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Product
Asynchronous System Level Test Platform
Titan
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The Titan System Level Test (SLT) platform delivers maximum flexibility, scalability and density in semiconductor test environments that require the highest levels of system performance testing. Titan is Teradyne’s solution for high-volume mobile application processor SLT requirements.
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Product
System Level Test and Burn-in Solutions
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System Level Test (SLT) is a paradigm shift from traditional structural and functional testing. The device is tested in a complete, integrated system to evaluate its compliance against specified requirements. The system approach allows for higher and more cost-effective test coverage especially for multi-function and non-deterministic devices. It also brings new integration and test challenges like: ..Designing test fixtures on Burn-in Boards with system components ...
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Product
DRAM Module Test
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We provide our customers with Automated SLT (System Level Test) Solutions for DRAM Module HVM test. Our solution gives our customers the best possible combination of technologies for the best performances and manufacturing effiencies - increasing yield, reducing cost of ownership and accelerating time-to-market.
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Product
Systems Integration for Circuit Card Assembly
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Teledyne Advanced Electronic Solutions integrates CCAs and other sub-assemblies, cables and fabricated parts into system modules shipped directly to customers for integration into their products.- Box Build: custom built to order system solutions- High complexity box assemblies and subsystems- High frequency RF box assemblies and subsystems- Full functional RF testing up to 26 GHz (K band)- Multi-level systems integration – build and test modules and CCAs and integrate into higher level assemblies- Custom cell design for customer subsystems- Special bonding processes including thermal management and vibration- Robust torque and FOD control programs- System level testing including functional, vibration and thermal- Complex harness fabrication and integration- Fiber-Optic and RF waveguide integration and testing- Large system capacity in excess of 200 lbs.- Configure to order – Integrate different options, firmware, configurations, etc across a single order as required
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Product
Test & Test Development for Circuit Card Assembly
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Teledyne Advanced Electronic Solutions performs comprehensive testing at the CCA and system level assembly. Teledyne AES can perform testing developed by the customer or develop a complete test strategy for the customer’s products.- Bed of Nails FixtureIn-Circuit Test (Bed of Nails) or Flying Probe Testing for rapid feedback on CCAs- Functional testing of CCAs or complete systems- Environmental testing to include vibration, thermal cycling, HASS, etc.- CCA and system level test development- High frequency testing – currently to 40 GHz- High power system testing – currently to 4kW
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Product
System Testing
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TestOrigen Software Testing Services Pvt Ltd.
System testing is basically a sequence of various test performed to check the whole computer-based system. The key objective of system testing is to confirm the system level testing should meet the user’s viewpoint.
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Product
Semiconductor Test
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Smiths Interconnect’s test socket and probe card solutions utilize IDI contact technology to ensure superior quality and reliability in semiconductor test applications. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms.
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Product
±6 kV ANSI/ESDA/JEDEC HBM Test System
HBM-TS10-A
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High Power Pulse Instruments GmbH
*±6 kV Human-Body-Model (HBM) tester according ANSI/ESDA/JEDEC JS-001 standard with C = 100 pF, R = 1.5 kΩ discharge network*Wafer, package and system level HBM testing*True HBM: the classical discharge network of the HBM-S1-A according the standard ensures compliant waveforms for all load conditions*No trailing pulses*Integrated 10 kΩ charge removal resistor*Integrated DUT HBM current sensor for real time transient current monitoring with 1V/A output sensitivity into 50 Ω digital oscilloscope input*Integrated DUT HBM voltage sensor for real time transient voltage monitoring with 1/200V/V output sensitivity into 50 Ω digital oscilloscope input*Integrated overvoltage protection of the DUT voltage sensor, DUTcurrentsensor and DC test interface for efficient overload protection of the digital oscilloscope and SMU during high voltage HBM testing*Integrated DC test DUT switch with automatic switch control*Integrated 50 Ω precision hardware trigger output for high speed digital oscilloscopes*Fast HBM measurements, typically 0.5s per pulse including one-point DC measurement between pulses*Eficient sofware for system control and waveform data management (fully compatible with TLP measurement data)*The sofware can control automatic probers for fast measurements of complete wafers*Compact size 145 mm x 82.5 mm x 44 mm of the integrated HBM pulse generator probehead*System controller size 483 mm x 487 mm x 133 mm*High performance and high quality components*Optionally available hardware upgrades to all HPPI fully integrated HBM/HMM/TLP/VF-TLP test systems TLP-3010C, 4010C, 8010A, and 8010C
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Product
ECM PCB Tester
MS 1105
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*Used for testing of DAWN RWR PCBs in Jaguar Aircraft*19” Rack mountable with built-in wide range of IO signals *Used in 4th line servicing of PCBs*Used in LRU and system level testing*Detects 100% fault coverage including track faults*Adaptability with off-the-shelf instruments
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Product
Distributed Test Manager
DTM
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The Distributed Test Manager (DTM) is a Windows™ application which enables many different types of system level testing by simulating multiple devices in a system. DTM is a system level simulator that is unique compared to other Triangle MicroWorks tools which test the communications of a single device. DTM is a highly extensible tool with multiple options for configuring devices, creating test cases, and simulating data in the system.
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Product
Device Testing
S-TEST Lab
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SPEKTRA Schwingungstechnik und Akustik GmbH Dresden
S-TEST Lab solutions have been tailored for system level testing in development and lab environments. The core component is the S-TEST desk system. It combines a compact design with the full test interface, that enables the developer to react flexible on changing requirements already in early project phases and to also verify product performance parameters.
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Product
Motion Simulator For Test Systems
Metis
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METIS is a motion simulator for sensor and end system level testing. Configurable design allows you to create system you need! - 1-axis rate table for gyro testing - 2-axis unit for 6DOF accelerometer and gyroscope testing - 3-axis Gimbal system for simultaneus Yaw, Pitch and Roll stimulus.
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Product
System Level Test
SLT
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As technology nodes continue to evolve and with a more aggressive time to market to bring devices to their end applications, full test coverage of such chips is possible only with System Level Testing.
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Product
Memory Test System
T5221
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The T5521 is a memory test system that supports wafer test and wafer burn-in test of non-volatile memory devices such as NAND flash, housed within a multi-wafer prober to reduce test floor footprint.
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Product
HV Test System for Patient Monitors
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HV test enclosure for testing medical products (patient monitors). Insulated test booth with large space for DUT.3 different test nests for adapting different devices.Displays from patient monitors are checked. For this, insulation tests and leakage current measurements must be carried out. Ensuring the standard-compliant test. For the safety of the operating personnel, the test cell is electrically locked while the high voltage measurement is active.
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Product
Fully-Automated CTIA-Compliant OTA Test System
TS8991
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The R&S®TS8991 OTA performance test system measures the spatial radiation and sensitivity characteristic as specified by CTIA and 3GPP.The system software provides ready-to-use test templates for OTA measurements and supports all wireless standards.The integrated report function collects all measured test data such as graphics or numeric results, test environments, EUT information and hardware setup in one document.
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Product
Scienlab Battery Test System — Cell Level
SL1002A
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Test System with up to 36 Channels.The Keysight SL1002A provides sink and source with 0 to 6 V, 100 to 600 A, 0.6 to 3.6 kW and 36 channels for battery cells.
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Product
CPE Design Verification System
Jupiter 310
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Jupiter is the industry standard for automated DOCSIS physical (PHY) layer testing. It provides the most comprehensive test coverage and accurate results on the market for DOCSIS 3.1 devices.
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Product
Scienlab Battery Test System – Pack Level, 110 KW Compact Version
SL1710A
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Compact solution for testing Battery Packs with output power up to 110 kW and voltage range up to 1500 V
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Product
VLSI Test System
3380P
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The 3380D/3380P/3380 test system have 4 wires HD VI source and any-pins-to-any-site high parallel test (multi-sites test) functions (512 I/O pins to test 512 ICs in parallel) that can meet the upcoming higher IC testing demands.
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Product
Mini LED Backlight Module Automatic Optical Test System
7661-K003
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Chroma 7661-K003 Mini LED Backlight Module Automatic Optical Test System contains a 71803-2 2D color analyzer to measure chromaticity and brightness
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Product
Memory Test System
T5830/T5830ES
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Highly flexible tester which has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories
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Product
HV Test System up to 20000 Volt
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Insulated test booth with large space for test items. 2 banana sockets for AC connection and 4 banana sockets for the DC connection of the DUTs. IC’s are tested in a long-term test. These are checked in an oil bath so that there are no air gaps to reduce the insulation. Maximum voltage 20 kV. Therefore, insulation tests must be carried out. Ensuring the standard-compliant test. For the safety of the operating personnel, the test cell is electrically locked while the high voltage measurement is active.
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Product
Test System for Detecting Exact PCB Short Circuit Locations
QT25
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Qmax Test Technologies Pvt. Ltd.
QT25 employs a unique method to detect exact PCB shorts circuit locations and pin down the shorted components and tracks. It is designed in such a manner that it precisely detects exact short circuit locations across VCC - GND or a shorted component connected across a Bus or hair-line shorts between PCB tracks, Which is highly impossible to detect using conventional tools especially when they are connected parallel in circuit. It can also be used in measuring the contact resistance of switches and relays in its milli-ohm mode as a value add.
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Product
Memory Test Systems
T5503HS2
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Semiconductor memories are in high demand to meet the needs of fast-growing end markets such as portable electronics and servers. It has been forecasted that applications ranging from mobile devices and data centers to automobiles, gaming systems and graphics cards will consume an estimated 120 billion gigabits of DRAM capacity. To meet this market demand, new generations of memories with data-transfer speeds of 6.4 Gbps and higher are being developed. Advantest’s second-generation T5503HS2 tester is designed to handle these ultra-high-speed memory ICs.
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Product
Laser Diode Burn-in Reliability Test System
58604
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The Chroma 58604 is a high density, multi-function, and temperature controlled module for laser diode burn-in and lifetime tests. Each module has up to 256 SMU channels which can source current and measure voltage in various control modes as described below.
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Product
VLSI Test Systems
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50/100 MHz clock rate50/100 Mbps data rate1024 I/O pins (Max :1280 I/O pins)Up to 1024 sites Parallel testing32/64 M pattern memoryVarious VI sourceFlexible HW-architecture (Interchangeable I/O, VI, ADDA,)Real parallel trim/match functionTime & frequency measurement unit (TFMU)High-speed time measurement unit (HSTMU)AD/DA test optionSCAN test option (max 1G M/chain)ALPG test option for embedded memorySTDF tools supportTest program/pattern converter(J750, D10, V50, E320, SC312, V7, TRI-6020, ITS9K)User friendly windows 7 environmentCRAFT C/C++ programming languageSW (Software) same as 3380P & 3360P
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Product
SoC Test Systems
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Specifically designed for high-throughput and high parallel test capabilities to provide the most cost-effective solution for fabless, IDM and testing houses. With the full functions of test capability, high accuracy, powerful software tools and excellent reliability, 3650-EX is ideal for testing consumer devices, high-performance microcontrollers, analog devices and SoC devices.
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Product
Scienlab Battery Test System – Pack Level, 330 KW
SL1740A
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Keysight’s SL1700A Scienlab Battery Test System – Pack Level Series allows to realistically emulate the environment of the future battery pack application in order to test the high-power battery pack comprehensively and improve its functions and safety. The growing demand of e-mobility increases the need of vast battery test labs for EV battery development. Keysight developed the SL1700A Series to accelerate the development and validation of batteries. It offers a voltage range of up to 1500 V and power options between 100 and 300 kW including a Performance Bundle to increase the power up to 330 kW. The new high-voltage SiC (silicon carbide) technology provides a high energy efficiency on a small footprint and helps to minimize your operating costs.
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Product
Photodiode Burn-in Reliability Test System
58606
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The Chroma 58606 PD/APD Burn-in system is a high density, multifunction and temperature controlled module based system for photo diode burn-in and lifetime test. Each module has up to 256 Source Measurement Unit channels which can source current and measure voltage in various scenarios such as one described below. The system can accommodate 7 modules for a total of 1,792 device channels.
