- Virginia Panel Corporation
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Tool, Inspection Depth Gauge, Micro Coax, ITA
910121180
Tool, Inspection Depth Gauge, Micro Coax, ITA.
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AOI & SPI, Test Systems
SigmaX SPI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The SigmaXs inspection technology is unaffected by varying materials, surface conditions, or colors. The system profiles the board to generate accurate 3D shapes far superior to other brands and technologies.
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Soldering Inspection Video Microscope
MS-1000
The MS-1000 is a highly portable microscope for exclusive use with BGA, CSP, and QFP. It is highly efficient in inspecting portions which cannot be inspected by the X-ray inspection method.Specifically, it is efficient for inspecting the following conditions: fillets of soldered balls, melted condition of soldered parts, cracks, defective soldering, etc.
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Solid Measuring Viewer
SMV system is designed to perform automatic final inspecting system. SMV integrates professional vision and optics technology. Besides, reliable mechanical system reduces the maintenance time. It is especially suitable for the demand for high quality and low cost inspection. Unique inspection techniques adapt to all 3D measuring. It can detect laser Via, dimple, bump, copper plating thickness, line, SMT, BGA, etc. SMV provides 3D image and 3D measuring result. SMV adopts programmable LED lighting to obtain the best image.
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2D/3D AOI Series
MV-6e
- Exclusive10MP/18MPCameraTechnology- Precision Telecentric Compound Lens Design- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Extremely Simple Programming and Operation- Integrated INTELLI-SCAN® Laser Inspection System- 3D Co-Planarity Inspection of Gull-Wing Leads, BGA and CSP - - -- Devices- Enhanced 3D Solder Paste Height Measurement Capability- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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For Real-Time X-ray Inspection Systems
Image Processors
A number of image processing software packages are available. Features include frame averaging, measurement, text, label, marking, 3-D rendering, video recording and image storage. Additionally, BGA analysis and void measurement software can be added as well as other options. See our image processors for x-ray inspection machines below.
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Circuit Card Assembly
Teledyne Advanced Electronic Solutions assembles and tests a variety of complex circuit card assemblies (CCAs) using leading edge, advanced technology assembly automation. We specialize in low-volume, high-mix assembly of highly complex CCAs.- RF, analog, high-speed and digital circuits on rigid-flex and Cu core substrates- Typical lot sizes from 3 to 300 pieces- 4 high speed, flexible SMT lines- Production processes for components from 0201 chips to large grid-array components and connectors- 1...show more -
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Digital In-Circuit tester
MTS180/300
Analog in-circuit inspection and function inspection are realized on this inspection equipment. IC pin float function is standard equipment. The MTS180 is a press type jig, and the MTS300 is a vacuum type jig. In the board mounting process at the production site, electrical inspection is performed on the mounted board after component mounting, and non-defective or defective products are automatically judged. The main inspection contents are short / open inspection, analog inspection of resistors, capacitors, coils, diodes, etc., lead floating voltage measurement of QFP and BGA, Digital IC inspection, frequency measurement.
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X-ray Inspection System
NEO-690Z / NEO-890Z
Off-line Microfocus X-ray Inspection System equipped with PONY ORIGINAL Direct Conversion X-ray Camera; SID-A50. Suitable for inspection of BGA, CSP, and LGA on PCB.
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AOI & SPI Test Systems
Xceed AOI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The Xceed enables true 3D measurement and provides the most accurate and repeatable inspection results with the minimum false calls. It’s designed with Advanced Signal Processing which gives results in noise-less, clear, and accurate 3D images.
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Making Invisible Visible
Quadra 3
Quadra™ 3 is your partner for high quality X-ray inspection for production line quality control. Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking and counterfeit device screening. High quality, high magnification inspection for product applications.
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Optical BGA Inspection
Imaging hidden solder joints of BGA, IBGA, FlipChip, CSP, CGA and SMD components
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BGA Sockets
Our BGA socket platform takes advantage of the H-Pin®, a high-performance stamped spring probe pin, to provide a pure vertical contact system that meets all BGA design challenges at an enabling cost.
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BGA Rework Station
PDR IR-D3 Discovery
The system is tool free, gas free, instantly/precisely controllable, clean, modular, upgradeable and produces 100% yield BGA rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs, QFNs, Flipchips and is ready for 0201 and lead-free applications.
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Dimensional Inspection (3D Inspection)
The 3D measurement data from our scanners and PCMMs offers a comprehensive definition of a physical object that is used for measurement, inspection, comparison and reporting. When a part is defined by millions of points, you can see subtle deviations, slight variations and fine details, which gives you the confidence that a part (or mold) meets your specifications. To deliver the best of both worlds, we combine 3D scanning with our contact, touch-probe measurement tools to deliver precise dimensions on geometric shapes.
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Inspection Cameras
The inspection camera opens a new view into the insides of machines and systems; whether an endoscope, thermal imaging camera or infrared thermometer - an inspection camera is the ideal instrument for monitoring and maintenance.Due to the flexible control of the endoscope or the visual display of potential damage areas in machines or systems, weaknesses and points of failure can be detected and therefore be prevented. The inspection camera make this possible without the need for complex disassem...show more -
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IPC Inspection
Customers of MASER Engineering that are designing electronic products and thereby using bare and assembled Printed Circuit Boards (PCB's) are interested in the manufacturing quality of the PCB and assembling quality of the PCBA.
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Optical Inspection
Typically, in a standard PCB manufacturing facility, there will be a department where people perform inspection of PCBs through a manual processes, such as visual inspection with magnifiers, microscopes, etc...
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Inspection System
X-eye 7000B
Appropriate for the inspection of medium•large size components and detection of surface structure and defects (inside voids and cracks etc).Due to high-energy, high-power Micro-focus X-ray Open Tube, maintenance cost's significantly reduced and long-term use possible with only replacing consumables.Customization is available with selecting main parts by customers depends on their needs for size and material.
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BGA Sockets
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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Video Inspection
MacroZoom
Our MacroZoom Video Inspection packages are useful is countless industries. MacroZoom solves the problems that customers have with traditional microscopes, by offering an unlimited working distance, as well as field of view, and hugely generous 1-80x magnification range.
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Digital Inspection
The DI-1000 and DI-1000L-PRO inspect fiber optic connector endfaces, providing clear sharp digital images on your Windows® PC. The DI-1000 and DI-1000L-PRO use LIGHTEL's Series 2 Tips and come with a soft case designed to fit easily into a standard laptop case.
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Drone Inspection Software
Qii.AI
Qii.AI automates the detection and analysis of defects. It is the only enterprise AI platform that combines drone inspection software with an AI labeling tool, AI-assisted computer vision, and machine learning.
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PV Wafer Inspection
In the production of wafers, process parameters directly affect the wafer quality. For optimal use of wafers it is necessary to sort them into appropriate quality classes. This way, further processes can be adjusted according to the characteristics of the wafers.
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BGA Socket And BGA Adapter Systems
Mill-Max's BGA Socket/Adapter Systems are used for both socketing BGA devices and interconnecting circuit boards. Systems are available to fit 1mm, .050" and .8mm grid footprints.
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DDR4 BGA Interposers, DDR4 DRAM X16 Packages
N2115A
The N2115A DDR4 BGA Interposers are soldered in between the DRAM and PC board or DIMM raw card where the DRAM would normally be soldered. They are designed with the PCB or DIMM foot print on the bottom side and the DRAM footprint on the top side. The signals from the memory controller chip and DRAM are then passed directly to the top side of the BGA probe adapter where they can be accessed with the oscilloscope probes.
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X-Ray Inspection System
TruView™ Fusion
The quality of your products is paramount to the success of your business. The TruView™ Fusion X-ray Inspection System allows you to "see inside" your products without destroying them, enabling unprecedented understanding of your manufacturing process. The TruView™ Fusion X-ray is the right solution if you are looking for a radiography system to inspect medical devices, printed circuit boards, electronic components, and mechanical parts.
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Defect Inspection
With over 20 years of experience in defect inspection, microelectronics manufacturers around the world partner with us to improve yield by performing high-speed, automated inspection and then transforming the defect data into actionable process control with powerful analytical software.
