Common Core
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Product
PXI/PXIe RF Multiplexer, Single 4-Channel, Terminated Common, 3GHz, 50Ω, MCX
40-876A-101
Multiplexer Module
The 40-876A-101 (PXI) and 42-876A-101 (PXIe) are 50 Ohm 4 to 1 RF multiplexers with 1 bank in a single slot. Additionally, extra switching allows the common connection to be terminated into 50 Ohm, maintaining signal integrity. The module exhibits low insertion loss and VSWR through the use of modern RF relay technology at an affordable cost.
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Product
Intel® Core™ / Celeron® Embedded Controller
AMAX-5580
Embedded Controller
Optimized BIOS & Embedded OS for 1ms real-time control (Windows and Linux)Achieve 64-axis motion control with 1ms EtherCAT cycle time under Windows (applies to AMAX-5580 Core i processor)OPC UA and Modbus TCP/RTU as IT connectivity enabled by CODESYSEtherCAT, PROFIT, Ethernet I/P, CANopen as OT connectivity enabled by CODESYSUnlimited I/O points, fieldbus networks, and visualization variables for CODESYS applicationsCODESYS Visualization (Target and Web), SoftMotion and CNC/Robotics support by different packageAdvantech Data Connect (ADC) Library provides flexible and highly efficient data connection with 3rd party application software through symbols (PLC Handler) & shared memory (C++/C#)Intel® Core™ i7/i5/Celeron® with 8GB/4GB DDR4 memorySystem I/O with 2 x GbE, 4 x USB 3.0, 2 x COM, 1 x HDMI, 1 x VGA, 1 x 7 pin terminal (dual power input with alarm output)
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Product
Mini-ITX Embedded Board with 8th/9th Gen Intel® Core™ Desktop Processor
AmITX-CF-G
Motherboard
Targeted at gaming customers and system integrators, AmITX-CF-G is a Mini-ITX board specially designed for Gaming. AmITX-CF-G features GLI compliance, easy and flexible configuration, security enhancements, and system resilience. The values of AmITX-CF-G include amplified visual impact, guaranteed system integrity, secure transactions with fast TTM and low TCO, and maximized system uptime. AmITX-CF-G can satisfy application function requirements and meet GLI certification which cannot be offered by other conventional Mini-ITX boards.
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Product
Intel® Core™ Ultra 7/5 Processors AMR Control System
AFE-R760
Computer-on-Module
Intel® Core™ Ultra 7/5 Processors, up to 16 Cores, TDP 28W. Dual Channel DDR5-5600, up to 96GB. Support 4x GMSL through 120pin B2B connector.Dedicate I/Os for AMR: 3x 2.5GbE, 2x USB-C, 2x USB-A, 4x COM, 2x CAN-FD, 8-bit GPIO.
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Product
3U CompactPCI 9th Gen Intel® Xeon®/Core™ i7 Processor Blade
cPCI-3520 Series
Processor Blade
The cPCI-3520 Series is a 3U CompactPCI blade available in single-slot (4HP), dual-slot (8HP) or triple-slot (12HP) width form factors with various daughter boards to provide a broad range of I/O requirements. Faceplate I/O in the single-slot (4HP) version includes 1x DVI-I, 2x GbE and 1x USB 3.0 port (these I/O are common to all versions). Faceplate I/O in the dual-slot (8HP) version includes additional 2x USB 2.0, 1x COM, 1x KB/MS and Line-in/Line-out on the cPCI-3520D or additional 2x DisplayPorts, 1x COM in RJ-45 connector, 1x KB/MS and 1x additional USB 2.0 port on the cPCI-3520G. Two more dual-slot options are the cPCI-3520L with additional 2x GbE, 1x COM and 2x USB and the cPCI-3520M with one 100-pin high density connector supporting additional 2x DVI-D, 2x USB 2.0, 2x COM, 2x KB/MS and Line-in/Line-out ports.
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Product
Metal Cored PCB
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Teledyne Labtech is at the forefront of complex metal-cored PCB design and manufacture. The PCB use a thin metal core <2 mm, which acts as isolation between the RF/Microwave circuit and the Analogue/Digital circuitry and creates an excellent thermal path.The major advantages are reduced size and no need for complex microwave feed-thru's. The ability to laser cut pockets allows the designer engineer to mount the high power MMIC directly on to the metal core.
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Product
19" Fanless Panel PC With 13th Gen Intel® Core™ Processors (I7/i5/i3)
PPC-319S RPL
Panel PC
True-flat touchscreen with Industrial-grade LCD panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware security
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Product
3U Intel® Core™ i7-4700EQ Quad-Core Processor-Based PXI Express Controller
PXIe-3985
Controller
The ADLINK PXIe-3985 PXI Express embedded controller, based on the fourth generation Intel® Core™ i7 processor is specifically designed for hybrid PXI Express-based testing systems, delivering maximum computing power for a wide variety of testing and measurement applications.
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Product
Core I7 Processor AMC With PinoutPlus, PCIe
AMC728C
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The AMC728C is a Processor AMC (PrAMC) in a double module, mid-size AdvancedMC (AMC) form factor based on the Intel next generation Core i7 Processor (Haswell) with QM87 PCH. The module follows AMC.1 (PCIe), AMC.2 (GbE) and AMC.3 (storage) specifications.
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Product
3U i7 Quad Core, 2.4 GHz Processor cPCI Express Controller
GX7945
Controller
The GX7945 is a single-slot embedded cPCI Express 3U controller for use with Marvin Test Solutions' PXI Express chassis. When combined with the embedded storage peripherals which are integrated into PXIe chassis, the controller / chassis offers a compact, high performance, and integrated test platfrom solution.
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Product
Ultra Compact, Uncooled Thermal Imaging Core
Dione 1280 OEM Series
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The Dione 1280 OEM series is based on an uncooled 12 μm pitch microbolometer detector with a 1280 × 1024 resolution. The NETD is less than 40 mK (available upon request) or 50 mK.The cores are optimized for low SWaP (Size, Weight and Power). The overall size of the OEM core is 35 x 35 x 23.5 mm3 and weight is 27 gr. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione 1280 versions have the same SAMTEC ST5 connector and are GenICam compliant. The ultra-compact Dione 1280 OEM series find application in safety and security systems, as well as in industrial thermal imaging systems.
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Product
Embedded Real-Time Robotic Controller with 11th Gen Intel® Core Processor
ROScube Pico TGL
Robotic Controller
ADLINK’s ROScube Pico TGL is a real-time ROS 2 enabled robotic controller based on the 11th Gen Intel® Core™ i7/i5/i3 processors with Intel® Iris® Xe Graphics featuring exceptional I/O connectivity and supporting a wide variety of sensors and actuators for unlimited robotic applications. The ROScube Pico TGL supports the full complement of resources developed with ADLINK Neuron SDK. Bundled with AI features and capabilities and developed with the Intel® distribution of OpenVINO™ toolkit, the ROScube Pico TGL is a perfect platform for industrial service robot applications such as autonomous mobile robots (AMR) and autonomous mobile industrial robots (AMIR).
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Product
Ka-Band Silicon SATCOM Tx Quad Core IC
AWMF-0109
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The AWMF-0109 is a highly integrated silicon quad core chip intended for satellite communications transmit applications. The device supports four dual polarization radiating elements with full programmable polarization flexibility. The device provides 22 dB of gain per channel with an output power of +12 dBm per element per polarization. Additional features include gain compensation over temperature, temperature reporting, and Tx output power telemetry. The chip features ESD protection on all pins, operates from a +1.8 V supply, and is packaged in a 48 lead 6x6 mm QFN for easy installation in planar phased array antennas.
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Product
3U Intel® Core™ i7-2715QE 2.1 GHz Quad-Core Processor-based PXI Controller
PXI-3980
Embedded Controller
The ADLINK PXI-3980 PXI embedded controller, based on the second generation Intel® Core™ i7 processor is specifically designed for hybrid PXI based testing systems, delivering a rugged yet stable platform for a wide variety of testing and measurement applications.
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Product
Compact Size Tower IPC With 12th / 13th Gen Intel® Core
IPC-320
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Compact Size Tower IPC with 12th / 13th Gen Intel® Core™ i CPU Socket (LGA 1700) and 250W PSU. Intel® 12th / 13th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with H610E chipset. Design for operator IPC and application with space limit, Dual USB 3.2 and dual USB 2.0 port on both front and rear side. Dual Independent Display (HDMI/ DP) 2 low profile Expansion slots (PCIe x16 and PCIe x4).
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Product
Mini Type COM-HPC Module With Intel® Core™ Ultra Processor (Meteor Lake)
COM-HPC-mMTL
Computer on Module
Combining a power-efficient Intel® Core™ Ultra processor with up to 64GB LPDDR5 memory in a 95x70mm size makes this ideal for battery-powered, space-limited, high-performance edge applications like medical ultrasound devices, industrial automation, data loggers, autonomous driving, and AI robots.
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Product
Intel® Core™ Ultra 3 Series Processor
AIMB-234
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Intel® Core™ Ultra ProcessorsSupports Intel® ARC™ GPU with up to 12Xe, enabling four independent 4K displaysSupports up to 128GB dual-channel DDR5-7200MT/s using CSODIMM modulesBuilt-in NPU5 delivering 50 TOPS for dedicated AI accelerationOffers full support for embedded software APIs and Advantech’s WISE-PaaS/DeviceOn platformProvides extensive I/O expandability—2.5GbE, high-speed PCIe x8 Gen5, USB4 and USB3.2 Gen2 ports, plus SATA 3.0
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Product
3.5" Single Board Computer With Intel® Core™ Ultra Processors
SBC35-MTL
Single Board Computer
ADLINK SBC35-MTL, a compact 3.5" Single Board Computer equipped with Intel® Core™ Ultra Processors for efficient, high-performance computing. It features an integrated NPU to boost AI processing capabilities and includes a reserved MIPI-CSI signal pathway for easy camera integration, making it ideal for real-time and vision-based applications. The SBC35-MTL is designed to meet the needs of modern embedded systems, delivering cutting-edge performance in a compact form factor
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Product
Air Core Current Limiting Reactors
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Current Limiting Reactor (CLR) is one of the most effective short circuit current limiting devices. It reduces stresses on busses, insulators, circuit breakers and other high voltage devices. Use of CLR is the most practical and economical approach at current limiting.
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Product
10th Gen Intel® Core™ Processor LGA1200
AIMB-277
Motherboard
Supports 10th Generation Intel® Core™ i processor (LGA1200) with Intel Q470E chipsetTwo 260-pin SO-DIMM up to 64GB DDR4 2933 MHz SDRAMSupports triple display of HDMI 2.0a/DP++/VGA/LVDS( or eDP)Supports PCIe x16 (Gen 3), 1x M.2 M key + 1x M.2 E key, 4x USB 3.2 Gen2 + 4x USB 3.2 Gen1, and 4x SATA IIISupports Intel vPro, AMT, Software RAID 0,1,5,10, TPM 2.0, 3.2W AmplifierSupports ATX powerSupport Windows 10 LTSC & Ubuntu 20.04 LTS; SUSI API and WISE-DeviceOn
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Product
Clamp-On / Precision / Split Core Current Transformer
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Transformer Ratio (Arms) : 100A / 1AColours : Red, yellow, blueConnection : Safety Sockets for Banana Plugs ф 4mm Jaw Opening : Cable Dia 15mm max.
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Product
3U CompactPCI Intel® 6th Gen. Quad- Core™ Processor Blade
MIC-3332
Processor Blade
MIC-3332 is using Intel® 14nm technology to provide significant performance and power efficiency. It provides an ideal solution for railway rolling stock, high-performance computing and military application. With its optimized design on EMC & thermal, it is available to meet or exceed EN50155.
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Product
MORA Ready Development Platform: CompacFrame Integrated With SOSA Aligned PICs And Sciens Innovations Helux Core RF Tools
SE9M3PS9YIBXNLY
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The MORA-Ready Development Platform (MRDP) simplifies the process of creating RF signal processing capabilities and accelerates integration of existing applications. Featuring Sciens Innovations helux™ Core powerful software tools to accelerate RF signal generation and system development.
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Product
Modular Compact Embedded Box PC With 6th/7th Gen Intel® Core™ I CPU
UNO-2484G
Box PC
Intel® Core™ i7/i5/i3/Celeron Processor with 8GB DDR4 built-in Memory4 x GbE, 4 x USB 3.0, 1 x HDMI, 1 x DP, 4 x RS232/422/485Stackable 2nd layer for up to 4 iDoor extension or customize for domain applicationsCompact Fanless DesignRuggedized by zero cable and lockable I/O designSupports 30+ iDOOR combination with four main categoriesDiverse system I/O and Isolated Digital I/O by iDoor TechnologySupports Fieldbus Protocol by iDoor Technology3G/GPS/GPRS/Wi-Fi Communication by iDoor Technology with RED Compliance
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Product
Quad Core KeyStone™ DSP + UltraScale™ FPGA Module
SMT6657-KU35
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Sundance Multiprocessor Technology Ltd.
The SMT6657 DSP+FPGA module is a reliable and flexible platform for digital signal processing applications requiring high-performance integer and floating-point computation.It is applicable to both symmetric multiprocessing applications in which the computational load is shared by the two DSPs and asymmetric applications where one of the DSPs is responsible for hard real-time processing and the other acts as a supervisor, handling all non-deterministic communication and optionally running under control of an operating system.
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Product
6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MXE-5500 Series
Industrial Computer
ADLINK's new Matrix MXE-5500 series of rugged quad-core fanless computers features the 6th generation Intel® Core™ i7/i5/i3 processors, delivering outstanding performance with robust construction.
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Product
3U 7th Generation Intel® Core™ i3-7100E Processor-Based PXI Express Gen3 Controller
PXIe-3937
Controller
The ADLINK PXIe-3937 PXI Express embedded controller, based on the 7th gen Intel® Core™ i3 processor, is specifically designed for hybrid PXI Express-based testing systems, delivering maximum computing power for a wide variety of testing and measurement applications.
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Product
SMARC Short Size Module with Freescale i.MX6 Solo, DualLite, Dual or Quad Core Processor
LEC-iMX6
Computer on Module
The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.
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Product
Industrial ATX Motherboard With 12/13/14th Gen Intel® Core™ I9/i7/i5/i3 Processor
IMB-M47
Motherboard
ADLINK's IMB-M47 ATX Motherboard is a driving force behind industrial automation, supporting 14/13/12th Gen Intel® Core™ processors, and delivering substantial improvements in performance, capacity, and GPU support through its seven PCIe slots, PCIe 5.0 compatibility, DDR5 memory, and 2.5GbE PoE capability. Tailored for a range of industrial applications including automation, machine vision, factory automation, and logistics, the IMB-M47 features up to 128GB DDR5 memory at 4800MHz, supports three independent displays, offers USB 3.2 Gen2x2 (20Gb/s), 3x 2.5GbE LAN, multi-M.2 Key M, TPM 2.0 security, and PCIe 5.0 slots for high-performance add-on cards. Optimized for the latest Intel processors, this motherboard blends efficiency and performance cores, bolstering edge applications with swift memory performance via DDR5 technology. With a commitment to technology leadership, ADLINK equips customers with the tools to harness the latest processors, streamline real-time graphics processing, and fuel innovation in Edge AI applications, solidifying its role in the future of industrial edge computing.
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Product
Split Core Current Transformer
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Beijing GFUVE Electronics Co.,Ltd.
Have a "split" in the core that allows the CTs to open and be placed around the conductor without having to disconnect the conductor or disrupt the wiring.
