Discrete Semiconductor
semiconductor typically having one circuit.
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Signal, Module, Receiver, CASS, 210 Position, Discrete Wiring
510113125
Module, Receiver, Cass, Signal, 210 Position, Discrete Wiring
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Metrology Solutions for Semiconductors
Bruker Semiconductor develops, manufactures, markets, and supports metrology solutions for thin films, which are based on novel, rapid, non-contacting and non-destructive X-ray technology. With Bruker’s acquisition of Jordan Valley Semiconductors, a name synonymous with unparalleled worldwide customer service and support, 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation thin films. Bruker commitment to innovation and technology leadership drives the continued release of new advancements in metrology, and has garnered numerous awards and industry recognition. In applications ranging from C-S thin films materials characterization to wafer substrate analysis and defect detection, Bruker’s systems provide simulation analysis and fit. HRXRD, XRR, WA-XRD, and XRDI measurement types are fully supported, enabling researchers, production engineers, and process developers unparalleled capabilities. Whether you are a semi and C-S fabricator, R&D center or academy, or an industry materials research facility, Bruker has a specifically designed solution for your metrology needs.
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Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
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Discrete Input Event Recorder
Wabtec M Series Recorders provide a compact recording solution for discrete electrical and pneumatic signals and provide compliance to FRA Crash Hardening requirements.
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Semiconductor Interconnect
Materials that are usable in all backend BI/reliability applicationsHigh IO count capabilityFine pitch down to 0.25 The industry’s smallest DDR4 and DDR5 socket outlineAdvanced plating technologies and custom outlines
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32-CH Discrete Output Module
HSL-DO32-M-N/HSL-DO32-M-P
Slave ID consumption: 2 consecutive from odd"N" type for NPN sinking type outputSwitch capacity: Single channel 500 mA; all channels 60 mA at 24VDCPhoto couple isolation voltage: 2500 VrmsResponse time: ON→OFF: 180µs, OFF→ON :1.2µsLED indicator: Power, Link and Output statusPower supply: +10V to +30 VDCOperating temperature: 0 to 60°C
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Semiconductor Tester
5000E
Current Ranges:Standard: 2.0nA – 50AUp to 100A with Mainframe ExtensionVoltage Ranges:Standard (anode): 10mV – 1000V2000V with 2kV Anode OptionStandard (gate): 10mv – 20V80V with 80V Gate Option
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Semiconductor Package Inspection System
NIDEC-READ GATS (Grid Array Testing System) series carry out open/leak circuit tests on semiconductor package (MCM/CSP/BGA).
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Semiconductor Authenticity Verification & Anti-Counterfeiting
JTAG Interrogator
Top manufacturers have used JTAG tests for years to ensure electronic systems are free from defects and assembled correctly. With growing uncertainty in supply chains and the proliferation of counterfeit components, that same technology can be used to verify the authenticity of system components.The Corelis JTAG Interrogator is an affordable solution for semiconductor verification. The software and hardware system provides the means to quickly identify components on an assembled electronic product by reading available information from the JTAG chain. Components can also be scanned to discover undocumented opcodes that may indicate hidden JTAG capabilities such as backdoors and harmful or malicious functions.Fast and nonintrusive JTAG component identification has never been so easy.
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Emulates Dallas Semiconductors DS89C420
FE-C420
* Emulates Dallas Semiconductors DS89C420 * 16K Code Memory * Real-Time Emulation * Frequency up to fmax at 3V and 5V * ISP Support * MS-Windows Debugger For C And Assembler * Emulation Headers and Signal Testpoints * Target Board and Programmer Included * Serially Linked to IBM PC at 115Kbaud
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Module, Receiver, RTCASS, Signal, 210 Position, Discrete Wiring
510113146
Module, Receiver, RTCASS, Signal, 210 Position, Discrete Wiring.
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Impulse Semiconductor High Current Integrated
Transmission Line Pulse Test System
The Impulse Semiconductor High Current Transmission Line Pulse (TLP) test system is the tool of choice for extracting ESD parameters for transient protection devices in a package, or at wafer level. With accuracy better than 100 milliohms at 40 amps peak current, the Impulse high current TLP is specially tailored to the needs of today's ESD device designers who must accurately measure low values dynamic resistance irrespective of breakdown voltage.
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Signal, Module, ID, CASS, 210 Position, Discrete Wiring
510114106
Module, ID, Cass, Signal, 210 Positions, Discrete Wiring
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Spread Resistance For Slanting Polished Sample Of Semiconductor By Tow Kinematically-mounted Probe Contacting .
SRS-2010
*Resitivity map along with depth direction, thickness of epitaxial , depth of PN junctin and carier density profiles
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Semiconductor Technology, Micro Scriber + Meters For Contact Angle And Surface Tension
SURFTENS WH 300
Optik Elektronik Gerätetechnik GmbH
The leading equipment for professional use in 200 and 300 mm wafer processing in semiconductor technology. SURFTENS WH 300 is equipped with a 3 axis wafer robot, wafer scanner, loadport for 200 and/or 300 mm wafers, fan filter unit, notching system. Suitable for any cleanroom class it features the automatic mapping of contact angles on wafers for up to 25 wafers.New: with SECS/GEM Interface!
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Compound Semiconductors
GaAs and InP substrates
Sumitomo Electric Industries, Ltd.
GaAs substrates (compound semiconductors) are used for smartphone power amplifiers and switches, LEDs (illumination, decoration, indicators), and solar cells. InP substrates are used for optical communication modules, etc.
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Semiconductor Relays
Panasonic Industrial Devices Sales Company of America
Panasonic Semiconductor Relays are categorized into two types: PhotoMOS® and Solid State Relays (SSRs).
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Switch Modules - 16 Single Pole, Form A, Discrete Relays Which are Wired & Controlled Individually
JX16/KA
This module has 16 single pole, Form A, discrete relays which are wired and controlled individually. The relays can be externally wired to make any configuration needed. Use as individual ON/OFF relays or use them to drive external relays, solinoids, or any external device. It is available with Type S or M reed relays.
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OEM DC Power System For Semiconductor
AMETEK Programmable Power, Inc.
*Single Package 6-Pack of 600W power supplies*Complete self-contained controller operates independently once pre-set*Capable of ramps and sequences*Capable of inter-channel dependent operation*DeviceNet Interface*Solid State polarity switching
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Semiconductor Test System
TS-960e
The GENASYS Semi TS-960e PXI Express Semiconductor Test System is an integrated test platform that offers comparable system features and capabilities found in proprietary ATE systems. Available as a bench top system or with an integrated manipulator, the TS-960e takes full advantage of the PXI architecture to achieve a cost-effective and full-featured test solution for device, SoC and SiP test applications.
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Semiconductor Packaging System
Inspects the quality of finished cells by measuring the gap between the battery electrode laminate and aluminum can.
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Module, Receiver, RTCASS, Coaxial, 64 Position, Discrete Wiring or Side PCB Mount
510113142
Module, Receiver, RTCASS, Coaxial, 64 Position, Discrete Wiring or Side PCB Mount.
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Data Communications And Semiconductor Device Related Products
Using our original micro springs and MC probes, these are highly durable products that are also lead-free. It is used for inspection of finished semiconductor products.
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Semiconductor Technology, Micro Scriber + Flatness, Bow, Warp, Curvature, Glass Thickness
FLATSCAN
Optik Elektronik Gerätetechnik GmbH
Non contact automated 2D- or 3D measurement of warp, bow, slope and surface curvature with software module for calculation of thin film stress (wafer stress) of wafers and glass substrates.
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Semiconductor Equipment Manufacturers
Integrated Dynamics Engineering
With shrinking process geometries, new structural elements and a major increase in substrate size, the challenges to improving process yield and overall throughput have increased exponentially. These demands drive a stringent requirement for system stability and overall immunity from internal and external forces.
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Semiconductor Testing Equipment
We provide you with various inspection equipment mainly for the semiconductor post-production process. Also, "inspection boards", "measurement control" and "test applications" are available for you to meet your various needs.
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Comprehensive Suite of Software Tools for Semiconductor Test Applications
ICEasy Test Suite
Marvin Test Solutions' ICEasy Test Suite is supplied with both the TS-900 and TS-960 semiconductor test platforms and provides a comprehensive set of software tools - facilitating the development and debugging of test programs for semiconductor devices. In addition the suite includes I-V curve and Shmoo plot tools for analyzing a device's DC and AC characteristics. The complete suite of tools interfaces seemlessly with Marvin Test Solutions' ATEasy®, a test executive and test development evironment which is supplied with each TS-900 / TS-960 system.
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Semiconductor Test Platform
Diamondx DxV
The Diamondx DxV semiconductor test system provides full ATE performance in a desktop PC footprint. Fully integrated, ultra-compact test system designed to be used in the engineering lab or office. Unlike traditional semiconductor tester solutions that is no mainframe, separate workstation or support cabinets needed. The Diamondx DxV is completely stand-alone, so it can be placed on a bench or desktop:
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Combination Module: 2 Ch. MIL-STD-1553 & 12 Ch. Discrete I/O
CM8
The CM8 module is a combination of NAI's MIL-STD-1553B module, FTB, and Enhanced Discrete I/O module, DT4. The CM8 offers twelve channels of discrete I/O and two channels of MIL-STD-1553B communications. The twelve discrete I/O channels are programmable as either input (voltage or contact sensing with programmable, on-module pull-up/pull down current sources), or output (current source, sink, or push-pull) up to 500 mA per channel from an applied, external 3-60 VCC source. The discrete I/O channels also provide additional functionality modes such as Pulse Width Modulation (PWM) output mode and Pattern Generator output mode. The two MIL-STD-1553B communications channels feature a dual, redundant, balanced-line, physical layer; a (differential) network interface; time division multiplexing; half-duplex command/response protocol; and up to 31 remote terminals (devices).
