Burn-In Sockets
See Also: Test Sockets, Burn-In, BGA Test Sockets
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Product
High Performance Chipscale Test Sockets
SC
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Ardent Concepts Test Sockets for ATE test deploy patented SC Contact Sets. This technology is capable of over 2 Million mechanical insertions in production environments and uses easy to replace pins with no complicated assembly procedure. It is designed to be drop-in compatible with 1mm offset and straight through footprints to ease implementation, and RC SC’s simple and robust design is extremely cost effective when compared with existing “roll” type test contactors and sockets. Designed specifically for JEDEC QFN and MLF applications, SC High Performance Test Sockets are available for most handler set-ups and offer exceptional AC performance.
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Product
Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3000-CF Series
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ADLINK provides an optimized, highly-available computing platform with expandability options, including the MXM cards. The DLAP-3000-CF series platforms support performance-hungry workloads (e.g., deep learning) with active cooling for applications requiring very high levels of computing in a limited space. DLAP-3000-CF Series features: - Smallest Embedded GPU Platform (3 liters) - Reliable MXM GPU Design with Low TDP - Scalable Graphics Processing Ranging from Pascal to Turing GPUs
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Product
ATX Motherboard With LGA1151 Socket 8th Gen Intel® Core™ Processor, Intel® Q370, USB 3.1 Gen2, SATA 3.0, Dual LAN, VGA, DisplayPort, DVI-D, And HDMI
IMB520
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The IMB520 is powered by the LGA1151 socket 8th generation Intel® Core™ i7/i5/i3, Pentium® or Celeron® processor (code name: Coffee Lake) with the Intel® Q370 chipset. The ATX motherboard supports four 288-pin DDR4-2666/2400 DIMMs with up to 64GB of system memory. The Intel® Coffee Lake-based IMB520 is a performance-driven motherboard that is expandable, feature-rich and versatile to help facilitate quick deployment. The brand new IMB520 is an ideal solution for automation, transportation, retail, medical and other Industrial IoT-related applications. The IMB520 provides one PCIe x16 slot, four PCIe x4 slots, one PCIe x1 slot and one PCI slot for frame grabbers, motion control cards and edge-based data acquisition cards, making it an ideal solution for machine vision and industrial automation application. It also has two USB 3.1 Gen 2 and four USB 3.1 Gen 1 ports for faster data transfer. In addition, the industrial-grade ATX motherboard is integrated with the Intel® HD Graphics for superb visual performance. Up to three independent displays are available from DisplayPort, DVI-D, HDMI, and VGA.
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Product
3.5" Embedded SBC With LGA1151 Socket For 7th/6th Gen Intel® Core™ I7/i5/i3 Processor, LVDS, VGA, HDMI, 2 GbE LANs And Audio
CAPA500
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The CAPA500 features the LGA1151 socket 7th generation Intel® Core™ processor family (codename: Kaby Lake) with 35W TDP (thermal design power), as well as the Intel® H110 chipset (Q170 optional). The CAPA500 supports one 260-pin DDR4-2400 SO-DIMM with a memory capacity up to 16GB for extensive storage. The compact 3.5-inch embedded motherboard also offers display outputs through HDMI, VGA and LVDS for triple independent display applications. Moreover, the compact-sized embedded board runs on +12 VDC power, supporting auto power-on. It can operate at a wide range of temperatures from -20°C to 60°C under active thermal control. The 146 mm x 104 mm embedded SBC is suitable for IoT/M2M-related, industrial control, self-service terminal, digital signage, POS, kiosk and many other applications where high-speed processing and graphics performance under limited space is required.
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Product
Hybrid Socket
CSP/Ballnest
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Any grid size available on 0.50mm pitch or larger. ZIF style socket using Aries solderless, gold plated pressure mount Spring Probe. The gold over nickel plated compression spring probes leave very small witness marks on the bottom surface of the device solderballs.
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1U Rackmount Network Appliance Platform With LGA1150 Socket Intel® Xeon® E3/Core™ Family Processor, Intel® C226 And Up To 24 LANs
NA570
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NA570 1U rackmount Network Security Platform, supports the 4th generation Intel® Xeon® E3 / Core™ processor family, formerly codenamed "Haswell". NA570 offers greatly improved performance and reduced power consumption base on the new Intel architecture marked improvements in power efficiency and performance. The system supports up to 32GB DDR3 1600 non-ECC / ECC (only NA570) memory. NA570 support 4 pairs of LAN Bypass function. Bypass ports allow users to experience uninterrupted network traffic even if a single in-line appliance hangs or sudden shutdown. Expandable LAN Modules via the PCIe 3.0, support up to 24 GbE ports, or up to 4 ports at 10GbE, and a future upgrade to 40GbE, port density and optional networking ports to suit your demands.
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Product
Fanless Embedded System With Socket G2 Intel® Core™ I7/i5/i3 & Celeron® Processor And 4 GbE LANs
eBOX660-872-FL
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A high-performance fanless embedded system with 3rd Generation Intel® Core™ processor (Ivy Bridge), the eBOX660-872-FL, is presented by Axiomtek earnestly. It incorporates the 3rd Generation Intel® Core™ processor (i7/ i5/ i3) or Intel® Celeron® processor with Intel® HM76 Express chipset, propelling computing with better processing. With the great graphics computing capability and dual view support, this fanless embedded box computer is especially suited for automatic optical inspection, digital signage (DS), digital surveillance, gaming, automation control and POS/Kiosk. In addition, this application-ready compact rugged platform also targets for nearly any field of industrial embedded applications like embedded controller, factory automation and more fields.
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Fanless Embedded System With LGA1151 Socket 7th/6th Gen Intel® Core™ & Celeron® Processor, Intel® H110, HDMI, DisplayPort, VGA, 6 USB, 4 COM, PCI Express Mini Card Slot And 10 To 30 VDC
eBOX640-500-FL
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The eBOX640-500-FL is powered by the 7th generation Intel® Core™ i7/i5/i3 and Celeron® processor families. It features dual DDR4-2133 DIMM sockets with up to 32GB of system memory, and provides a wide choice of front-accessible I/O interfaces for easy cabling and maintenance. It supports an extended operating temperature ranging from -10°C to +55°C, a wide voltage range DC power input from 10 to 30 VDC with power protection, and up to 2G vibration endurance, enabling a reliable and stable operation in harsh environment. The superior Intel® Kaby Lake-based fanless embedded box PC can support three independent high resolution displays and 4K resolution, offering high quality imaging.
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Open Pluggable Specification (OPS) Digital Signage Player With LGA1151 Socket 8th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H310 And TPM 2.0
OPS500-520-H
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The OPS500-520-H is powered by the newest 8th generation Intel® Core™ i7/i5/i3 and Celeron® processors (code name: Coffee Lake S) with the Intel® H310 chipset. The smart cableless digital signage module has two DDR4-2400 SO-DIMMs for up to 32GB of system memory. Axiomtek's OPS500-520-H supports the LGA1151 socket-type processors offering greater flexibility for CPU selections, which is easily configured to meet various performance requirements. The OPS signage module is connected to OPS-compliant display via a standardized JAE TX-25A plug connector interface which supports DisplayPort, HDMI 2.0, USB 2.0, USB 3.1, audio and UART signals. It also has one M.2 Key E for Wi-Fi modules and one M.2 Key M supporting PCIe, SATA and SSD interfaces for storage. We believe that this new smart cableless open pluggable signage module with simplified installation, maintenance and upgrade can help you develop creative display solutions that increase your sales and improve your customers' experiences. With the enhanced multimedia performance, the Intel® Coffee Lake S-based OPS500-520-H is well suited for a wide range of digital signage applications in retail, transport, entertainment, education, and more.
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4-slot Fanless Industrial System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q170, Front-access I/O, PCIe And PCI Slots
IPC964-512-FL
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The IPC964-512-FL is a 4-slot fanless barebone system with modular design and optimized expandability. The rugged industrial PC supports the high-performance 7th/6th generation Intel® Core™ and Celeron® processors with the Intel® Q170 chipset. The IPC964-512-FL features dual DDR4-2133 SO-DIMM slots with up to 32GB memory. For easy cabling and maintenance, the IP40-rated embedded system features a wide choice of front-accessible I/O interfaces, including two Gigabit LAN ports, four USB 3.0 ports, one VGA, one HDMI, one audio (Mic-in/Line-out), and three optional I/O modules - a 4-port isolated RS-232/422/485 module, an isolated 8-in/8-out DIO module, and a 2-port isolated RS-232/422/485 and 4-in/4-out DIO module. The compact industrial PC also provides four flexible PCI/PCIe expansion slots with three different combinations of expansion kits: one PCIe x16 and one PCIe x4; one PCIe x16 and one PCI; and two PCI. Additionally, it has a full-size PCI Express Mini Card slot for 3G/4G, GPS, Wi-Fi and Bluetooth connections, and comes with two easy-swappable 2.5” HDD trays for storage. To fit various industrial environments, the rugged modular industrial PC supports 24VDC (uMin=19V/uMax=30V) power input with a lockable terminal block-type connector and a wide operating temperature range of -10°C to +60°C.
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Product
Open Pluggable Specification (OPS) Digital Signage Player With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q170 And Intel® AMT 11.0
OPS500-501
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The OPS500-501 is a 4K resolution OPS compliant digital signage player supporting Intel® Active Management Technology (AMT) 11.0 for better remote management. The space-saving OPS signage module is powered by the 6th generation Intel® Core™ processor with Intel® Q170 chipset. It has one 260-pin DDR4-2133 SO-DIMM socket with up to 16GB memory capacity. Compliant with the Intel® OPS architecture, the 4K-ready signage player provides a high level of compatibility as well as simplified installation, maintenance and deployment for a lower total cost of ownership. The outstanding digital signage player, the OPS500-501, is connected to OPS-compliant display via a standardized JAE TX-25A plug connector that supports DisplayPort, HDMI 2.0, UART, audio, USB 3.0 and USB 2.0 signals. To meet various application needs, the powerful digital signage system offers rich I/O interfaces on its front panel, including one USB 2.0 ports, two USB 3.0 ports, one COM port, audio (in/out), HDMI and a Gigabit Ethernet port. This space-saving OPS signage player has one PCI Express Mini Card slot for WLAN connectivity and features one 2.5” SATA HDD for extensive storage needs.
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Product
Module Accessory Kit, Quantity 26, 4-40 x .625" Captive Socket Head Cap Screws
510109366
Accessory Kit
Used with modules: 510104135, 510104136, 510150115, 510150116, 510150130, 510150136, 510150137, 510150147, 510151105, 510151106 and 510151124.
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Product
Tester, US Mains Socket
72-6861
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The 72-6861 is a Receptacle Tester with 3-indicator light. 2nd-Amber indication for ground contact (Open ground) and 3rd-amber indication for neutral contact (Open neutral) not connected, for hot and ground contacts interchanged indication by red and amber. If 2-amber indication occurred, receptacle is wired correctly.
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Product
Socket Phone
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Design for phone device test and system verify.Phone device: CPU,flash,baseband,LPDDR,power IC.etcPitch range from 0.30 to 1.27mmKey material: PEI,Peek,Torlon,PPS.etcContact with top pogo pin
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Burn-In Boards
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Meets burn-in requirements, including extreme temperatures or continual handling. 2 or more layers of polyimide. 200 C maximum temperature. Gold-plated connectors.
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BGA Sockets
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Our BGA socket platform takes advantage of the H-Pin®, a high-performance stamped spring probe pin, to provide a pure vertical contact system that meets all BGA design challenges at an enabling cost.
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Fanless Embedded System With LGA1151 Socket 8th Gen Intel® Core™ & Celeron® Processor, Intel® H310, HDMI, DisplayPort, 6 USB, 2 COM And 8-CH DI/DO
eBOX640-521-FL
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*LGA1151 socket 8th gen Intel® Core™ i7/i5/i3 & Celeron® processor (Coffee Lake)*Supports 2 COM, 6 USB and 8-CH DI/DO*Two 2.5" SATA drive bay*M.2 Key E 2230 for Wi-Fi*Front I/O connectivity design*12/19 to 24 VDC power input via DC-Jack*Flexible I/O window supported
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Fanless Embedded System With LGA1150 Socket 4th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H81, 2 HDMI/ VGA/ DisplayPort, 2 GbE LANs, USB 3.0, CFast™ And PCI Express Mini Card
eBOX635-881-FL
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The eBOX635-881-FL supports the 4th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® processor with Intel® H81 chipset. The super light yet compact eBOX635-881-FL comes packaged in an IP40-rated aluminum and cold-rolled steel enclosure and is designed to operate at temperatures ranging from -20°C to +50°C for use in the extremely environments. The fanless embedded system supports six jumper-less RS-232/422/484 and sixteen DI/DO ports along with three display outputs of two HDMI, DisplayPort and VGA for applications used in transportation, POS, kiosk, industrial control automation and medical equipment. Two PCI Express Mini Card slots are added to the system for greater expansion capability. One SIM slot is also available for 3G/4G, GPS, Wi-Fi and Bluetooth applications, allowing for more efficient networking options.
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Product
Universal PLCC ZIF (Zero-Insertion-Force) Test Socket
Series 537
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Universal PLCC ZIF Test Socket Live Bug Type. This Universal PLCC ZIF (zero insertion force) Test Socket will take seven sizes of PLCC footprints with Aries insert plate, Part No. XX-537-20. Data Sheet No. 10012, available seperately.
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Product
Socket Tester with RCD Tripping
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Shanghai Beha Electronics Co., Ltd.
*Mains wiring polarity check.*ELCB/RCD testing.*Measuring ear for line current.*Measuring ear for leakage current.*Helps calculate insulation resistance.*Helps calculate power consumption.*Helps fault finding of standing earth fault.*Fused main adapter.*Appliance testing (with the ad of a clamp meter).
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Strip-Line™ Socket with Bifurcated Contact Wire Wrap Pins
Series 0501
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Strip-line Sockets with Bifurcated Contact Wire Wrap Pins. Features: For mounting liquid crystal displays and other high pin count or odd centered components. Available in several sizes with bifurcated contacts in wire wrap or solder tail pins. Consult Data Sheet No. 12008 for solder tail pins.
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Near Zero Footprint SMT Spring Pin Sockets
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Ironwood Electronics socket is a device size or near device size footprint test socket incorporating industry standard high performance spring pins. Ironwood can design a socket to work with any type IC packages- BGA, LGA, QFN, DFN and even leaded devices where you need to fit a socket in place of your device to allow fast, easy testing and development.
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Product
IEC60065 Socket Torque Balance Tester Torsion Tester
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Shenzhen Chuangxin Instruments Co., Ltd.
*Plug and Socket Torque Tester/Device is for compliance is checked by engaging the device, as during intended use, with the socket-outlet of a test apparatus. *Plug Torque Tester/Equipment is a device provided with pins intended to be introduced into fixed socket-outlets shall not impose undue strain on these socket-outlets.The balancing arm of the test apparatus pivots about a horizontal axis through the centre lines of the contact tubes of the socket-outlet at a distance of 8 mm behind the engagement face of the socket-outlet.*With the machine not in engagement, the balancing arm is in equilibrium, the engagement face of the socket-outlet being in the vertical position.After the device has been engaged, the torque to be applied to the socket-outlet to maintain its engagement face in the vertical plane is determined by the position o a weight on the balancing arm.
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Open Pluggable Specification (OPS) Digital Signage Player With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor And Intel® H110
OPS500-501-H
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The OPS500-501-H is an OPS compliant digital signage player supporting dual displays with 4K at 60Hz resolution. The smart cableless open pluggable digital signage module is powered by the latest 7th/6th generation Intel® Core™ and Celeron® processors (codename: Skylake) with the Intel® H110 chipset, providing outstanding performance at a lower cost. It supports LGA1151 socket-type CPUs to offer greater flexibility for CPU selection. In addition, the OPS signage module has one 260-pin DDR4-2133 SO-DIMM socket with up to 16 GB memory capacity. The high-performance OPS500-501-H is a perfect solution for multi-display applications in airport information board, shopping mall, corporate, education, hospitality, religious organization, bank, retail store, restaurant, performing art center, and many more.
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LGA Sockets
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We’ve taken our QFN expertise and combined it with the versatility and performance of the H-Pin® to leverage an LGA socket platform that serves the demanding requirements of today’s market. Plastronics LGA sockets using the H-Pin provide a high-performance socket that is affordable for all burn-in operations. These LGA sockets meet the power, temperature and signal performance needs of the higher density, larger package outline, and sometimes mix-pitch LGA designs. The LGA platform serves package sizes from as small as 2.0mm X 2.0mm to the industry’s largest standard socket for 60.0mm X 60.0mm packages.
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Burn-in Room and Aging Test Chamber
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Aging test room according to your requirements. More types of Burn-In Test Room, Burn-In Chamber, Burn-In Test Oven wanted, please contact us freely.
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Silver Ball Matrix Sockets
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SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
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Three-Phase Smart Socket
WECO 3230
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Utilize the RW-3X's features while on site in the van, as well as back at the shop with the WECO 3230 Three-Phase Smart Socket. The 3230 features built-in laser optics, Smart Socket™ technology and automatic meter form selection. Connect the RW-3X to the 3230 side panel using the included cables and the RW-3X Winboard Embedded software automatically sets the meter form, which will then populate on the WECO 3230 LCD display panel, and now you are ready to test. Not only does the 3230 make testing meters a snap, but it expands the current capability of the RW-3X to a full 50 amps, allowing the user to test class 320 amp meters.
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GHz Elastomer Sockets
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Ironwood’s GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA or QFN device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss up to >40GHz and supports BGA or QFN/MLF pitches down to 0.3mm was utilized in these sockets. GHz BGA sockets are mechanically mounted over a target system’s BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry’s smallest footprint). They support IC devices with body sizes ranging from 55mm down to 1mm. Larger body sizes may require a backing plate. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed. This insulation plate sandwiches between the backing plate and target PCB.
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ATX Motherboard With LGA1151 Socket 7th/6th Gen Intel® Core™ Processor, Intel® Q170, USB 3.0, SATA 3.0, Dual LAN, VGA, DVI-D And HDMI
IMB502
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*LGA1151 socket 7th/6th gen Intel® Core™ i7/i5/i3, Pentium® & Celeron® processor (Kaby Lake/Skylake)*Four 288-pin DDR4-2400/2133/1866 DIMM for up to 64GB of memory*VGA, DVI-D and HDMI with triple-view supported*5 SATA-600 with RAID 0/1/5/10*6 USB 3.0 and 7 USB 2.0
