Burn-In Sockets
See Also: Test Sockets, Burn-In, BGA Test Sockets
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Semiconductor
With ultra-multi pin count and fine pitch, our general-purpose IC socket lineup corresponds to every need. For semiconductor burn-in sockets for thermal acceleration tests, and test sockets for semiconductor electrical testing, we continue to hold a high market share all over the world.
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Burn-In Test Sockets
The selection of the test socket is critical to the performance of a device during qualification testing where electrical bias and signals are applied. Key factors such as mechanical compatibility, operating temperature, ability to withstand high moisture levels, signal speed and lead inductance/capacitance all need to be taken into account when selecting the best socket for the test application.
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Test & Burn-In Socket for Devices up to 13mm Square
CSP/MicroBGA
Test & Burn-In Socket. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws. Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
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Burn-In Test
C.C.P. Contact Probes Co., LTD.
Customized Burn-In Test Sockets for temperatures of up to 180°C.
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Burn-in System
Sonoma
High power burn-in system with advanced testing functionality at DUT level for substantially lower cost and high performance using State-of-the-Art technology
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Burn-in Systems
Incal Offers A Line Of State-Of-The-Art Burn-In Testing Hardware And Software For Retrofit And/Or Total, Customized Burn-In System Configurations.
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Burn-In Test Fixtures
Burn-in generally involves the extended operation of a product in a temperature-controlled environment. With possible humidity and supply voltage margining - the burn-in process can then be extended to include power stress (levels and on/off cycles) tests, high humidity environmental simulation as well as the classic "four corner test" of high voltage + high temperature, high voltage + low temperature, low voltage + high temperature and low voltage + low temperature.
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LED Burn-In Test
Burn-in system, based on LXI instrumentation, for concurrent testing of up to 80 DUTs in a climatic chamber. Devices to be tested include modern light emitting diodes and LED modules.The system consists of 2 control cabinets, each with 40 independent supply and measurement channels. Each channel can be configured individually via the operator software (current or voltage, including the relevant limit values). The software supports logging of current and voltage values for each DUT on all 80 channels with a sampling rate of <1s. Additionally, the software and system also support digital I/O channels, e. g. for controlling the climatic chamber. Inputs for connecting temperature sensors are also provided.
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Socket Phone
Design for phone device test and system verify.Phone device: CPU,flash,baseband,LPDDR,power IC.etcPitch range from 0.30 to 1.27mmKey material: PEI,Peek,Torlon,PPS.etcContact with top pogo pin
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Socket Probes
A lot of companies build test sockets. But only our test sockets are populated with our own proprietary probe technology, developed internally. This assures you that when you purchase one of our test sockets, you are using the most advanced interconnect available.
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Test Sockets
socket design as per customer specificationsquick + easy socket changehigh-performance spring probesdesigned for high frequency up to 16 GHz-55C/-67F to 150C/302F temperature rangemanual/automatic application optionssmall socket footprintone socket base for each insert (3x3 to 9x9 QFN)one-click switch from engineering to production socket modedevice dependent standard socket frame with changeable insertmore than 500,000 compression cyclesKelvin test applicabilitytool-free insert + actuator exchanges0.3 mm minimum lead pitchQFP extender available
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Aspen Sockets
Ironwood Electronics’ Aspen line of sockets are designed in standardized stepped footprint configurations, incorporating industry standard high performance spring pins. Sockets can be designed to work with any type of IC package; BGA – LGA – QFN – DFN and even leaded devices where you have minimal space to fit a socket in place of your device to allow fast, easy testing and development.
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Burn-in Board Continuity Tester
CT-1
Burn-in Board Coninuity Tester. Verifies burn-in board continuity and component tolerances. 768 I/O channels, can be forced to the constant current source or grounded independently. Highly accurate measurement of resistance, voltage, and capacitance using a pair of precision instrumentation amplifiers.
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Burn-In Tester
Universal test bench system. Provides basic electrical measurements at a low cost. Designed for a wide range of electronic products with a dedicated wiring harness. Allows you to expand the scope of functionality. Work in automatic or manual mode. Tailored to the needs of low- and high-volume production
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Electric Burn-in Board Carts
Conforms to SEMI ergonomic standards Holds and transports card cages for semi-automatic loading/unloading. Holds up to 10 burn-in boards. Raises and lowers the burn-in boards for easy loading/unloading of boards into ovens or onto test benches. Cart can be adapted to dock with any Micro Control oven.
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GHz Elastomer Sockets
Ironwood’s GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA or QFN device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss up to >40GHz and supports BGA or QFN/MLF pitches down to 0.3mm was utilized in these sockets. GHz BGA sockets are mechanically mounted over a target system’s BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry’s smallest footprint). They support IC devices with body sizes ranging from 55mm down to 1mm. Larger body sizes may require a backing plate. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed. This insulation plate sandwiches between the backing plate and target PCB.
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Camera Module Socket
Designed for application to all SMD type products, compact camera module clamshell socket provides a connector clip embodying precision in contact, a total interface solution.
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Socket Tester
*Power supply from mains : 200-230V AC*Transmit AC signal through concrete walls; Shielded / armored cable*Internal fuse protection
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Burn-In Boards
Manufacture of burn-in boards since 1976. Established for more than 40 years in the market, Trio-Tech is recognized and is an approved global supplier to all major semiconductor companies. Trio-Tech has the capability to design and manufacture boards for all system types, with solutions available for many test conditions, Including HTOL, PTC, HAST and 85/85.
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Memory Burn-In Tester
H5620/H5620ES
As Server and Mobile applications have mainly led the Memory and market has also entered a super cycle that has completely withdrawn from the previous silicon cycle.Memory capacitance will continue to rise as the application of data processing and mobile communication occurs—however, revenue will not grow as ASP goes down. Suppliers need to reduce test costs and increase profits.H5620 contributes to reduction of test cost by integrating the test process of DRAM Burn-in and Core Test. This hybrid memory test solution solves the challenge of reducing test costs while increasing test efficiency in the expanding DRAM market.
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Test Sockets
Yamaichi Electronics Co., Ltd.
A test socket is the ideal point to test your home’s internal phone wiring for faults. You can also use it to identify any potential faults with the phone line outside. Your test socket is located in your master socket. It is the point between the internal phone wiring in your house and the phone line outside. That means by plugging into your test socket you can bypass all the internal wiring and test your device directly on the phone line.
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Socket Tester c/w Buzzer
DL1090
Clear visual and audible indication of wiring status LED indication of a wide range of wiring conditions Designed to EN 61010 and IP30
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Single Phase Socket Tester
K-280
TESCO Knopp’s K-280 Single Phase Socket Tester is designed to detect short circuits, backfeed and wiring errors in a 120/240 volt, 3-wire, single phase self-contained meter socket.
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Custom Test Sockets
RTI specializes in producing custom test sockets We work with your engineering team from prototype to production, ensuring your product meets your test requirements. Contact us for a free quote.
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Socket with Collet Contacts
Correct-A-Chip
Correct-A-Chip with Collet Contacts. Correct-A-Chip technology solves problems associated with the use of alternate ICs (due to availability, obsolescence, need for better performance, etc.) by eliminating the need for new PCBs.
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Flex Socket Test Module
JT 2127/Flex Socket Test Module
The JT 2127/Flex STM memory socket tester is a family of hardware adapters specifically designed for the testing of of PCB-mounted DIMM & SODIMM sockets using a JTAG/boundary-scan controller and supporting software. The testing of memory sockets has always been troublesome for test and production engineers using JTAG/boundary-scan systems. Even when it is possible to create memory writes/reads from a boundary-scan compliant access device on the UUT (Unit Under Test), the initialization process may fail leaving you with little diagnostics information. What’s more it can still be uncertain whether fault lays with the DIMM module itself or the socket. Using the new JT 2127-Flex system from JTAG Technologies you get pin-point diagnostics from a known-good test interface so you can be certain that your socket is soldered correctly.
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RF Bias Burn-In System
These systems deliver an unbeatable combination of advantages over a wide range of RF frequencies and power levels. The Automated Multi-Channel RF-Biased Burn-In Test System is a turnkey system that incorporates all of the capability needed for accelerated aging and parametric testing of RF semiconductor devices. Its powerful software elegantly supports data acquisition, storage, and presentation. Accel RF’s customers choose system features to meet their technical needs and capital budget. In addition to cost savings, use of Accel-RF’s solutions accelerate product time-to-market, saving many months of product development.
