Wafer Probes
I/O pad contactor held by probe card or flying.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probers, Wafer Inspection
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Product
Wafer Mapping Sensor
M-DW1
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Panasonic Industrial Devices Sales Company of America
To provide better safety and improved sensing accuracy, Panasonic studied the requirements for future Wafer Mapping Sensors to ultimately develop the LED Beam Reflective Type Wafer Mapping Sensor, M-DW1. This Sensor uses LEDs as a light source for safe operation and a 2-segment receiving element for higher accuracy in wafer detection.
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Product
HPA-0B General Purpose Probes
General Purpose Probe
Current Rating (Amps): 3Average Probe Resistance (mOhm): 35Test Center (mil): 50Test Center (mm): 1.27Full Travel (mil): 100Full Travel (mm): 2.54Recommended Travel (mil): 67Recommended Travel (mm): 1.70Mechanical Life (no of cyles): 1,000,000Overall Length (mil): 635Overall Length (mm): 16.13
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Product
Standard 0.62 (18.00) - 4.00 (114.00) High Performance Bias Ball Probe
POGO-1T24-4-S
ICT/FCT Probe
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Product
Operation Support System for Wafer Prober
N-PAF
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N-PAF (Network-Based Prober Advanced Function) is a networking system developed for more effective operation and maintenance of multiple wafer probers. Remote operation helps save on labor on the factory floor. An E10-compliant RAM Analyzer can be used for operation management of the system
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Product
Ambient Temperature Vacuum Wafer Chucks
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6" (152mm) Vacuum Wafer Chuck for General Purpose Ambient Temperature testing with a Stainless Steel vacuum wafer surface
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Product
Alternate 0.78 (22.00) - 3.70 (105.00) General Purpose Probe
HPA-0B-1
General Purpose Probe
Current Rating (Amps): 3Average Probe Resistance (mOhm): 35Test Center (mil): 50Test Center (mm): 1.27Full Travel (mil): 100Full Travel (mm): 2.54Recommended Travel (mil): 67Recommended Travel (mm): 1.70Mechanical Life (no of cyles): 1,000,000Overall Length (mil): 635Overall Length (mm): 16.13
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Product
Wafer Bonder
AML
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Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Elevated 2.65 (75.00) - 6.50 (184.00) High Performance Lead Free Probe
LFRE-25T-6.5
ICT/FCT Probe
Current Rating (Amps): 8Average Probe Resistance (mOhm): 8Test Center (mil): 100Test Center (mm): 2.54Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Product
Wafer and Cells PL System
HS-PL
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Photoluminescence (PL) Imaging is a unique non-invasive inspection tool as it can be used in-line at many different steps of the cell manufacturing process. This facilitates the direct comparison of data obtained at one process step to data obtained at another. Additionally, PL imaging can be compared to electroluminescence (EL) imaging on finished cells using comparable equipment.
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Product
Light 0.75 (21.00) - 2.00 (57.00) High Performance Lead Free Probe
LFRE-25I15-2
ICT/FCT Probe
Current Rating (Amps): 8Average Probe Resistance (mOhm): 8Test Center (mil): 100Test Center (mm): 2.54Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Product
General Purpose Probes
General Purpose Probe
*High current*Fine pitch*Long travel*Mounting options
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Product
Standard 1.00 (28.00) - 2.75 (78.00) Non Replaceable General Purpose Probe
E-S-R
General Purpose Probe
Current Rating (Amps): 5Average DC Resistance lower than (mOhm): 30Test Center (mil): 100Test Center (mm): 2.54Full Travel (mil): 65Full Travel (mm): 1.65Recommended Travel (mil): 43Recommended Travel (mm): 1.09Overall Length (mil): 495Overall Length (mm): 12.57Rec. Mounting Hole Size (mil): 67Rec. Mounting Hole Size (mm): 1.70Recommended Drill Size: #51Overall Length Remark: Overall length for E-S-V and E-S-W is .540 (13.72)
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Product
LFLT-1 High Performance Lead Free Long Travel Probe
LFLT-1
ICT/FCT Probe
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 400Full Travel (mm): 10.16Full Travel Remark: Standard Spring: 400 mil / 10,16 mm, Elevated Spring 350 mil / 8,89 mm, High Spring: 350 mil / 8,89 mmRecommended Travel (mil): 317Recommended Travel (mm): 8.05Mechanical Life (no of cycles): 500,000Overall Length (mil): 1,450Overall Length (mm): 36.83
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Product
CC30100X, 100 MHz, 30 Arms Current Oscilloscope Probe
785562-01
High Current Probe
The CC30100X, or Hioki 3276, is a clamp-on current probe that offers a wide DC to 100 MHz bandwidth and 30 Arms of continuous input. It is ideal for capturing transient current signals from switching power supplies, inverters, and motor controllers. The probe requires an external power supply.
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Product
Ultrasonic Wafer Scanner
AutoWafer
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Installed in more wafer applications than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, production-ready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.
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Probes
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measures relative pressure range from -1 to 60 bar and -14 to 870 psi and comes with wireless connection low energy.
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BIP-3 Battery Probes
Battery Probe
Current Rating (Amps): 5Average Probe Resistance (mOhm): 35Test Center (mil): 125Test Center (mm): 3.18Full Travel (mil): 100Full Travel (mm): 2.54Recommended Travel (mil): 60Recommended Travel (mm): 1.52Mechanical Life (no of cyles): 250,000Overall Length (mil): 511Overall Length (mm): 12.98
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Wafer Edge Profile Measurement
WATOM
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WATOM can carry out fully automatic, non-contact measurements of the edge profiles and diameter in accordance with SEMICON standards. A special feature is the system's ability to make measurements of the mark cut into the edge of the wafer to indicate the crystal orientation. Because of its high measurement accuracy of less than 1.5 µm, leading wafer manufacturers across the world use WATOM for shop-floor geometrical quality control.
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Product
In-Process Wafer Inspection System
7945
System
Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
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Product
P2663 General Purpose Probes
General Purpose Probe
Current Rating (Amps): 3Average DC Resistance lower than (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 90Full Travel (mm): 2.29Recommended Travel (mil): 67Recommended Travel (mm): 1.70Overall Length (mil): 810Overall Length (mm): 20.57
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Standard 0.50 (14.00) - 2.00 (57.00) Non Replaceable General Purpose Probe
A-A-S-C
General Purpose Probe
Current Rating (Amps): 2Average DC Resistance lower than (mOhm): 30Test Center (mil): 39Test Center (mm): 1.00Full Travel (mil): 30Full Travel (mm): 0.76Recommended Travel (mil): 20Recommended Travel (mm): 0.51Overall Length (mil): 310Overall Length (mm): 7.87Rec. Mounting Hole Size (mil): 31.5Rec. Mounting Hole Size (mm): 0.80Recommended Drill Size: #68 or 0.79 mm
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Product
Wafer Lifetime Measurement with Photoluminescence Detector
WCT-120PL
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Measure the calibrated carrier-recombination lifetime of a silicon wafer using both the standard method and the photoluminescence meth
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Product
Standard 0.62 (18.00) - 4.00 (114.00) High Performance Bias Ball Probe
POGO-1T24-4
ICT/FCT Probe
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Probes
RTD
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No matter the application, ThermoWorks has a probe for you: penetration probes, immersion probes, air probes, surface probes, wire probes, even specialized probes like griddle probes, burger probes, pipe clamp probes, and probes for medical and lab use. Choose from standard tip, reduced tip, corkscrew tip, alligator clip, or needle probes; different handle types; and straight, coiled, stainless overbraid or even armored cables. Sensor types include type T or type K thermocouples, RTD sensors and our Pro-Series® line of thermistor probes.
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Probes
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SHOCONA Probes are designed for non-vibrating, contact mode applications and are compatible with most commercially available SPMs/AFMs. These probes are nanofabricated using highly doped single crystal silicon with unparalleled reproducibility, robustness and sharpness for consistent high resolution imaging capabilities. This is a box of 10 probes.
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Semi-Automatic Contactless Wafer Detector
NCS-200SA
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Semi-Automatically, non-contact measurement of wafer thickness, TTV ,bow,Point and flatness.Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.the powerful software can test all the data above within several seconds,all the design according to SEMI standard and the ASTM,make sure the data can be easily unify. the system can used for several sample size,like 75 mm, 100 mm, 125 mm, 150 mm, 200 mm
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Light 0.83 (24.00) - 2.00 (57.00) High Performance Bias Ball Probe
POGO-1Z1-2
ICT/FCT Probe
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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G-S General Purpose Probes
General Purpose Probe
Current Rating (Amps): 5Average DC Resistance lower than (mOhm): 30Test Center (mil): 125Test Center (mm): 3.18Full Travel (mil): 100Full Travel (mm): 2.54Recommended Travel (mil): 67Recommended Travel (mm): 1.70Overall Length (mil): 780Overall Length (mm): 19.81Rec. Mounting Hole Size (mil): 86Rec. Mounting Hole Size (mm): 2.18Recommended Drill Size: #44
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Passive Probe, 10:1, 300 MHz, 1.2 M
N2842A
Oscilloscope Probe
The Keysight N2842A low-cost passive probe provides a 10:1 attenuation and features a high input resistance of 10 MΩ. The probe can be adjusted for low-frequency compensation and high-frequency compensation.
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High 1.73 (49.00) - 8.00 (127.00) High Performance Lead Free Probe
LFRE-1V-8
ICT/FCT Probe
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 500,000Mechanical Life Remark: *Ultra High force products may observe slight decrease in cycle life.Overall Length (mil): 1,300Overall Length (mm): 33.02
