BGA Test Sockets
Ball Grid Array package test connection between BGA and board.
See Also: Test Sockets, Burn-In Sockets
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Product
6TL19 Off-Line Base Test Platform
H71001900
Test Platform
The 6TL19 is a bare half-rack with castors for creating Off-Line, modular, flexible and reliable Base test platforms. The overall rack capacity is 11U (580mm depth).
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Product
Boundary-Scan DIMM Socket Tester
ScanDIMM
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Maximizing test coverage is an important piece in test procedure development. Unfortunately, not all designs have the necessary requirements in place to accommodate boundary-scan test methods on memory devices. ScanDIMM digital socket test modules are designed to overcome such limitations when testing DIMM sockets utilizing boundary-scan test techniques.ScanDIMM modules provide the capability to instantly turn any DIMM socket into a fully compliant IEEE-1149.1 device. Integration is as simple as assigning the included BSDL file to the reference designator of the target socket and compiling test vectors.In multi-socket systems, multiple ScanDIMM modules can be linked to provide even greater boundary-scan test depth.
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Product
LPDDR3 178-ball BGA Interposer For Logic Analyzers
W3301A
Interposer
The W3301A LPDDR3 rigid BGA interposer for LPDDR3 178-ball DRAM enables capture of simultaneous read and write traffic at data rates in excess of 1866 Mb/s. E5406A Soft Touch probes and U4201A cables connect the W3301A LPDDR3 BGA interposer into the U4164A logic analyzer module. The W3301A LPDDR3 178-ball rigid BGA interposer allows signal access to the LPDDR3 signals critical to your debug and validation effort through a U4164A logic analyzer. The probe works in existing designs and eliminates the need for up-front planning or redesign. The probe connects directly to the balls of the DRAM using a LPDDR3 178-ball riser (included) or an optional 3rd party socket (not provided), enabling operation and acquisition of LPDDR3 signals.
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Product
DDR4 BGA Interposers, DDR4 DRAM X16 Packages
N2115A
Interposer
The N2115A DDR4 BGA Interposers are soldered in between the DRAM and PC board or DIMM raw card where the DRAM would normally be soldered. They are designed with the PCB or DIMM foot print on the bottom side and the DRAM footprint on the top side. The signals from the memory controller chip and DRAM are then passed directly to the top side of the BGA probe adapter where they can be accessed with the oscilloscope probes.
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Product
BGA Rework Station
PDR IR-E3 Evolution
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The PDR IR-E3 SMT/BGA rework system, using PDR’s patented Focused IR technology, has been specifically designed to cope with the challenges of repairing today’s PCB assemblies.
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Product
Standardize Production Test Software For PCBAs And Electronic Devices
test
The vast majority of test project man-hours are spent on software development, so the choices that teams make in software tools and architecture have significant impact on deployment schedules. Standardizing software across a team or organization increases both efficiency and proficiency, lowering the risk of missed deadlines and improving test quality and reliability. Test software must:
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Product
BGA Socket And BGA Adapter Systems
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Mill-Max's BGA Socket/Adapter Systems are used for both socketing BGA devices and interconnecting circuit boards. Systems are available to fit 1mm, .050" and .8mm grid footprints.
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Product
Universal SOIC ZIF (Zero-Insertion-Force) Test Socket
Series 547
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Universal SOIC Zero Insertion Force Test Socket. Devices with up to 44 pins can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. Accepts SOIC gull-wing and J-lead devices, up to 44 pins on .050 [1.27] lead pitch, body widths from .150 to .600 [3.81 to 15.24].
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Product
230V AC Socket Tester With RCD Test (For UK)
1944
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Peaceful Thriving Enterprise Co Ltd
*With UKCA Approval.*Test for 230VAC circuits.*Neon indicators.*RCD Test.*30mA leakage current measurement.*Detect faulty wiring status in 3 wire receptacle.*Various combinations of 3 neon idnicators tell if wiring is OK or 6 possible faulty conditions.*Power Plug type: UK 13A socket-outlet*Measurement Category: CAT II / 1.5W*Frequency: 50Hz
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Product
Hybrid Socket
CSP/Ballnest
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Any grid size available on 0.50mm pitch or larger. ZIF style socket using Aries solderless, gold plated pressure mount Spring Probe. The gold over nickel plated compression spring probes leave very small witness marks on the bottom surface of the device solderballs.
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Product
DDR4 X4/x8 BGA Interposer For Logic Analyzer, Connects To 61-pin ZIF
W4643A
Interposer
The W4643A DDR4 2-wing BGA interposer for DDR4 x4/x8 BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A. The W4643A is the smallest BGA interposers for DDR4 x4/x8 DRAM capable of capturing simultaneous read and write traffic at data rates exceeding 3.2 Gb/s. U4208A and U4209A probe/cables connect any W4640A Series DDR4 BGA interposer directly into the U4164A logic analyzer module from 61-pin high density zero insertion force (ZIF) connectors that attach to the W4640A Series BGA interposer wings.
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Product
Universal ZIF (Zero-Insertion-Force) DIP Test Socket
Series X55X
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Universal Zero Insertion Force DIP Test Socket. All pin count sockets go into PCB with either .300 or .600 [7.62 to 15.24] centers. Sockets can be soldered into PCBs or plugged into any socket. Socket fits into Aries or any competitive test socket receptacle.
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Product
Elevator Socket with Bifurcated Contacts
Series 8XXX
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Elevator Sockets with Bifurcated Contacts. Ideal for elevating devices (displays, switches, etc.) to desired level with .260 to 1.250 [6.60 to 31.75] height extension.
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Product
Test System for High Volume Production Testing of Integrated Circuits
ETS-364
Test System
The ETS-364 is a general-purpose precision analog and mixed-signal test platform designed for high volume production testing of integrated circuits; optimized for high throughput applications with a fully integrated multisite software and hardware architecture.
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Product
Advanced SoC/Analog Test System
3650-EX
Test System
Chroma 3650-EX is specifically designed for high-throughput and high parallel test capabilities to provide the most cost effective solution for fabless, IDM and testing houses.
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Product
Sealed Beam Bulb Testing System
H710019SSL
Test Platform
EOL test for manufacturing of bulbs with LED for applications requiring to ensure watertightness: vehicles, marine, swimming pools, operating rooms, classified areas (Ex Zone), etc. The test system checks in a short time all the light and electrical characteristics of the bulb. A high precision Micro Leakage Meter also checks that there are no leaks between the environment and the inside of the bulb. The test results are recorded on the PC and can be printed on a quality control label attached to each unit.
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Product
BGA Rework Station
PDR IR-E6 Evolution
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The PDR IR-E6 SMT/BGA rework system, using PDR’s patented Focused IR technology, has been specifically designed to cope with the challenges of repairing today’s Large PCB assemblies.
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Product
Universal Function Test System for Industrial Electronics
Test System
General functional test system based on LXI instrumentation for high mix / low to medium volume manufacturing. DUTs are tested which are mainly used as communication and measurement modules in power plant technology, grid management and electrical drives.The system has a Virginia Panel adapter interface to which various desk adapters can be docked, including automated contacting of the DUTs. A camera for the verification of light emitting diodes on the test object is integrated in the adapter interface.
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Product
Socket Testers & Adaptors
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Our range of socket testers & adaptors allow users to quickly and simple check the wiring of a socket, clearly identifying polarity faults with and audible buzzer continuously sounding if correct.
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Product
BGA Socket Adapter Systems
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Advanced Interconnections Corp.
BGA Socket Adapter Systems convert surface mount device packages to through hole (pinned) assemblies, making it easy to plug and unplug SMT devices whether you are planning for future device upgrades, field programming at point of use, or need the ability to quickly swap out device packages in the field or the test lab. Protects valuable PC boards and saves time by eliminating the need to desolder packages during device removal.
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Product
Smart Sockets
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Ironwood Electronics extended its high performance socket product line with smart features. Sockets are typically rated for 2K to 500K cycles. How do we know if the sockets are used for 100K or 200K insertions? Solution is electronic chip insertion counter. Our sockets can be integrated with electronics counter into the compression mechanism of the socket lid. A push button is exposed on the compression plate. Every time a chip is compressed, push button is actuated which in turn activates the electronic circuitry inside the lid. These activations are counted by the counter IC and displayed in LCD. Let’s say a contact element is rated for 2K insertions. After 2K insertions, this contact element will be replaced by new contact element. Now, the counter has to start the counting from the beginning. To achieve this function, a reset option is included in the electronics circuitry. When reset is actuated, LCD display will go to “0”.
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Product
PXI Semiconductor/IC Test System
Test System
A high-density 100MHz PXIe digital IO card designed for characterizing, validating, and testing a variety of digital and mixed-signal ICs. Each IO card consists of a Sequencer Pattern Generator (SQPG) and 32 channels of full ATE-like features. The 33010 IO card is expandable up to 256 channels. Some unique features of the 33010 include an on-board SQPG, per pin timing/levels/ PMU/TFMU, multiple time domains, and multithreaded testing for complex IC testing. Each channel is also equipped with 64M vector memory, 16 timing sets with on-the-fly timing change, and per pin timing and frequency measurements up to 400 MHz.
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Product
JTAG External Modules (JEM) DIMM/SODIMM Socket Cluster Test
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The primary function of the JTAG External Modules (JEM) for the DIMM/SODIMM Socket Cluster Test is to provide test access to off-board signals that otherwise could not be accessed by a JTAG test system and to strengthen the memory-independent JTAG testing for the assembly correctness of the almost full spectrum of the modern socket types, particularly (according to JEDEC_Std.21-C):
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Product
Blade Socket Tester
RV 7
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The RV 7-Blade Socket Tester offers a fast, easy way to isolate a lighting problem to the trailer or towing vehicle. A must have for anyone who deals with hitch and lighting hookup installations, it tests the output of towing vehicle’s RV 7-blade lighting socket.
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Product
3-Axis Non-Robotic Automated Testing System
AT3
Test Instrument
The Instron AT3 is a space-efficient, highly adaptable 3-axis mechanical testing platform designed for automated execution of tensile, compression, flexural, and lap shear tests. Built to comply with a broad spectrum of ASTM and ISO standards, it’s well-suited for evaluating materials such as plastics, elastomers, thin films, foils, and metals. The system streamlines the entire testing workflow from specimen measurement and handling to strain measurement and specimen disposal—enabling users to load up to 160 samples and let the AT3 take care of the rest. Boost productivity, reduce manual intervention, and achieve consistent, dependable results with every test cycle.
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Product
Open Top BGA Sockets
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Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
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Product
NI Semiconductor Test Systems
Test System
The STS delivers the openness and flexibility of the NI PXI platform to the semiconductor production environment. For easy integration into the production test cell, the STS comes with features such as handler/prober integration, spring probe device under test interfacing, STDF data reporting, and system calibration.
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Product
Radar Test System
UTP 5065
Test System
Radar sensors are core elements to realize autonomous driving. The UTP 5065 radar test system from NOFFZ Technologies has a compact vertical design and contains everything needed to allow State-of-the-Art measurement and sensor calibration. The test bench setup and component selection are tuned to get best possible results for highly accurate and cost-efficient testing in production of automotive radar sensors.
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Product
Liquid Test Fixture
16452A
Test Fixture
The 16452A provides accurate dielectric constant and impedance measurements of liquid materials. The 16452A employs the parallel plate method, which sandwiches the liquid material between two electrodes to form a capacitor. An LCR meter or an impedance analyzer is then used to measure the capacitance created from the fixure.
