- Virginia Panel Corporation
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Module Accessory Kit, Quantity 26, 4-40 x .375" Socket Head Cap Screws
510109301
Used with modules: 510104118 and 510108104.
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Open Top BGA Sockets
Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
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QFN/QFP35 Sockets
Test sockets are designed for testing today’s high-performance QFN, QFP, DFN and SOIC devices. For development, characterization, at speed burn-in, and low volume production manual testing.
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BGA Sockets
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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Stamped Spring Pin Sockets
Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature...show more -
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BIB Loading
FALCON Series
The Falcon Series is an automated BIB loading and unloading machine. It is designed to provide precise high-speed loading of DUTs from Trays/Tube to Burn-in boards and precise high-speed unloading of DUTs from Burn-in boards to Trays/Tube for different device packages. The Falcon Series also has a simple conversion kit which allows end-users to re-configure the equipment for different types of sockets and package combinations.
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Burn-In Test
C.C.P. Contact Probes Co., LTD.
Customized Burn-In Test Sockets for temperatures of up to 180°C.
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Burn-In Test Sockets
The selection of the test socket is critical to the performance of a device during qualification testing where electrical bias and signals are applied. Key factors such as mechanical compatibility, operating temperature, ability to withstand high moisture levels, signal speed and lead inductance/capacitance all need to be taken into account when selecting the best socket for the test application.
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Test & Burn-In Socket for Devices up to 13mm Square
CSP/MicroBGA
Test & Burn-In Socket. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws. Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
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LGA Sockets
We’ve taken our QFN expertise and combined it with the versatility and performance of the H-Pin® to leverage an LGA socket platform that serves the demanding requirements of today’s market. Plastronics LGA sockets using the H-Pin provide a high-performance socket that is affordable for all burn-in operations. These LGA sockets meet the power, temperature and signal performance needs of the higher density, larger package outline, and sometimes mix-pitch LGA designs. The LGA platform serves package sizes from as small as 2.0mm X 2.0mm to the industry’s largest standard socket for 60.0mm X 60.0mm packages.
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Burn-In Board Tester
Focus-275
Focus275 is a tester for burn-in board.It can improve reliability of burn-in board by inspecting boards for burn-in test by Focus275 regularlyBoth short open test and component test can be done by sending electric signals for special socket contactor and edge part.
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Burn-in and Test Sockets
Loranger International Corporation
Loranger International Corporation designs and manufactures thousands of socket styles for the burn-in and test of semiconductors and electronic components. Some of the socket styles are listed below.
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Semiconductor
With ultra-multi pin count and fine pitch, our general-purpose IC socket lineup corresponds to every need. For semiconductor burn-in sockets for thermal acceleration tests, and test sockets for semiconductor electrical testing, we continue to hold a high market share all over the world.
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Burn-In Test
Trio-Tech provides a comprehensive range of semiconductor testing services through its state-of-the-art laboratories in the Far East. The laboratories provides static and dynamic Burn-in /HTOL /SLT testing and other testing services. All of the company’s testing facilities are ISO9001, ISO14000, ISO17025 and DSCC certified ensuring that operating policies and procedures meet stringent international standards for consistency and reliability.
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Burn-In System
The COBIS-II Series Burn-in System is designed to test the latest high frequency integrated circuits (ICs) and combines a large capacity oven with well proven Accutron FlexBID™ dynamic driver technology. This system is engineered for productive dynamic device testing and reliable monitoring.
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Burn-In Boards
Meets burn-in requirements, including extreme temperatures or continual handling. 2 or more layers of polyimide. 200 C maximum temperature. Gold-plated connectors.
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Burn-In Systems
OPTIMUM Series
Advanced Microtechnology, Inc.
The OPTIMUM product line of burn-in systems has a model to meet your individual testing requirements. Please select one of the models below for more specific information
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Sockets
Ironwood Electronics Sockets – Embedded gold plated wire elastomer (SG) – Stamped & Etched spring pins (SBT) – Embedded silver ball elastomer matrix (SM/SMP)– Compressible silver button in polyimide (GT/GTP)– Surface mount adapters for sockets (SF)
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Burn-in Room and Aging Test Chamber
Isolated type of burn-in room features: ●Separate the product and loading area, easy to control temperature and maintain. ●Temp. range: 40-70ºC±3/±5ºC, ●Temp. constancy: ±0.5ºC ●Uniformity: ±3ºC ●Test frame materials: painted stainless steel or a combination of forming aluminum ●Insulation: with PU foam ( doors with double glazing ) insulation, so that the internal temperature is not subject to external factors, to achieve power saving effect ●Product hierarchy placement, Selection of lay...show more -
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Photodiode Burn-in Reliability Test System
58606
The Chroma 58606 PD/APD Burn-in system is a high density, multifunction and temperature controlled module based system for photo diode burn-in and lifetime test. Each module has up to 256 Source Measurement Unit channels which can source current and measure voltage in various scenarios such as one described below. The system can accommodate 7 modules for a total of 1,792 device channels.
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Probe “Socket” Clamps
LCP-S12
A simple and cost-effective option for mounting Small-aperture Probes in the probe plate. A Socket Clamp tool is needed for insertion and removal of the clamp in the probe plate
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Memory Burn-In Test
The N3500 is Neosem Technology’s fourth generation memory test system. Specifically designed for Flash Components and Flash Cards, the N3500 tester-on-a-board architecture targets the broadest range of DUT technologies in various form factors and packages. Each Tester Board (or “Blade”) contains 288 I/O pins and 32 DPS supplies.
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Electric Burn-in Board Carts
Conforms to SEMI ergonomic standards Holds and transports card cages for semi-automatic loading/unloading. Holds up to 10 burn-in boards. Raises and lowers the burn-in boards for easy loading/unloading of boards into ovens or onto test benches. Cart can be adapted to dock with any Micro Control oven.
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Test Sockets
QFN/QFP
For today’s chipscale packages, finding the right socket solution can be challenging. With SC™ sockets from Ardent, you can count on the right design, the best performance, and quick turns for even the most challenging custom designs
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Socket Probes
A lot of companies build test sockets. But only our test sockets are populated with our own proprietary probe technology, developed internally. This assures you that when you purchase one of our test sockets, you are using the most advanced interconnect available.
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Burn-in System
Sonoma
High power burn-in system with advanced testing functionality at DUT level for substantially lower cost and high performance using State-of-the-Art technology
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QFN Sockets
With the largest QFN catalog in the world, Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages. These sockets offer a modular design in a small outline with very low inductance. The Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version.
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Test Socket
Contact Pitch Sizes 0.3mm, 0.4mm, 0.5mm, 0.65mm, 0.8mm, 1.0mm (custom pitches available)•Bandwidth < -1 dB through 65GHz•Current Carrying Capabilities 1 - 4 Amps•Pin Contact DC Resistance 10 - 30 mΩ•Environmental -40°C to +150°C•Self Inductance 0.14nH – 0.36nH•Mutual Inductance 0.12nH – 0.32nH•Typical Contact Force 12 – 35 grams/pin•Contact Compliance 75 µm – 200 µm•Custom Cooling Options Available
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