Common Core
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Offline Stator Core Testing
Iris Power EL CID Evolution
The EL CID Evolution provides offline testing of inter-laminar insulation breakdown within a stator core. The only alternative to the Iris Power EL CID Evolution test is the Ring Flux (full flux) test. The Ring Flux test requires large power supplies, considerable manpower, and expensive infrared viewing cameras.
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Air Core Inductors
Osborne designs our Air Core Inductors to realize their advantage of high linearity. We also work with our clients to identify and mitigate any potential disturbances that could result from electromagnetic fields created. The air core design approach is known to create strong electromagneticfields. Osborne develops electromagnetic circuit models, if necessary, to ensure that our clients build effective and reliable circuits.
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PXI 5A Power Multiplexer, 4-Bank, 11-Channel, Isolated Common
40-651A-013
The 40-651A-013 is part of our range of high density power multiplexer modules is suitable for switching inductive/capacitive loads up to 5A at 250VAC. It is available in the following 1-pole multiplexer formats.
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Mini-ITX SBC With LGA1150 Socket Intel® Xeon® E3-v3 And 4th Gen Intel® Core™ Processor, Intel® C226, HDMI/DisplayPort/VGA/LVDS, Dual LANs And USB 3.0
MANO882
The MANO882 supports Intel® Xeon E3 series, 4th generation Intel® Core™ i7/i5/i3 processors and Celeron® processors with the Intel® C226 chipset. Two SO-DIMM sockets onboard support up to 16 GB of DDR3-1333/1600 system memory. The outstanding motherboard sustains HDMI, DisplayPort, VGA and LVDS with triple-display capability, making this system board an ideal solution for digital signage, optical inspection for machinery, and industrial automation and control fields. In addition, the embedded board supports Intel® AMT 9.0 security technology to provide complete protection against viruses and attacks. Additionally, the MANO882 is equipped with an Infineon TPM 1.2 security chipset to enhance user data protection.
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COM Express Type 6 Compact Module With 7th Gen Intel® Core™ & Celeron® Processor
CEM511
The CEM511, a new COM Express Type 6 Compact form factor module, is powered by the latest 7th generation Intel® Core™ i7/i5/i3 processor (Kabylake-U) for high-performance applications. The palm-sized CEM511 is packed with a variety of rich features including low power consumption, industrial wide temperature range support and impressive graphic processing capability. The COM Express® Type 6 Compact module supports two DDR4-2133 SO-DIMM sockets with a maximum system memory capacity of up to 32GB. It has a rugged design with an extended operating temperature range from -40°C to +85°C (-40°F to +185°F) to satisfy different harsh environment demands. The system on module also delivers outstanding computing, graphics and media performance through its Intel® Gen 9 graphics engine, DirectX 12.0, OCL 2.0, OGL4.3 features and 4K resolution (4096 x 2160 @ 30 Hz) support. Therefore, the power efficient CEM511 is designed for graphics-intensive applications over the Industrial IoT, including industrial control system, medical imaging, digital signage, gaming machines, military, and networking.
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9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXC-6600 Series
- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor- Dual SODIMMs for up to 32GB DDR4- Rich I/O: 2x DP++, 1x HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM 2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1, 4x USB 2.0- Rich storage: up to 4 internal 2.5" SATA 6 Gb/s ports with RAID 0/1/5/10 support, CFast, M.2 2280
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Industrial ATX Motherboard with 8th/9th Gen Intel® Core™ i9/i7/i5/i3 or Xeon® E Processors
IMB-M45
ADLINK IMB-M45 ATX industrial motherboard supports the 8th/9th Generation Intel Core i9/i7/i5/i3 and Xeon E3 processor in the LGA1151 package, and the Intel C246 chipset. This model supports ubiquitous high-speed data transfer interfaces PCIe 3.0, USB 3.1 Gen2 and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2400/2666 MHz ECC or non-ECC memory up to 128 GB in four DIMM slots.
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3.5" Single Board Computer With 13th Gen Intel® Core™ I7/i5/i3/ Celeron® Processor
SBC35-RPL
SBC35-RPL is powered by Intel's latest processors, which offer improved performance, power efficiency, and support for the latest technologies based on Intel's 13th generation of 3.5-inch Single Board Computers (SBCs) offer a range of advanced features and capabilities for a variety of embedded applications.
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7th Gen. Intel® Core™ Processor-Based Fanless Open Frame Touch Panel PC
SP2-KL Series
- 7th Gen. Intel® Core™ Proc- 10.1"/15.6"/21.5" PCAP touch screen- Wide input voltage range 9-36V DC- Full customization for fast integration with all form factors, kiosks, and all-in-one panel PC applications- Enhanced protection in case of sudden power outage with back-up battery (Optional)- Pre-compliance EMC testing and high ESD tolerance
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Digital Signage Player With 8th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, 3 HDMI 2.0, 4 USB And GbE LAN
DSP500-523
*8th gen Intel® Core™ i7/i5/i3 & Pentium® processor (Coffee Lake)*2 DDR4-2400 SO-DIMM for up to 32GB of memory*3 HDMI 2.0*4 USB 3.1 and 1 GbE LAN*1 M.2 Key E 2230 for Wi-Fi/BT*1 M.2 Key B 3042 for 4G LTE*1 M.2 Key M 2280 for storage
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Pico-ITX SBC With 6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processors, HDMI/LVDS, LAN And Audio
PICO500
The PICO500, an extreme compact pico-ITX embedded board, supports the latest 14nm 6th generation Intel® Core™ i7/i5/i3 processors (Codename: Skylake-U). The tiny PICO500 is equipped with one DDR4 SO-DIMM with up to 16 GB memory capacity. Integrated with Intel® HD graphic engine, the Pico-ITX motherboard supports HDMI and 18/24-bit dual channel LVDS that delivers a whole new level of Ultra HD 4K visual experiences. Its Pico-ITX form factor allows for an extremely compact performance system; meanwhile, the PICO500 is built to withstand wide temperature conditions, ranging from -20°C to +70°C (-4°F to +158°F) with active thermal solution.
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Camera Cores
Photonis camera cores provide day-through-night imaging to detect and capture images in any lighting conditions, from daylight through quarter-moon darkness. Our camera core portfolio covers a broad range of detection from visible, near infrared (NIR), short-wavelength infrared (SWIR) to long-wavelength infrared (LWIR) spectrum.
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Vision System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron®, Intel® Q170, 4 PoE, 4 USB 3.0, And Real-time Vision I/O
IPS962-512-PoE
The IPC962-512-PoE meets the increasing requirements for maximum quality and flexibility in modern production plants. It features flexible expansion capacity, camera communication interfaces, real-time vision-specific I/O with microsecond-scale and LED lighting control. This machine vision controller is powered by the LGA1151 socket 7th/6th generation Intel® Core™ (codename: Kaby Lake/Skylake) and Celeron® processors (up to 65W) with the Intel® Q170 chipset. The IPS962-512-PoE comes with a full range of isolated I/O interfaces and real-time controls essential to machine vision applications, including trigger input, LED lighting controller, camera trigger, as well as an encoder input for conveyor tracking. The real-time vision system PS962-512-PoE enables a fast and high accurate inspection to ensure that the desired quality is achieved with no manufacturing defects. It supports four IEEE802.3at PoE LAN ports and four USB 3.0 ports for connection with industrial cameras. Operating over a wide temperature range from -10°C to +55°C, the IPS962-512-PoE provides reliable and stable performance within severe environments. Its easy setup and compact design are ideal for space constrained environments. Moreover, one PCIe x16 and one PCIe x4 expansion slots allow quick installation of I/O cards and graphics cards. Two easy-swappable 2.5" HDDs are available for extensive storage needs.
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3U 7th Generation Intel® Core™ i5-7440EQ Processor-Based PXI Express Gen3 Controller
PXIe-3977
The ADLINK PXIe-3977 PXI Express embedded controller, based on the 7th gen Intel® Core™ i5 processor, is specifically designed for hybrid PXI Express-based testing systems, delivering maximum computing power for a wide variety of testing and measurement applications.
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3U i7 Quad Core, 2.4 GHz Processor cPCI Express Controller
GX7945
The GX7945 is a single-slot embedded cPCI Express 3U controller for use with Marvin Test Solutions' PXI Express chassis. When combined with the embedded storage peripherals which are integrated into PXIe chassis, the controller / chassis offers a compact, high performance, and integrated test platfrom solution.
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ATX Motherboard With LGA1151 Socket 7th/6th Gen Intel® Core™ Processor, Intel® Q170, USB 3.0, SATA 3.0, Dual LAN, VGA, DVI-D And HDMI
IMB502
*LGA1151 socket 7th/6th gen Intel® Core™ i7/i5/i3, Pentium® & Celeron® processor (Kaby Lake/Skylake)*Four 288-pin DDR4-2400/2133/1866 DIMM for up to 64GB of memory*VGA, DVI-D and HDMI with triple-view supported*5 SATA-600 with RAID 0/1/5/10*6 USB 3.0 and 7 USB 2.0
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Industrial All-In-One Touch Panel PC Based On 11th Gen. Intel® Core™ Processor
STC2-TGL Series
- High performance with 11th Gen. Intel® Core™ Processor- 15.6"16:9 LCD panel with LED backlight with 50,000 service life- With up to 1920 x 1080 resolution- 10-point PCAP touchscreen- Anti-fingerprint surface treatment for ease of cleaning and enhanced readability- IP 65 rating for water and dust protection- Robustness with wide 9-36V DC input- Ease of installation with optional VESA mount
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Compact, Industrial Thermal Imaging Core
Dione 320 OEM Series
The Dione 320 OEM is based on a state-of-the-art detector with a 320×240 pixels and 12 μm pixel pitch. The NETD is less than 40 mK (available upon request) or 50 mK.The cores are optimized for low SWaP (Size, Weight and Power). The overall size of the OEM core is 25 x 25 x 10 mm3 and weight is 6 gr. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione 320 versions have the same SAMTEC ST5 connector and are GenICam compliant.The compact Dione 320 OEM series find application in industrial machine vision, medical, scientific and advanced research, safety and security systems.
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Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processors, With Support For MXM-AXe Based On Intel® Arc™ GPU, And Thunderbolt™ 4 Port
MLB-3100 with Intel MXM GPU
- ADLINK MXM-AXe graphics module support (type A, up to 50W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller
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6U CompactPCI 9th Gen Intel Xeon®/Core™ Processor Blade with Two PMC/XMC Sites
cPCI-6540 Series
- 14nm multi-core 9th Gen Intel® Core™ processor (formerly Coffee Lake Refresh)- Dual channel DDR4 ECC memory, soldered and SO-CDIMM, up to 64GB- Versatile storage: SSD, CFast, M.2- Dual PMC/XMC sites- Remote management and TPM support
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Radar Core Chips
Macom Technology Solutions Holdings Inc.
Multifunction GaAs and Silicon MCM designed for communication radar and weather applications. MACOM Core Chips deliver a complete transmit/receive function with phase and amplitude control.
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Intel® Smart Display Module Large (Intel® SDM-L) With 8th Gen Intel® Core™ I7/i5/i3 Processor, HDMI And LAN
SDM500L
The SDM500L is powered by the onboard 8th generation Intel® Core™ i7/i5/i3 processor with the Intel® Generation 9 HD Graphics chipset. The Intel® Smart Display Module-Large (Intel® SDM-L) measures just 175 x 100 mm and a maximum z-height of 1.6 mm, which is well-suited for ultra-slim displays. It can be easily connected to an SDM-compliant display via a high-speed PCIe x8 edge connector - which supports 4K resolution displays and video capture and has built-in USB 3.0, HDMI 2.0, DisplayPort 1.2, Serial TX/RX and I2C signals. With its excellent graphics performance and installation flexibility, the incredible signage module can satisfy diverse industry requirements and support a wide range of digital signage applications such as bedside terminals for hospital patients or factory automation solutions.
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Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processors, With Support For MXM GPU Module With Embedded NVIDIA RTX GPU And Thunderbolt™ 4 Port
MLB-3102 with NVIDIA MXM GPU
- ADLINK MXM graphics module support (type A/B, up to 120W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller- 2x PCIe Gen 3 x4 expansion slot for full-height, half-length add-on card, each slot is 25W power budget and additional Molex 4-pin power cable (12V/1.5A and 5V/2A) support
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Pulser / Sampler Core
Furaxa has researched, developed, and characterized a novel monolithic arrayable pulse and sample aperture generation technology. Recent results include demonstration of sub-10ps pulse/aperture generation at repetition rates up to 3 Billion Pulses/Samples Per Second (BPPS) with jitter that is estimated at sub-10fs. Further, simulations in a number of InP DHBT processes exhibit sub-3ps 20BPPS performance. The IP is process-independent, and has been achieved in CMOS SOI, InP HBT, SiGe and GaAs so far. Please contact us regarding your specific foundry and technical requirements: The company currently licenses the sampler/pulser technology for use by application and market, and is interested in discussing how the technology can enable our partners' applications. A short list of characterized Pulser/Sampler Cores is given below.
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Rugged IP67-rated Fanless Embedded System With Intel® Core™ I5-7300U & Celeron® 3965U, VGA, GbE LAN, 2 USB, 2 COM And 9 To 36 VDC
eBOX800-511-FL
The eBOX800-511-FL is a fanless embedded system with IP67-rated housing and M12 connectors for mission-critical environments. This rugged embedded system is powered by the onboard 7th generation Intel® CoreTM i5-7300U and Celeron® 3965U (formally codename: Kaby Lake) and comes with one 204-pin DDR4-2133 SO-DIMM slot with system memory up to 16GB. The eBOX800-511-FL is designed for enabling to function in harsh environments with power protection, a wide range operating temperature from -30°C to 60°C, operating shock tolerance up to 3G and 9-36V wide range DC input. Additionally, there are M12 lockable connectors and N-jack type waterproof antenna openings to meet the performance needs for outdoor critical applications such as facility condition monitoring. Furthermore, the fanless embedded box computer comes in great expansion possibilities, including flexible I/O connectors and two 2 PCI Express Mini Card slots. For enhanced platform security the eBOX800-511-FL provides Trusted Platform Module (TPM) 1.2 support.
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1394 and AS5643 IP Core Solutions
Synthesizable 1394 and AS5643 IP Core solutions PHY, LLLC, PHY & LLC for multiple FPGA families.
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Industrial ATX Motherboard For 12/13/14th Gen Intel® Core™ I9/i7/i5/i3 Processors
IMB-C47H
The next level of industrial performance with the ADLINK IMB-C47H Value Series motherboards. These boards redefine what's possible in cost-effective industrial computing, combining dependable performance with an accessible price point.Ideal for a variety of industrial scenarios—from embedded automation to IoT integration—the IMB-C47H series stands out with its support for the latest high-performance processors, versatile I/O capabilities, and robust expansion potential. They provide a stable and scalable platform that accommodates the growing demands of industrial environments.
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X-Band Silicon Radar Quad Core IC
AWS-0101
The AWS-0101 is a highly integrated silicon quad core IC intended for radar and 5G phased array applications. The device supports four radiating elements, single beam transmit, and dual beam receive and includes all requisite beam steering controls for 6 bit phase and gain control. The device provides 21 dB gain during transmit mode, +15 dBm output power during transmit, and 3.4 dB NF during receive. Additional features include gain compensation over temperature, temperature reporting, and fast beam switching using eight on-chip beam weight storage registers. The device features ESD protection on all pins, operates from a +1.8V supply, and is packaged in a 56 lead 7x7 QFN for easy installation in planar phased array antennas.
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PXI RF Multiplexer: 3 GHz, Quad 1 x 4, 50 Ω, Terminated Common
M9147A
Route signals up to 3 GHz through any of four 1 x 4 RF switch multiplexers in a single PXI module.
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Complete TAP Signal Isolation for Corelis Boundary-Scan Controllers
ScanTAP IsoPod
The Corelis ScanTAP IsoPod™ is an add-on accessory that provides a galvanic isolation barrier between the target system and the boundary-scan (JTAG) controller hardware. While the Corelis boundary-scan controllers are highly robust and reliable, the complete electrical isolation helps prevent damage to the controller from harsh electrical environments where over-voltage and over-current can damage components.This Corelis ScanTAP IsoPod was designed to add an additional layer of protection with minimal cost and effort. Open the box and plug it in; everything just works.
