" Hot Zone: 126 Cubic In.) High Purity Quartz Tube with Water Cooled End Caps. Broad Pressure Range of Atmosphere to 10-3 Torr. Upgradable to High Vacuum. Computer Interfaceable. Small Footprint (26" x 48"), Portable with caster mounts.
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Pulsed Laser Deposition -
Neocera, Inc.
Is a versatile thin film deposition technique. A pulsed laser (~20 ns pulse width) rapidly evaporates a target material forming a thin film that retains target composition. This unique ability of stoichiometeric transfer of target composition into the film was realized first by the research team led by Dr. Venkatesan at Bell Communications Research, NJ, USA, nearly 30 years ago while depositing high temperature superconducting (YBa2Cu3O7) thin films. Since then, PLD has become the preferred deposition technique where ever thin films of complex material compositions are considered. Another unique feature of PLD is its ability for rapid prototyping of materials. The energy source (pulsed laser) being outside the deposition chamber, facilitates a large dynamic range of operating pressures (10-10 Torr to 500 Torr) during material synthesis. By controlling the deposition pressure and substrate temperature and using relatively small target sizes, a variety of atomically controlled nano-structures and interfaces can be prepared with unique functionalities.
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MSP Corporation
Vaporizers are used in gas phase processes to transition a liquid into a gas for thin film deposition or other processes that require a vapor (metal etch, doped epitaxial growth, etc). Vaporizers are widely used in:*CVD (Chemical Vapor Deposition)*PECVD (Plasma-Enhanced Chemical Vapor Deposition)*MOCVD (Metal-Organic Chemical Vapor Deposition)*ALD (Atomic Layer Deposition)
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MKS Instruments
SEMOZONĀ® Ozone gas generators and subsystems are the industry standard for compact, high concentration, ultra-clean ozone gas generation. Applications include Atomic Layer Deposition (ALD), Atomic Layer Etch (ALE), Chemical Vapor Deposition (CVD) and Wet Cleaning.
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Neocera, Inc.
Neocera offers a variety of components that can be fitted and combined into new or existing PLD and PED systems to provide improved functionality and enhanced capability. Components include:*Oxygen-compatible substrate heaters for epitaxial oxide film depositions..*Automated Target Carousels for preparing multilayer heterostructures.*Deposition chambers design specifically for PLD and PED systems.*Manual and automated laser window-change Accessories.*Pulsed Electron Deposition (PED) sources for laser transparent materials.*Ideal for retrofitting existing systems or construction of new systems.
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MODEL VES-3000 -
TEK-VAC INDUSTRIES Inc.
TEK-VAC's VES-3000 coater station model offers a modular concept for thin film deposition. Common PVD techniques which can be employed in this compact unit include thermal and electron beam evaporation. A 2KVA SCR controlled filament evaporation power supply is provided. Optional ion deposition and magnetron sputtering devices can be incorporated in the system.
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k-Space Associates, Inc.
The kSA BandiT is a non-contact, non-invasive, real-time, absolute wafer and thin-film temperature monitor used during thin-film deposition and thermal processing.
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RU-1000 -
HORIBA, Ltd.
The optical technology developed by HORIBA and the gas control technology offered by HORIBA STEC have been combined to make further advances in plasma control technology. The plasma emission controller RU-100 offers; faster deposition by controlling the transition region, optimized distribution in a large-area, high-capacity chamber, plasma stabilization in a long sputtering process (stable deposition), and mixture optimization of compounds for reactive sputtering.