Common Core
-
Product
Medical Computer Equipped With MXM Graphics Module Supporting NVIDIA Quadro® GPU With 8th/9th Generation Intel® Core™ I7/i5/i3 In LGA1151 Socket. Compliant With IEC 60601-1/IEC 60601-1-2
MLB-3000
-
- Medical grade computer compliant with IEC 60601-1:2005 + A1:2012 + A2:2020 (3.2 edition) / IEC 60601-1-2:2014 + A1:2020 (4.1 edition)- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT
-
Product
PICMG 1.3 Half-size CPU Card With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3, Xeon® E, Pentium® Or Celeron® Processor, Intel® C246/Q370/H310, SATA 3.0, USB 3.1 Gen1, LAN And DVI-I
SHB250R
-
*LGA1151 9th/8th gen Intel® Core™ i7/i5/i3, Xeon® E (C246), Pentium® or Celeron® processor*Intel® C246/Q370/H310 chipset*2 DDR4-2666/2400 SO-DIMM for up to 64GB of memory*Supports M.2 slot (C246/Q370)*Supports Intel® AMT and vPro (C246/Q370)*TPM 2.0 supported
-
Product
COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
-
The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
-
Product
COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D and Pentium D SoC (formerly codename: Broadwell-DE)
Express-BD7
-
The Express-BD7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) (formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.
-
Product
COM Express Basic Size Type 6 Module with 12th Gen Intel® Core™ Processor (formerly codename: Alder Lake-P)
Express-ADP
-
ADLINK’s Express-ADP COM Express Type 6 Basic size module is based on the 12th Gen Intel® Core™ processor and is the first COM Express module to support advanced hybrid architecture with up to 6 Performance-cores (P-cores) for IoT workloads and up to 8 Efficient-cores (E-cores) for background task management, boosting productivity and fueling IoT innovation across a wide variety of deployments.
-
Product
PXIe-8821, 2.6 GHz Dual Core Processor PXI Controller
785545-01
-
PXIe, 2.6 GHz Dual Core Processor PXI Controller—The PXIe‑8821 is an Intel Core i3‑based embedded controller for PXI systems. You use it to create a compact and/or portable PC-based platform for industrial control, data acquisition, and test and measurement applications. The PXIe‑8821 includes a 10/100/1000 BASE‑TX (Gigabit) Ethernet port, two Hi‑Speed USB ports, two USB 3.0 ports, as well as an integrated hard drive, serial port, and other peripheral I/O.
-
Product
PXI/PXIe RF Multiplexer, Single 4-Channel, Terminated Common, 3GHz, 50Ω, SMB
42-876A-001
-
The 40-876A-001 (PXI) and 42-876A-001 (PXIe) are 50 Ohm 4 to 1 RF multiplexers with 1 bank in a single slot. Additionally, extra switching allows the common connection to be terminated into 50 Ohm, maintaining signal integrity. The module exhibits low insertion loss and VSWR through the use of modern RF relay technology at an affordable cost.
-
Product
Fanless Embedded System With Intel® Celeron® 2980U/ Core™ I5-4300U/i3-5010U ULT SoC, HDMI/DisplayPort, 2 GbE LANs, 4 USB 3.0, 2 COM And PCIe Mini Card
eBOX560-880-FL
-
The eBOX560-880-FL, a palm-sized, fanless embedded computing system utilizes high performance Intel® Haswell ULT multi-core SoC. The ultra-compact, ultra-lightweight eBOX560-880-FL adopts an IP40-rated rugged aluminum cold-rolled steel enclosure to withstand vibration of up to 3 Grms (with SSD) and has a unique thermal solution to support the temperature range from -20°C to +50°C (-4°F to +122°F). Supporting 4K2K resolution via HDMI interface, the outstanding embedded box computer is ideal for passenger information system, Kiosk, entry-level gaming, video surveillance, and other automation & embedded applications.
-
Product
14/13/12th Generation Intel® Core™ Processor-Based Expandable Modular Industrial Computers
MVP-6200 Series
-
The MVP-6200 Compact Modular Industrial Computers powered by 14/13/12th Gen Intel® Core™ i9/i7/i5/i3 and Celeron processors. Featuring Intel R680E chipset and supporting up to 65W, the computers can also incorporate GPU cards in a rugged package suitable for AI inferencing at the Edge, and can be used for but not limited to smart manufacturing, semiconductor equipment, and warehouse applications.
-
Product
PICMG 1.3 Full-size CPU Card With LGA1150 4th Gen Intel® Core™ I7/i5/i3 Processor, Intel® Q87, SATA3, USB 3.0, DVI-D, VGA, DisplayPort And Dual LAN
SHB130
-
The PICMG 1.3 full-size CPU card, SHB130, designed for the new architecture 4th Generation Intel® Core™ processors (codename: Haswell/Haswell Refresh) with Intel® Q87 chipset on 22nm technology using LGA1150 socket. The outstanding SHB130 with new Intel® architecture delivers up to double the graphics performance over the previous generation. The new graphics solution has high levels of integration to enable new form factors and designs with excellent visual quality built in. In addition, The PICMG 1.3 full-size CPU card comes with two DDR3 1333/1600 MHz unbuffered ECC DIMM slots up to 16 GB of system memory and six SATA 6Gbps ports with RAID 0, 1, 5, 10. The PCI Express 2.0 available on the new Intel® Core™ processor provides flexible x16, x4 or x1 lanes for versatile applications. The high performance SHB130 with improved graphics ability is ideal for applications such as network security, storage server, POS, kiosk, medical, gaming, digital signage, and surveillance security monitoring.
-
Product
Ultra Compact, Uncooled Thermal Imaging Core
Dione S 1280 CAM Series
-
The Dione S 1280 CAM series is based on an uncooled 12 μm pitch microbolometer detector with a 1280 × 1024 resolution and NETD of less than 40 mK (available upon request) and 50 mK.The camera cores are optimized for low SWaP (Size, Weight and Power). The Dione S 1280 CAM is lightweight and small with mechanical shutter. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione S 1280 versions have the same SAMTEC ST5 connector and are GenICam compliant. Dione S 1280 CAM is a LWIR uncooled thermal imaging SWAP module with housing supporting M34/M45 lens (optional).The ultra-compact Dione S 1280 CAM series find application in safety and security systems, as well as in industrial thermal imaging systems.
-
Product
Diagnostic Cores
VersaCore™
-
The diagnostic cores are uniquely designed in the VC20 format. Using the customizable PCB, components can be added to create a "golden core" to quickly troubleshoot your system Test SMUs, Test Motherboard, Test Pogo pins, Test Relay matrix.
-
Product
15" Fanless Panel PC With 13th Gen Intel® Core™ Processors (I7/i5/i3)
PPC-315S RPL
-
True-flat touchscreen with Industrial-grade LCD panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware security
-
Product
LGA 1151 Intel® Xeon® E & 8th/9th Generation Core™ MicroATX Server Board with 4 DDR4, 4 PCIe, 6 USB 3.1, 8 SATA3, Quad/Dual LANs, IPMI
ASMB-586
-
- LGA 1151 Intel® Xeon® E and 8th/9th generation Core™ i7/i5/i3 processors with C246 chipset- DDR4 ECC/Non-ECC 2666/2400/2133 MHz UDIMM up to 128GB- One PCIe x16, two PCIe x4 and one PCIe x1 slots- Triple displays - DVI-D, VGA and HDMI 2.0 ports- Eight SATA3 ports and six USB 3.1 ports- 0 ~ 60° C ambient operating temperature range
-
Product
Intel® Core™ Ultra Series 2 Processors (LGA1851), Up To 24 Core. Support Q870/H810 PCH
AIMB-2710
-
Intel® Core™ Ultra Series 2 Processors, Up to 24 Core. Support Q870/H810 PCHDual channel DDR5 6400MT/s, max. 96GB with two CSODIMMSuper Speed I/O: PCIe x16 Gen5 (32GT/s), USB 3.2 Gen2x1 (10Gbps), 2.5 GbERich expansion: M.2 M key for NVMe SSD, M.2 E key for wireless, 2 SATA and 1 USB4 Type-C12-24V DCinWindows 11 LTSC & Ubuntu 24.04 LTS; SUSI API and WISE-DeviceOn
-
Product
COM Express Type 6 Basic Module With Intel® Xeon® E3/7th Gen Intel® Core™ I7/i5/i3 Processors And Intel® CM238/QM175/HM175
CEM510
-
The CEM510 is based on the Intel® Xeon® E3 and 7th generation Intel® Core™ i7/i5/i3 processors with Intel® CM238/QM175/HM175 chipset. The 125 x 95 mm system-on-module was designed for graphics-intensive applications over the Industrial IoT, including industrial control, medical imaging, digital signage, and gaming machines. The embedded module is equipped with dual 260-pin DDR4-2133 SO-DIMM slots with up to 32GB system memory. Its wide operating temperature range of -40°C to +85°C strengthens the adaptability of various harsh conditions. For evaluation and development purposes, Axiomtek also has the CEB94011, a carrier board designed to operate with the CEM510 for additional I/O and expansions interfaces. Integrated with Intel® Gen 9 graphics, and with the support of DX12.0, OCL 2.0 and OGL 4.3, the module presents excellent graphics performance with resolution up to 4K (3840 x 2160 @ 30 Hz). Three independent displays are supported through LVDS and three DDI ports supporting HDMI, DisplayPort, and DVI (one DDI supporting optional VGA).
-
Product
Fanless Embedded System With LGA1150 Socket 4th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q87, 4 PoE, 6 USB 3.0, HDMI/DVI/DisplayPort And 2 PCIe Mini Cards
eBOX671-885-FL
-
The eBOX671-885-FL powerful industrial-grade embedded vision system features PoE (power-over-Ethernet) support. To provide better computing performance, the powerful PoE embedded vision system supports LGA1150 socket 4th generation Intel® Core™ i7/i5/i3 or Celeron™ processor (Codename: Haswell/Haswell-refresh). Its four channel Gigabit PoE ports allow multiple cabling to cameras and any PoE power device. With high-end CPU and multi-I/O connectivity, this fanless embedded vision system is well suited to multi-camera imaging applications such as optical inspection, surveillance system and IoT & M2M-related applications.
-
Product
Intel® 8th. Gen. Core I7/i5 Processor Fanless Embedded System
EPC-C301
-
Intel 8th. Gen. Core Processor with Quad/Dual Cores (i7/i5), TDP 15W.Semi-Industry Fanless slim systen, Din Rail or Wall mount design.HDMI + DP* (Support vai MIO) dual display.4 GbE, 4 USB3.1, 4 USB 2.0, CAN Bus, M.2 M-Key 2280 supports NVMe, M.2 E-key 2230, M.2 B-key, 1 full size of mini PCIe, DC-in 12V.-20 ~ 60 degree extend temperature operating.Supports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite.No RED certification.
-
Product
Fanless Embedded System With Intel® Atom™ Processor E3845 Quad Core™ (1.91 GHz) For Railway PC
tBOX323-835-FL
-
The tBOX323-835-FL, a fanless railway PC, is designed for in-train applications. Integrated with onboard quad-core Intel® Atom™ E3845 processor and 4 GB low-powered DDR3L memory. The fanless railway PC boosts its computing performance and specializes its I/O design with five isolated COM ports, two M12-type LAN connectors, USB 2.0 ports, and one isolated digital I/O. The railway PC also provides VGA and HDMI outputs for in-train surveillance. The tBOX323-835-FL is an ideal all-in-one IoT (Internet of Things) solution for various applications, including railway multi-functions of gateway, controller, digital signage management and surveillance. Certificated with EN50155 and EN50121 for rolling stock and complied with EN45545-2 for fire resistance, the rugged embedded system operates reliably in a -40ºC to 70ºC operating temperature range (EN50155 Class TX) and in a high vibration environment.
-
Product
11th Gen. Intel® Core™ Processor-Based Fanless Open Frame Touch Panel PC
SP2-TGL Series
-
- 11th Gen. Intel® Core™ Processor- 10.1"/15.6"/21.5" PCAP touch screen- Wide input voltage range 9-36V DC- Full customization for fast integration with all form factors, kiosks, and all-in-one panel PC applications- Extensive I/O and function expansion through board-to-board connectors (Function Modules)- Enhanced protection in case of sudden power outage with back-up battery (Optional)- Pre-compliance EMC testing and high ESD tolerance
-
Product
Compact DIN-Rail Edge Controller With 11th Gen Intel® Core™ I CPU
UNO-148
-
Port isolation for 8 x DI, 8 x DO, 4 x COMSupports M.2 M key 2280 NVMe SSD storage, M.2 B key 2242 storage, 3042/3052 cellular modules, and M.2 E Key 2230 wi-fi modulesDual 2500BASE-T Ethernet supports Time-Sensitive Network(TSN) technologyRemote out-of-band (OOB) power management with Advantech iBMC technologyMicrosoft Azure IoT Edge and Amazon AWS IoT Greengrass certified
-
Product
Value Family 9th Generation Intel® Core™ i7/i5/i3 & 8th Gen Celeron® Processor-Based Embedded Fanless Computer
MVP-5100 Series
-
ADLINK MVP-5100 Series of fanless embedded computing platforms, incorporating the 9th Generation Intel® Core™ processor, is optimized for edge computing applications. The MVP-5100 Series consolidates high performance computing, scalable function and I/lO enhancements, and industrial-grade reliability onto a compact fanless platform, providing reliable long-time operation for performance-critical applications in industrial automation, logistics, transportation, and smart city segments.
-
Product
Open Pluggable Specification (OPS) Digital Signage Player With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor And Intel® H110
OPS500-501-H
-
The OPS500-501-H is an OPS compliant digital signage player supporting dual displays with 4K at 60Hz resolution. The smart cableless open pluggable digital signage module is powered by the latest 7th/6th generation Intel® Core™ and Celeron® processors (codename: Skylake) with the Intel® H110 chipset, providing outstanding performance at a lower cost. It supports LGA1151 socket-type CPUs to offer greater flexibility for CPU selection. In addition, the OPS signage module has one 260-pin DDR4-2133 SO-DIMM socket with up to 16 GB memory capacity. The high-performance OPS500-501-H is a perfect solution for multi-display applications in airport information board, shopping mall, corporate, education, hospitality, religious organization, bank, retail store, restaurant, performing art center, and many more.
-
Product
Fanless Embedded System With 7th/6th Gen Intel® Core™, Pentium® And Celeron® Processor For Railway And Vehicle PC
UST500-517-FL
-
The UST500-517-FL is powered by the LGA1151 socket 7th/6th generation Intel® Core™ and Pentium® processors up to 65W with the Intel® Q170 chipset. The integrated 16 PoE ports are available in RJ-45 or M12 connectors for IP cameras. It provides a full scope of power protection that includes intelligent vehicle power management technology for ACC on/off delay, shutdown delay, and over/under voltage protection. Enhanced by its robust structure and system design, the UST500-517-FL is able to operate under a wide temperature range from -40°C to +70°C and vibration endurance up to 3 Grms. This transportation embedded box is in compliance with ISO 7637-2 and EN 50155 for mobile surveillance applications. There are 16 Gigabit LAN ports which support 802.3at/af Power over Ethernet with a total power budget of 200W. Its DVI-D, HDMI and VGA interfaces support three surveillance monitors. Furthermore, its external accessible SIM card slot enables users to easily change SIM card for different telecommunication service. With wireless LAN modules, this user-friendly transportation embedded system can real-time transmits the video to the control center. The two built-in or four swappable SATA hard drives are used for mass storage of video files.
-
Product
2-slot Fanless Industrial System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H110, Front-access I/O, PCIe And PCI Slots
IPC962-511-FL
-
The IPC962-511-FL is powered by the 7th/6th generation Intel® Core™ and Celeron® processors (codename: Kaby Lake/Skylake) up to 65 W with the Intel® H110 chipset, featuring high performance capability. The ultra-compact industrial computer provides flexible expansion options with one I/O module slot and two PCI/PCIe expansion slots. It has a wide operating temperature range of -10°C to +60°C, and is equipped with a wide range 19V - 30V DC power input for mission-critical environments. The ruggedized industrial PC has a creative modular design with rugged mechanisms and optimized expandability. To meet different customization requirements, it has an optional I/O module slot and three different types of I/O modules. The choices, include a 4-port isolated RS-232/422/485 module; isolated 8-in/8-out DIO module; 2-port isolated RS-232/422/485 and 4-in/4-out DIO module, can provide system integrators with a less cabling solution for a lower total cost of ownership. Additionally, the compact industrial PC provides two flexible PCI/PCIe expansion slots with three different combinations of AX96205, AX96206, AX96207: one PCIe x16 and one PCIe x4; one PCIe x16 and one PCI; 2 PCI.
-
Product
Load Testing for Evolved Packet Core (ePC/VePC)
Flare
-
Linkbit Flare is designed for load testing of Evolved Packet Core (ePC) networks, and the upcoming VePC deployments. It is based on the technology initially develped for Linkbit functional testers, and as a result is extremely flexible.
-
Product
Intel® 6th/7th Generation Core I Desktop Compact Fanless System
MIC-7700
-
Intel® 6th/7th Generation Core i Desktop CPU (LGA1151) with Q170/H110 chipset2 x RS-232/422/485 and 4 x RS232 serial ports (with expansion cable)1 x 2.5" HDD, 1 x CFast, 1x mSATA and 1 mini-PCIe with SIMSupports 2 LAN, Isolation COM, 32-bit GPIO modules2 x GigaLAN and 8 x USB 3.0VGA and DVI outputSupports Advantech’s i-module, SUSIAccess, and embedded software APIs9 ~ 36 V DC input power rangeWide operating temperature
