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Silicon Inspection System
NIR-01
The NIR-01 imaging system is made of CNC engineered Aluminium alloy. The suruface protection is powder painting and electrolitic oxidation on pure aluminium surfaces. The frame of the system is a high quality industrial design. All components are designed for long term heavy usage with minimal maintenance needs. Electrical components are also selected for stability and durability. The block like electronics gives the advantage of easy and quick repair.
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PDP Driver/Function Inspection System
SRV
*Greatly Reduced Testing Tact Time*Cutting-Edge Inspection*Easy Operation
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Battery Management Systems Testing
A Battery Management System (BMS) is an embedded unit performing critical battery functions, including cell monitoring and balancing, pack charge and discharge control, safety, and communications. The BMS must be tested early in development to optimize control algorithms, as well as during manufacturing to ensure reliable functionality. Bloomy’s family of BMS test systems provides a consistent platform for engineers to bring a BMS to market faster, and more reliably.
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Wafer Internal Inspection System
INSPECTRA® IR Series
An infrared internal defect inspection system has been added to the INSPECTRA® series.It is now possible to inspection with both infrared and visual light in one system.
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2-Module ICT System, I317x Series 6
E9902G
Keysight's family of i3070 Series 6 In-Circuit Test (ICT) systems are built on a proven technology foundation, and they improve test efficiency with time-tested software, hardware, and programmability. I3070 Series 6 ICT tester supports a wide range of printed circuit board assembly (PCBA) sizes for applications including IoT and 5G, as well as automotive and energy. The i3070 features a unique design that delivers the shortest signal path between measurement circuitry and devices under test to minimize undesired effects from parasitic capacitance, improve immunity to crosstalk, and eliminate stray signal coupling effects, delivering consistent and repeatable measurements. The Series 6 is fully backward compatible with previous systems and makes highly repeatable measurements.
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X-ray Inspection System
RTX-113HV
Precision X-ray Inspection for BGAs, QFNs, LEDs, sensors, medical devices, and other packaged devices.
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Medalist i1000D
U9401B
The Keysight Medalist i1000D is now even better. Improving from its previous state of an analog-only ICT, the new digital release of the system now features per pin programmable digital cards and a whole new set of intuitive software graphical user interfaces (GUIs) that makes programming and development effortless.
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VLSI Test System
3380P
The 3380D/3380P/3380 test system have 4 wires HD VI source and any-pins-to-any-site high parallel test (multi-sites test) functions (512 I/O pins to test 512 ICs in parallel) that can meet the upcoming higher IC testing demands.
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In-Line Wafer Surface Defect Inspection
ALTO-SD-150/200
ALTO-SD SERIES IS AN IN-LINE INSPECTION SYSTEM SUPPLYING HIGH THROUGHPUT, FULL SURFACE DEFECT INSPECTION FOR ALL KINDS OF WAFERS INCLUDING SILICON, QUARTZ, SAPPHIRE, COMPOUND AND MEMS WAFERS. HIGH-RESOLUTION CAMERA OPTICS PLUS LED ILLUMINATION GUARANTEE RELIABLE DETECTION OF ALL LOCAL DEFECTS. IT INSPECTS DEFECT SIZE OF 1~ 10 MICRONS, CONFIGURABLE INSPECTION RESOLUTION TO OPTIMIZE DEFECT SIZE VS. THROUGHPUT. THE SYSTEM COMBINES HIGH-PRECISION MEASUREMENT, POWERFUL DATA ANALYSIS AND USER-FRIENDLY OPERATIONS.
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BMS Manufacturing Test System
The Battery Management System (BMS) Manufacturing Test System performs functional testing of product during end-of-line manufacturing. The system hardware includes all instrumentation to test a BMS, including multiple cell simulators, a mass interconnect for quick product transition and bed-of-nail fixtures to ensure less down time, higher throughput, and easy maintenance. The system application easily integrates into manufacturing processes, provides a method to test multiple product types, and optimizes tests to ensure only good product is released from manufacturing.
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Wafer Probers
Devices to align probes to test the electrical properties of IC chips or TEGs (Test Element Groups) formed on wafers. The vast options available will meet various needs, from research to mass production.
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Wafer Analysis Systems
Tropel®
Corning Specialty Materials has a long heritage of providing solutions to semiconductor equipment manufacturers. The Tropel line of wafer analysis equipment enables measurement of wafer substrates from 2” to 450mm regardless of material type and surface finish.
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SAS Protocol Test System
M124A
The SAS Sierra M124A Protocol Test System is Teledyne LeCroy's 7th generation protocol analyzer system that provides 100% accurate protocol capture of both SAS (SAS 3.0) and SATA (SATA 3.0). The industry's most widely used test platform for SAS and SATA features unmatched analysis and debug capabilities to help pinpoint problems at every layer of the protocol.
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Mezzanine System
5174
The 5174 provides two major functions, serving as a precision Voltage Controlled oscillator board and a variable frequency source board. These features can be use together or independently. As a variable frequency source, the 5174 provides a high-resolution variable clock source that is based upon a reference clock supplied by the ECM carrier.
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Wafer Test
Based on the reliability test, CSE conducts the test of the IC chip through electrical signals to the semiconductor wafer. We provide various Test Solutions according to the needs of designers/manufacturers. by sorting out good and bad products.
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In-Line Test System
With an Averna in-line test system, clients boost production/yields, catch defects invisible to the human eye, reduce equipment downtime, and ensure repeatable results.
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Test System Optimized for High Throughput, Low Cost of Test for Single Site, Multi-site and Index Parallel Applications
ETS-88RF
Targeting the needs of power amplifier (PA) and front-end-module (FEM) semiconductor manufacturers, the ETS-88RF test system is aligned with the test challenges associated with these direct RF radio wave interface components. The precision with which the ETS-88RF can measure high-gain, wideband frequency performance, adjacent channel leakage and power supply efficiency makes this test system the most cost-effective alternative to bench set-ups. Teradyne routinely provides timely updates to a substantial library of RF Standards (such as 802.11xx and 3GPP) targeted for PA and FEM test.
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Wafer Test
WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
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Iridium Physical Layer Test Systems
PLTS
Averna has worked with Iridium to ensure you have the right equipment to support their test coverage. The Iridium PLTS verifies product performance to Iridium’s standards. Find out more!
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Defect Inspection System
NovusEdge
The NovusEdge System provides high sensitivity inspection for the edge and backside of bare unpatterned wafers for current and advanced nodes. Multiple modules can be configured on the same automation platform for increased throughput while maintaining a small footprint for an improved cost of ownership.
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Smart Aircraft System
The Astronics Smart Aircraft System makes that possible. Our patented system enables the immediate, cabin-wide gathering of thousands of data points using sensors & IoT (Internet of Things) technology. The result? You get the insight you need—when you need it. Insight that helps you on every flight. Insight that allows you to improve your operational efficiency, your cabin safety, and your overall passenger experience.
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Industry-Standard, Automated Precision Inspection Systems
Circuit AOI 4.0
Circuit AOI 4.0 is a set of industry-standard, automated precision inspection systems that combine precision, robust construction and line-of-sight technology for assembly and production under stringent regulatory standards and is ideal for PCB / HDI line inspection.It uses innovative alignment detection logic to detect defects such as short / open circuit, protrusion / depression, scratch, pinhole, residual copper, line width / line distance violation, missing objects, unwanted objects, and so on. The system can be used with off-line set-up station and off-line re-check station to enhance the detection capacity.Circuit AOI 4.0 uses multi-angle LED light source, compared to the traditional single angle light source design, can obtain the best image contrast, widely used in different plate inspection.
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Vision Inspection Systems
We have available with us diverse array of Vision System. These systems are based on high-end technologies and meet the requirements of diverse sectors. Further, our systems are an epitome of quality and available at economical prices. Details of different systems.
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X-ray Inspection System
NEO-690Z / NEO-890Z
Off-line Microfocus X-ray Inspection System equipped with PONY ORIGINAL Direct Conversion X-ray Camera; SID-A50. Suitable for inspection of BGA, CSP, and LGA on PCB.
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Ceramics and Glass Inspection Systems
Due to their special material properties, ceramic and glass components are the basis of many high-tech products. The same properties make the production complex and costly. Substrate defects that lead to failure of finished components should be avoided at all costs. For this reason, early automated optical inspection is essential.For the inspection of sapphire and quartz glass Intego has developed systems to detect both external and internal defects and can also provide cutting suggestions. Using index matching it is possible to test rough or uneven glass profiles.For the inspection of ceramic components Intego offers solutions specifically tailored to the respective testing task. Our modular design uses standard components that have already been developed and tested and in most cases only requires minimal adaptation.
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Optical Inspection System
OIS Products
A manual optical inspection system that is able to inspect the wire-bonded leadframe or substrate.
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Photodiode Burn-in Reliability Test System
58606
The Chroma 58606 PD/APD Burn-in system is a high density, multifunction and temperature controlled module based system for photo diode burn-in and lifetime test. Each module has up to 256 Source Measurement Unit channels which can source current and measure voltage in various scenarios such as one described below. The system can accommodate 7 modules for a total of 1,792 device channels.
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Tool, Inspection Depth Gauge, Mini Coax, Receiver
910121156
Used to verify the depth setting of the center conductor of receiver mini coax contacts.
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PXIe System Sync Module, 5 Port
M9033A
The M9033A PXIe System Synchronization Module is a dual-slot, 5-port module that provides multi-module and multi-chassis synchronization and triggering for Keysight's modular instruments.
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AIM System Solutions
AIM can provide a wide range of customized solutions:*Special-to Type Test Equipment (STTE)*High Level Bus Analysers (HLBA)*Data Acquisition Recording & Simulation Systems*Aircraft Ground Equipment (AGE)*MIL-STD-1760 Weapon Test Sets*Fibre optic MIL-STD-1553 Stub/ARINC429 Link Extension System (FoMIS/FoL)
