Discrete Semiconductor
semiconductor typically having one circuit.
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Product
Semiconductor Technology, Micro Scriber
Precision Micro Diamond Scriber MR200
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Optik Elektronik Gerätetechnik GmbH
Precision micro diamond scriber MR 200 for exact manual scribing for defined cutting of structured silicon wafers.
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Product
Smartchem Discrete Analyzers
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Fully automated, multi-parameter, direct read discrete analyzers, available in bench-top or floor-stand models, for simple and automated chemistries. Up to 200 samples and up to 600 tests/hour.
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Product
Semiconductor Test
Ismeca NY20
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20-position turret platform for semiconductor test, inspection and packaging, provides the highest quality yield and throughput. It integrates innovative hardware and software technology such as Intelligent Features that enable extended autonomous operation and productivity.
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Product
PXI Semiconductor/IC Test System
Test System
A high-density 100MHz PXIe digital IO card designed for characterizing, validating, and testing a variety of digital and mixed-signal ICs. Each IO card consists of a Sequencer Pattern Generator (SQPG) and 32 channels of full ATE-like features. The 33010 IO card is expandable up to 256 channels. Some unique features of the 33010 include an on-board SQPG, per pin timing/levels/ PMU/TFMU, multiple time domains, and multithreaded testing for complex IC testing. Each channel is also equipped with 64M vector memory, 16 timing sets with on-the-fly timing change, and per pin timing and frequency measurements up to 400 MHz.
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Product
Semiconductor
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You can find Spring probes used for test process for production of semiconductor here. Spring probe is probe with spring inside and is also called Double-ended probe and Contact probe. It is assembled in IC socket and becomes electronic path, which vertically connects Semiconductor and PCB. By our excellent machining technique, we can provide spring probe with low contact resistance and long life. “MARATHON” series is our standard lineup of spring probe for testing semiconductor.
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Product
Power Discretes
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Our power discrete products are high-quality solutions for a wide range of high-voltage and high-power applications. They include a variety of high-voltage Switch Mode Power Supply (SMPS) transistors—Insulated-Gate Bipolar Transistors (IGBTs) Silicon Carbide (SiC) MOSFETs and Silicon MOSFETs—Diodes and Radio Frequency (RF) MOSFETs. Many of our products are offered in single- and combi-packaged options across a variety of voltage ratings, currents, and package styles.
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Product
Semiconductor
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Engineered ceramics are used in the semiconductor industry because of their excellent material properties. Ultra-pure ceramics are often used in the whole cycle of semiconductor manufacturing including Semiconductor Wafer & Wafer Processing, Semiconductor Fabrication (Front End), and Semiconductor Packaging (Back End).
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Product
Discrete Input Event Recorder
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Wabtec M Series Recorders provide a compact recording solution for discrete electrical and pneumatic signals and provide compliance to FRA Crash Hardening requirements.
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Product
Semiconductor Wafer Microscope Inspection System
MicroINSPECT
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MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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Product
Semiconductor Test
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Smiths Interconnect’s test socket and probe card solutions utilize IDI contact technology to ensure superior quality and reliability in semiconductor test applications. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms.
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Product
Hi-Speed Discrete Test System
QT-6000
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QT-6000 Test System, with built-in capacitance test (DC+CAP) and Scanbox etc, is applicable to devices like medium & small power transistors, MOS-FET, diodes and Wafer.
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Product
Semiconductor
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Semiconductor technology requirements often outpace the test coverage that traditional ATE provides for analog, mixed-signal, and RF test. Semiconductor test engineers need smarter solutions that address cost, scalability, design, and device challenges.
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Product
Semiconductor Testing
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Teradyne’s semiconductor test portfolio is transforming the way you test chipsets for automotive, industrial, communications, consumer, smartphones, and computer and electronic game applications. Semiconductor devices span a broad range of functionality, from very simple low-cost devices such as appliance microcontrollers, operational amplifiers or voltage regulators to complex digital signal processors and microprocessors as well as memory devices.
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Product
Discrete C-Size Switch Cards
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Compatible for use on VXI platforms, these switch products were formerly sold under the Racal Instruments brand name.
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Product
Semiconductor Device Testers
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are particularly suitable for certain semiconductor test requirements, but other models may also be of interest. Our knowledgeable application engineers can guide you to the most suitable model.
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Product
Semiconductor Testing
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The integrated PXI platform and the open interfacing provides extension capabilities for additional testing requirements like DUT specific resistors-networks or temperature sensors. The Test System comes with the ready-to-run GTSoftware package and allows easy programming of test sequences (GTbuilder) and fast execution in production/test mode (GTengine).
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Product
Discrete Module for Multi Protocol 4000 Boards
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Discrete Module for Multi Protocol 4000 BoardsThe M4KDiscrete is an interface module for the multimode, multiprotocol Excalibur EXC-4000 family of carrier boards. The M4KDiscrete provides a complete solution for developing and testing discrete voltage-level interfaces.The module contains control I/O registers that may be accessed in real time. The module supports 20 discretes. The user can set each discrete:• Either as input or output.• Either to TTL (0 – 5V) or Avionics (0 – 32V) voltage levels and• Either enable or disable external debounceOutput discretes are open collector, capable of handling up to 32V with a maximum current of 100 mA each. There is a 4092 word FIFO, capable of storing 1023 Discrete entries containing the discrete data and Time tags.
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Product
Manual Semiconductor Metrology System
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Front USB port enables easy storage of measurements and other data to flash drivesMTI Instruments’ Proprietary Capacitance Circuitry for Outstanding Accuracy and DependabilityNon-contact measurements76-300 mm diameter wafer rangeOptional wafer measurement ringsWafer stops for exact centeringEthernet interfaceFull remote control software (Windows compatible)Optional calibration wafers
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Product
Protective Cover, 9050, VXI and Discrete Wiring, Receiver
310113285
Protective Cover
When the Receiver is not in use, the Protective Cover is used to protect the modules and contacts. The Protective Cover is made up of black anodized aluminum.
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Product
RTM Discrete Signal Conditioning Board
MS 3632I
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CPCI Rear IO Discrete Signal Conditioning Board is a signal conditioning and interface board for CPCI based Advance Compute & IO Module (MS3639i). This board primarily focusing on signal conditioning of TTL/CMOS DIO levels to required type of discrete input and output interface. Digital IO from ACIO board to discrete IO at Rear IO interface. Board takes 144 DIO from ACIO and does Open/Ground, 28V/Open, 28V/Ground configuration. In addition it shall generate additional 32 discrete input / output signals with signal conditioning and all IO interfaces are brought to two 96 Pin Euro Connector.
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Product
Semiconductor
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The semiconductor industry faces continuous pressure to reduce device size and costs while improving performance and reliability. Semiconductor, test and assembly automation manufacturers demand the same improvements from the motion technology which drives it. Haydon Kerk Pittman continues to develop new technologies in motors, lead-screws, gears, encoders, actuators, slides, drives and complete sub-systems that increase operational speeds and accuracy while lowering the cost of ownership.
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Product
32-CH Discrete Input Modules with U Profile
HSL-DI32-UD
Digital Input Module
HSL U series is designed as compact & horizontal-placed slave module. For I/O module, ADLINK adopts three types of connectors to meet different users' requirements & habits. Compared with past models, U series brings compact size, easier-to-wire and cost-effective advantages for users. DI/O, AI/O and motion control module are supported
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Product
Semiconductor Packaging System
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Inspects the quality of finished cells by measuring the gap between the battery electrode laminate and aluminum can.
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Product
32-CH Discrete Output Daughter Board Module
HSL-DO32-DB-N
Digital Output Module
*Slave ID consumption: 2 - N: for 32-CH NPN sinking type outputs*Photo couple isolation voltage: 2500Vrms*Output switching capacity: Single channel 500mA; all channels 60mA at 24VDC*Output response time:ON OFF: 180µs, OFF ON: *1.2µsTerminal Base:HSL-TB64 or HSL-TB32U-DIN
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Product
Semiconductor
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Aerotech has a long history of engineering and manufacturing motion systems and components for high precision wafer processing, scanning electron microscopy (SEM), wafer bumping, 450 mm wafer manufacturing, lithography equipment and advanced laser micromachining. We also specialize in systems and components for vacuum applications, such as EUV lithography. So whether you need off-the-shelf wafer bumping components or a custom-engineered SEM system manufactured and tested to exacting specifications, Aerotech can provide the optimal solution for your application.
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Product
Dissolved Oxygen Concentration Monitor Series for Semiconductor Manufacturing
HD-960LR
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Ideal for measuring dissolved oxygen concentration in Wet Process from Front-end of Line to Back-end of Line.By adopting a chemical resistant sensor, it is possible to support a wide range of dissolved oxygen concentration measurements from facility to process usage.
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Product
68-Pin SCSI Micro-D Male Discrete Wire
40-962-068-M
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This connector is designed to allow users to directly terminate with IDC connections to the 68-Pin SCSI Style Micro D connector. Pickering Interfaces recommends the use of purchased cable assemblies for applications where most or all of the contacts are in use.
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Product
Emulates Dallas Semiconductors DS89C420
FE-C420
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* Emulates Dallas Semiconductors DS89C420 * 16K Code Memory * Real-Time Emulation * Frequency up to fmax at 3V and 5V * ISP Support * MS-Windows Debugger For C And Assembler * Emulation Headers and Signal Testpoints * Target Board and Programmer Included * Serially Linked to IBM PC at 115Kbaud
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Product
32-CH Discrete Input Modules
HSL-DI32-M-N/HSL-DI32-M-P
Digital Input Module
- Slave ID consumption: 2 consecutive from odd- "N" type for NPN sinking type sensor or dry contact; "P" type for PNP sourcing type sensor or wet contact- Photo couple isolation voltage: 2500 Vrms- Input impedance: 4.7 KΩ- Input current: ± 10 mA (Max), ± 12.5 mA (Peak)- Input voltage: ± 40 V (Max)- LED indicator: Power, Link and Input status- Power supply: +10 V to +30 VDC
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Product
Semiconductor
DieMark
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DieMark Inking Systems are available in Electric and Pneumatic models and utilize convenient, disposable DieMark Ink Cartridges to streamline and optimize the process of marking defective die. With models available for nearly every test platform and configuration, Xandex inking systems are in operation daily in every corner of the world where wafer sort is performed.
