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Product
Qseven Module with 4th Generation Intel Atom® Processor E3800 Series SoC (formerly codename: BayTrail)
Q7-BT
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The Q7-BT Computer-On-Module (COM) combines the Qseven® 2.0 standard with the Intel® Atom™ E3800 series System-on-Chip (SoC), providing an ideal solution for mid-range power and high, pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Product
COM Express Basic Size Type 7 Module with Intel® Xeon® D SoC and 4 SODIMMs
Express-BD74
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- 4 SO-DIMMs, up to 128GB dual channel DDR4 at 1866/2133/2400MHz ECC (dependent on SoC SKU)- Intel® Xeon® D SoC (up to 16 cores)- Two 10G Ethernet and NC-SI support- Up to 32 PCIe lanes (24x Gen3, 8x Gen2)- GbE, two SATA 6 Gb/s, four USB 3.0/2.0- Supports Smart Embedded Management Agent (SEMA®) functions
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Product
In-Process Wafer Inspection System
7945
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Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
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Product
Smart Aircraft System
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The Astronics Smart Aircraft System makes that possible. Our patented system enables the immediate, cabin-wide gathering of thousands of data points using sensors & IoT (Internet of Things) technology. The result? You get the insight you need—when you need it. Insight that helps you on every flight. Insight that allows you to improve your operational efficiency, your cabin safety, and your overall passenger experience.
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Product
Single Board Computers
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NAI offers a comprehensive line of adaptable, 3U cPCI, 3U VPX and 6U VME, rugged Single Board Computers (SBCs) specifically designed for harsh, SWaP-constrained environments in a range of demanding, embedded computing applications for the defense, commercial aerospace and industrial applications. These Commercial Off-the-Shelf (COTS) and modified COTS SBCs are based on the latest Intel®, NXP (PowerPC™), and ARM® Cortex®- A9 processors, each delivering unique advantages in deployed applications.
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Product
Semiconductor Test System
TS-960e
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The GENASYS Semi TS-960e PXI Express Semiconductor Test System is an integrated test platform that offers comparable system features and capabilities found in proprietary ATE systems. Available as a bench top system or with an integrated manipulator, the TS-960e takes full advantage of the PXI architecture to achieve a cost-effective and full-featured test solution for device, SoC and SiP test applications.
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Product
Rack based antenna test system
R&S®ATS800R CATR
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Very compact far-field over-the-air (OTA) test system based on compact antenna test range (CATR) technologyUnrivaled quiet zone size within 0.8 m2 footprintState-of-the-art reflector ensuring a high quiet zone accuracyUnique rack based CATR system supporting over 50 GHzIndirect far-field method (approved by 3GPP for 5G OTA testing)
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Product
VIP IFEC & CMS Systems
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Astronics is the smart choice for inflight connectivity, entertainment, and cabin management solutions for VIP, VVIP, and business aircraft. From the highest-performing global SATCOM connectivity for optimum productivity and entertainment, to our Avenir IFE/CMS line that incorporates the latest technologies to deliver native 4K video distribution through the highest bandwidth Ethernet network system in the industry, Astronics is ready with a cutting-edge solution that delivers the ultimate VIP experience.
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Product
HV Test System up to 20000 Volt
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Insulated test booth with large space for test items. 2 banana sockets for AC connection and 4 banana sockets for the DC connection of the DUTs. IC’s are tested in a long-term test. These are checked in an oil bath so that there are no air gaps to reduce the insulation. Maximum voltage 20 kV. Therefore, insulation tests must be carried out. Ensuring the standard-compliant test. For the safety of the operating personnel, the test cell is electrically locked while the high voltage measurement is active.
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Product
COM Express Basic Size Type 2 Module with Mobile 7th Gen Intel® Xeon® and Core™ Processors (formerly codename: Kaby Lake)
Express-KL2
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ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
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Product
Photonics Wafer Probing Test System
58635
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The advancement of the photonics device technology continues to enable broader and more demanding applications in the industry.
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Product
COM Express Mini Size Type 10 Module with Intel Atom® E3900 Series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
nanoX-AL
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The nanoX-AL is a COM Express® COM.0 R3.0 Type 10 module supporting Intel Atom® processor E3900 series system-on-chip (SoC). The nanoX-AL is specifically designed for customers who need optmized processing and graphics performance with low power consumption in a long product life solution.
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Product
COM Express Type 2 Starter Kit
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The Starter Kit consists of a COM Express Type 2 core module with ATX size reference carrier board that offers one PCI Express graphics slot x16 , four PCI Express x1 slot, two PCI slots, Serial ATA, SDVO, VGA, LVDS, TV-out, USB 2,0, Gigabit LAN, and Super I/O. All necessary cables are included.
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Product
AI Inference System Based On NVIDIA Nova Orin For AMR Applications
MIC-732-AO
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Fanless and ultra-compact design. Embedded with NVIDIA® Jetson AGX Orin™ up to 275 TOPS. Supports 1 x 10GbE, 1 x 2.5GbE, 3 x USB 3.2 Gen 2 (10 Gbit/s). Supports 2 x CANbus, 1 x mPCIe, 2 x Nano SIM slots. Support Total 8-ch GMSL3.0/2.0 with FAKRA connectors.
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Product
Massively Parallel Parametric Test System
P9001A
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The highest throughput parallel parametric test solution. 100-pin parallel measurement capability and faster single parameter measurement than Keysight 4080. Good data correlation with Keysight 4080. New per-pin parametric test unit module with all basic measurement function (voltage, current, capacitance, pulse, frequency). Easy development of parallel test plan. Easy migration from 4080 environment. Proven in 1st-tier logic foundries and memory companies.
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Product
6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MXE-5500 Series
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ADLINK's new Matrix MXE-5500 series of rugged quad-core fanless computers features the 6th generation Intel® Core™ i7/i5/i3 processors, delivering outstanding performance with robust construction.
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Product
Wafer Chip Inspection System
7940
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Chroma 7940 wafer chip inspection system is an automated inspection system for postdiced wafer chip inspection.
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Product
3.5" Single Board Computer With Intel® Core™ Ultra Processors
SBC35-MTL
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ADLINK SBC35-MTL, a compact 3.5" Single Board Computer equipped with Intel® Core™ Ultra Processors for efficient, high-performance computing. It features an integrated NPU to boost AI processing capabilities and includes a reserved MIPI-CSI signal pathway for easy camera integration, making it ideal for real-time and vision-based applications. The SBC35-MTL is designed to meet the needs of modern embedded systems, delivering cutting-edge performance in a compact form factor
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Product
SMARC Module
LEC-MTK-I1200
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The ADLINK LEC-MKT-I1200 is a SMARC module powered by the MediaTek MT8395 SoC with 4x Arm Cortex-A78 and 4x Cortex-A55 cores and up to 5 TOPS APU. The module incorporates a spate of IoT technologies, such as on-device artificial intelligence (AI) capabilities and support for up to 3 cameras, while delivering a low power envelope, making it the ideal solution for robotic and drone applications across various sectors, including consumer, enterprise, defense, industrial, logistics, and more.
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Product
Conformance Test System
TS8980
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The R&S®TS8980 is the most compact full range conformance testing solution on the market for testing in line with requirements from GCF, PTCRB and regulatory bodies. It supports the entire device certification process for RF and RRM, covering the widest range of technologies including 5G NR based on 3GPP and carrier acceptance specifications. The test system is available in various configurations to cover the required scope of testing.
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Product
Battery Management Systems Testing
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A Battery Management System (BMS) is an embedded unit performing critical battery functions, including cell monitoring and balancing, pack charge and discharge control, safety, and communications. The BMS must be tested early in development to optimize control algorithms, as well as during manufacturing to ensure reliable functionality. Bloomy’s family of BMS test systems provides a consistent platform for engineers to bring a BMS to market faster, and more reliably.
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Product
ETX Module with Intel Atom® Processor E3800 Series SoC (formerly codename: Bay Trail)
ETX-BT
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The ETX-BT is based on the latest Intel Atom® processor E3800 SoC series, adopting the latest 22nm process technology with 3-D Tri-Gate transistors featuring significant improvements in computational performance and energy efficiency. The E3800 SOC series integrates processor and GPU cores and all I/O on a single chip. Processor performance is scalable from a single-core Intel Atom® processor E3815 at 1.4GHz to a quad-core Intel Atom® processor E3845 at 1.9GHz. Two quad-core Intel® Celeron® processors, based on the same microarchitecture, are also available.
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Product
COM Express
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COM Express, defined by the PCI Industrial Computer Manufactures Group (PICMG), is the most successful Computer-On-Module (COM) standard in the embedded market today. COM Express employs a mezzanine-based approach, whereby an off-the-shelve module with two 220-pin board-to-board connectors, plugs into a custom, application-specific carrier board.
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Product
AI Application Board
MIO-5355
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Qualcomm Dragonwing QCS6490/QSC5430 on 3.5" SBC, OS support Yocto BSP, Windows on Arm & Ubuntu. Qualcomm® QCS6490/QCS5430 on 3.5" SBC, support extend operating temperature -20~70°C. Powerful but Low Power with 8x Kryo 670 CPU from 1.9 up to 2.7 GHz + Adreno GPU 643 + up to 12.3 TOPs iNPU.
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Product
In-line High-Density ICT System Series 7i
E9988GL
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The E9988GL Keysight i3070 Series 7i Inline High-Density In-Circuit Test (ICT) system brings industry-leading ICT technologies into your automated manufacturing line, saving resources and optimizing your automated test strategy.
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Product
CPE Design Verification System
Jupiter 310
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Jupiter is the industry standard for automated DOCSIS physical (PHY) layer testing. It provides the most comprehensive test coverage and accurate results on the market for DOCSIS 3.1 devices.
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Product
Data Acquisition System
DAQ973A
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Get the next-generation data acquisition (DAQ) system with a three-slot mainframe and your choice of nine plug-in modules. Interface with the DAQ using Keysight BenchVue DAQ software or use the intuitive graphical front panel with task-oriented, self-guiding menus.
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Product
3U OpenVPX™ Rugged, Cybersecure & Anti-Tamper Single Board Computer
68ARM2
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The 68ARM2 is a 3U OpenVPX Zynq® UltraScale+™ Quad-core ARM® Cortex™-A53 MPCore™ based Single Board Computer that can be configured with up to three NAI Smart I/O and communications function modules. Ideally suited for rugged Mil-Aero applications, the 68ARM2 delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.
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Product
COM Express Compact Size Type 6 Module with Next Generation Intel Atom® Processor SoC
cExpress-EL
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ADLINK cExpress-EL supports next generation Intel Atom x6000 processors (Elkhart Lake) combined with Intel UHD graphics at low power envelope and high speed interfaces. cExpress-EL modules support In-Band ECC dual channel DDR4 memory up to 32GB, and are also available in rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
Memory Test Systems
T5503HS2
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Semiconductor memories are in high demand to meet the needs of fast-growing end markets such as portable electronics and servers. It has been forecasted that applications ranging from mobile devices and data centers to automobiles, gaming systems and graphics cards will consume an estimated 120 billion gigabits of DRAM capacity. To meet this market demand, new generations of memories with data-transfer speeds of 6.4 Gbps and higher are being developed. Advantest’s second-generation T5503HS2 tester is designed to handle these ultra-high-speed memory ICs.
