- Virginia Panel Corporation
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Tool, Inspection Depth Gauge, Micro Coax, ITA
910121180
Tool, Inspection Depth Gauge, Micro Coax, ITA.
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For Real-Time X-ray Inspection Systems
Image Processors
A number of image processing software packages are available. Features include frame averaging, measurement, text, label, marking, 3-D rendering, video recording and image storage. Additionally, BGA analysis and void measurement software can be added as well as other options. See our image processors for x-ray inspection machines below.
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Soldering Inspection Video Microscope
MS-1000
The MS-1000 is a highly portable microscope for exclusive use with BGA, CSP, and QFP. It is highly efficient in inspecting portions which cannot be inspected by the X-ray inspection method.Specifically, it is efficient for inspecting the following conditions: fillets of soldered balls, melted condition of soldered parts, cracks, defective soldering, etc.
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Making Invisible Visible
Quadra 3
Quadra™ 3 is your partner for high quality X-ray inspection for production line quality control. Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking and counterfeit device screening. High quality, high magnification inspection for product applications.
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2D/3D AOI Series
MV-6e
- Exclusive10MP/18MPCameraTechnology- Precision Telecentric Compound Lens Design- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Extremely Simple Programming and Operation- Integrated INTELLI-SCAN® Laser Inspection System- 3D Co-Planarity Inspection of Gull-Wing Leads, BGA and CSP - - -- Devices- Enhanced 3D Solder Paste Height Measurement Capability- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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X-ray Inspection System
NEO-690Z / NEO-890Z
Off-line Microfocus X-ray Inspection System equipped with PONY ORIGINAL Direct Conversion X-ray Camera; SID-A50. Suitable for inspection of BGA, CSP, and LGA on PCB.
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AOI & SPI Test Systems
Xceed AOI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The Xceed enables true 3D measurement and provides the most accurate and repeatable inspection results with the minimum false calls. It’s designed with Advanced Signal Processing which gives results in noise-less, clear, and accurate 3D images.
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Digital In-Circuit tester
MTS180/300
Analog in-circuit inspection and function inspection are realized on this inspection equipment. IC pin float function is standard equipment. The MTS180 is a press type jig, and the MTS300 is a vacuum type jig. In the board mounting process at the production site, electrical inspection is performed on the mounted board after component mounting, and non-defective or defective products are automatically judged. The main inspection contents are short / open inspection, analog inspection of resistors, capacitors, coils, diodes, etc., lead floating voltage measurement of QFP and BGA, Digital IC inspection, frequency measurement.
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Optical BGA Inspection
Imaging hidden solder joints of BGA, IBGA, FlipChip, CSP, CGA and SMD components
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AOI & SPI, Test Systems
SigmaX SPI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The SigmaXs inspection technology is unaffected by varying materials, surface conditions, or colors. The system profiles the board to generate accurate 3D shapes far superior to other brands and technologies.
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Circuit Card Assembly
Teledyne Advanced Electronic Solutions assembles and tests a variety of complex circuit card assemblies (CCAs) using leading edge, advanced technology assembly automation. We specialize in low-volume, high-mix assembly of highly complex CCAs.- RF, analog, high-speed and digital circuits on rigid-flex and Cu core substrates- Typical lot sizes from 3 to 300 pieces- 4 high speed, flexible SMT lines- Production processes for components from 0201 chips to large grid-array components and connectors- 1...show more -
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Solid Measuring Viewer
SMV system is designed to perform automatic final inspecting system. SMV integrates professional vision and optics technology. Besides, reliable mechanical system reduces the maintenance time. It is especially suitable for the demand for high quality and low cost inspection. Unique inspection techniques adapt to all 3D measuring. It can detect laser Via, dimple, bump, copper plating thickness, line, SMT, BGA, etc. SMV provides 3D image and 3D measuring result. SMV adopts programmable LED lighting to obtain the best image.
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BGA Socket Adapter Systems
Advanced Interconnections Corp.
BGA Socket Adapter Systems convert surface mount device packages to through hole (pinned) assemblies, making it easy to plug and unplug SMT devices whether you are planning for future device upgrades, field programming at point of use, or need the ability to quickly swap out device packages in the field or the test lab. Protects valuable PC boards and saves time by eliminating the need to desolder packages during device removal.
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Open Top BGA Sockets
Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
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Inspection
A complete line of testing instruments for inspection laboratories is available from our Petrolab group. We specialize in instruments for vapor pressure, flashpoint, distillation, and color as well as equipment for hundreds of other ASTM, ISO, and DIN testing procedures. Below are a handful of items we offer.
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BGA Sockets
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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Inspection Systems
EVG's metrology solutions for wafer inspection and measurement are optimized for lithography and all types of bonding applications. Customers can choose between integration of the metrology technology within fully-automated equipment, or stand-alone metrology systems serving multiple process steps. EVG's metrology solutions are optimized to maximize our customers' production yields, featuring:
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Pipeline Inspection
Radiodetection and Pearpoint provide a wide array of Pushrod and Crawler pipeline inspection systems.
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Inspection Microscope
Z-NIR
The McBain Z-NIR Near Infrared Inspection System is best-in-class for wafer-to-wafer and die-to-die alignment measurement and verification. This unique tool has been sold into many industries with various applications including sub-surface wafer and die inspection for cracks and bond integrity, MEMS, wafer bonding, 3-D chip stacking, failure analysis, process development, tool verification, part characterization, environmental testing and more.
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Concrete Inspection
Concrete structures are normally constructed using steel reinforcement and Elcometer offers Concrete Covermeters and Rebar Locators to either measure the depth of concrete over the rebar or simply to detect the rebar under the surface. Half-cell versions of the Covermeter can be used to assess the probability that corrosion is taking place on the rebar. Test Hammers are used to assess the surface hardness of cured concrete and Elcometer offers several moisture meters that can be used to determine if the structure is sufficiently dry for coating.
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Appearance Inspection
We perform quality assurance agency of customers' important products through inspection.
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Optical Inspection
3D AOI
In contemporary electronics manufacturing, automatic optical inspection (3D AOI) is an established component of quality control. A company purchasing a 3D AOI system wants to ensure that it is manufacturing its electronic products in the very best quality and can guarantee they will have a long service life. The Viscom systems feature superlative 3D and software attributes to deliver excellent measurement accuracy and exceptional image quality. Our 3D AOI systems are designed for simple programming and can also be flexibly adapted to new requirements, allowing them to easily accommodate fast product changeovers as well as large production quantities.
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Inspection and Maintenance
Sensors' EMISSIONS INSPECTION ANALYZERS have a long-standing history for exceeding international standards with compact, portable, and cost-effective systems.
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Property Inspection Solution
DJI / IMGING
Advanced DJI drone solutions for the P&C Insurance industry. IMGING™ to conduct full roof and property inspections with incredible detail in as little as ten minutes from start to finish, and they’re getting high-resolution, actionable data they can use to make informed decisions. By combining Insurance-focused workflows and patents-pending autonomous flight control technology, IMGING is making roof inspections safer, quicker, and more consistent. It’s deceptively simple, amazingly powerful, and built specifically for Insurance.
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PV Cell Inspection
Solar developed a complete solution for stand-alone optical quality sorting, complete with inspection, classification and handling. The system allows implementation of automated optical inspection without changing existing machines.
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3D Measurement And Inspection
LOTOS
LOTOS automatic measuring systems can measure the full outer contours or individual areas of any measurement object quickly and precisely, irrespective of the shape, and test them for imperfections. The three-dimensional, non-contact measurement is carried out using optical measurement sensors with accuracy in the μm range. The result is a representation of the measurement object as a 3D model. Powerful, intuitive software allows the measurement results to be assessed extremely quickly.
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Inspection Tools
Multi Disk Test System (4-Port)
16 types of inspection modes can be registered and edited. More accurate acceptance inspections can be performed using various types of inspections.High speed data communications using USB interface for communicating with host computer.Acceleration testing for temperature loaded HDD can also be performed. (Optional)Easy attaching and removing HDD using optional plug-in unit.
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Building Inspection Kit
MR160-KIT2
Troubleshoot moisture and building problems wherever you go with the FLIR MR160-KIT2. This kit features the MR160, a moisture meter with IGM™ to quickly target problem areas, as well as the C2, a full-featured, pocket-sized thermal camera designed for a wide range of building and electrical applications. The MR160’s integrated pinless sensor and external pin probe provide the flexibility to take either intrusive or non-intrusive measurements. The kit also includes the MR06 wall cavity probe for even greater functionality.
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Defect Inspection Systems
Candela® defect inspection systems detect and classify a wide range of critical defects on compound semiconductor substrates (GaN, GaAs, InP, sapphire, SiC, etc.) and hard disk drives, with high sensitivity at production throughputs.
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LPDDR3 178-ball BGA Interposer For Logic Analyzers
W3301A
The W3301A LPDDR3 rigid BGA interposer for LPDDR3 178-ball DRAM enables capture of simultaneous read and write traffic at data rates in excess of 1866 Mb/s. E5406A Soft Touch probes and U4201A cables connect the W3301A LPDDR3 BGA interposer into the U4164A logic analyzer module. The W3301A LPDDR3 178-ball rigid BGA interposer allows signal access to the LPDDR3 signals critical to your debug and validation effort through a U4164A logic analyzer. The probe works in existing designs and eliminates ...show more
