Burn-In Sockets
See Also: Test Sockets, Burn-In, BGA Test Sockets
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Burn-In Test Sockets
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The selection of the test socket is critical to the performance of a device during qualification testing where electrical bias and signals are applied. Key factors such as mechanical compatibility, operating temperature, ability to withstand high moisture levels, signal speed and lead inductance/capacitance all need to be taken into account when selecting the best socket for the test application.
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Burn-In Test
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C.C.P. Contact Probes Co., LTD.
Customized Burn-In Test Sockets for temperatures of up to 180°C.
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Test & Burn-In Socket for Devices up to 13mm Square
CSP/MicroBGA
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Test & Burn-In Socket. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws. Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
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Semiconductor
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With ultra-multi pin count and fine pitch, our general-purpose IC socket lineup corresponds to every need. For semiconductor burn-in sockets for thermal acceleration tests, and test sockets for semiconductor electrical testing, we continue to hold a high market share all over the world.
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Burn-In Systems
OPTIMUM Series
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Advanced Microtechnology, Inc.
The OPTIMUM product line of burn-in systems has a model to meet your individual testing requirements. Please select one of the models below for more specific information
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Burn-In Boards
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Meets burn-in requirements, including extreme temperatures or continual handling. 2 or more layers of polyimide. 200 C maximum temperature. Gold-plated connectors.
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TEST SOCKET
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IC Package It is a device to install INTERFACE between TESTER and DEVICE during TEST to check electrical defects such as O / S (Open, Short) test, mounting test, BURN-IN TEST and RLC TEST, The device
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SLT Socket
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Mobile Phone, Tablet, TV Board, Set-top box etc.LEENO can provide a System Level Test solution on various types of packages.
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Test Sockets
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Yamaichi Electronics Co., Ltd.
A test socket is the ideal point to test your home’s internal phone wiring for faults. You can also use it to identify any potential faults with the phone line outside. Your test socket is located in your master socket. It is the point between the internal phone wiring in your house and the phone line outside. That means by plugging into your test socket you can bypass all the internal wiring and test your device directly on the phone line.
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Hybrid Socket
CSP/Ballnest
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Any grid size available on 0.50mm pitch or larger. ZIF style socket using Aries solderless, gold plated pressure mount Spring Probe. The gold over nickel plated compression spring probes leave very small witness marks on the bottom surface of the device solderballs.
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QFN Sockets
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With the largest QFN catalog in the world, Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages. These sockets offer a modular design in a small outline with very low inductance. The Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version.
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Test Sockets
Non Standard
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Chances are good Ardent can help you with that. We can adapt our technology to just about any package, device or module. Small volumes of custom sockets for higher bandwidth applications are a niche all in their own, and our engineering team has many years of experience designing custom sockets for all kinds of applications.
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Elastomer Socket
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As a structure made of silicon and conductive powder, elastomer is a good solution for high speed, no ball damage, stable CRES, low force and high frequency testing.
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Burn-in and Stress Screening Chambers
KDR
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Supervise the operation of your product, electronic device, circuit board, or medical device while they are stress screened, burned-in, or temperature cycled inside a Bemco Kardburn or Koldburn glass front chamber. With a huge amount of testing or storage space within instant reach, KD Chambers provide a compact and attractive alternative to a walk-in chamber.
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Polyphase Socket Tester
K-281
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Knopp’s K-281 Polyphase Socket Tester is designed to detect backfeed conditions, grounds, short circuits and wiring errors in either a 120/240, 120/208 or 277/480 volt meter socket. It is equipped with high intensity Power Lights and Fault Lights to show whether or not the meter is safe to set. The Polyphase Socket Tester also comes with a heavy duty handle for quick and easy installation.
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Multi-Wafer Test & Burn-in System
FOX-XP
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The key features of the new FOX-XP test cell that contribute to the cost-effectiveness of the solution include the ability to provide up to 2,048 "Universal Channels" per wafer, which allows the system to test all the devices on the wafer in parallel. The new "Universal Channel" architecture allows any channel to be any function (I/O, Device Power Supply (DPS) or Per-pin Precision Measurement Unit (PPMU)). This enhanced architecture now allows customers to perform per pin parametric testing, more extensive digital pattern test with deeper data stimulus / capture memory (32M per pin), and deeper scan (768M) optimized for BIST/DFT testing.
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Burn-in System
Sonoma
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High power burn-in system with advanced testing functionality at DUT level for substantially lower cost and high performance using State-of-the-Art technology
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Burn-in Room and Aging Test Chamber
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Isolated type of burn-in room features: ●Separate the product and loading area, easy to control temperature and maintain. ●Temp. range: 40-70ºC±3/±5ºC, ●Temp. constancy: ±0.5ºC ●Uniformity: ±3ºC ●Test frame materials: painted stainless steel or a combination of forming aluminum ●Insulation: with PU foam ( doors with double glazing ) insulation, so that the internal temperature is not subject to external factors, to achieve power saving effect ●Product hierarchy placement, Selection of layer height in accordance with the requirements, convenient access ●Computer monitoring system is optional. ●Noise level:≤75dB Application Suitable for all kinds of electronic products, especially for products with heating characteristics Product and loading area should be separated Large-scale production
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Socket Tester
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*Power supply from mains : 200-230V AC*Transmit AC signal through concrete walls; Shielded / armored cable*Internal fuse protection
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Power Tube Burn-in Station
Maxi-Burn
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The MaxiBurn Tube Preheater is a 2U rack mountable or bench top unit for heating 30 Octal Base Tubes. Designed for continuous use heating standard power pentodes to normalize their characteristics before testing or matching the MaxiBurn powers the tube filaments and drives a nominal plate current through each tube. Normal function of each tube is indicated by a glowing LED associated with the tube.
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Test Sockets & Interposers
Silmat
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Innovative technology platforms and multiple product families for BGA, LGA, QFN and CSP packages down to 0.3mm pitch. High frequency bandwidth > 40 GHz..
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Burn-In System
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The COBIS-II Series Burn-in System is designed to test the latest high frequency integrated circuits (ICs) and combines a large capacity oven with well proven Accutron FlexBID™ dynamic driver technology. This system is engineered for productive dynamic device testing and reliable monitoring.
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BGA Sockets
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Our BGA socket platform takes advantage of the H-Pin®, a high-performance stamped spring probe pin, to provide a pure vertical contact system that meets all BGA design challenges at an enabling cost.
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Socket Phone
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Design for phone device test and system verify.Phone device: CPU,flash,baseband,LPDDR,power IC.etcPitch range from 0.30 to 1.27mmKey material: PEI,Peek,Torlon,PPS.etcContact with top pogo pin
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Socket Testers
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Precision Mastech Enterprises Co.
Handheld electrical tools plugged directly into wall outlets to quickly verify if they are wired correctly and functioning safely.
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Photodiode Burn-in Reliability Test System
58606
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The Chroma 58606 PD/APD Burn-in system is a high density, multifunction and temperature controlled module based system for photo diode burn-in and lifetime test. Each module has up to 256 Source Measurement Unit channels which can source current and measure voltage in various scenarios such as one described below. The system can accommodate 7 modules for a total of 1,792 device channels.
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BGA Sockets
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Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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Memory Burn-In Tester
H5620/H5620ES
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H5620 contributes to reduction of test cost by integrating the test process of DRAM Burn-in and Core Test. This hybrid memory test solution solves the challenge of reducing test costs while increasing test efficiency in the expanding DRAM market.
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Laser Diode Burn-in Reliability Test System
58604
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The Chroma 58604 is a high density, multi-function, and temperature controlled module for laser diode burn-in and lifetime tests. Each module has up to 256 SMU channels which can source current and measure voltage in various control modes as described below.
