Showing results: 2311 - 2325 of 2622 items found.
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Thermo Fisher Scientific Inc.
Thermo Fisher Scientific has developed a range of process, testing, and analytical solutions for semiconductor and integrated circuit manufacturers, petrochemical refineries, steel, aluminum, plastics, rubber, and nonwovens manufacturers, water analysis facilities, and more—all aimed at helping you achieve your business goals. Flow Measurement, Density Measurement, Level Measurement, Metals Coating Weight & Thickness Measurement Gauges, Moving Web Thickness & Weight Measurement Systems, Process Mass Spectrometers, Gas Moisture & Sulfur Analyzers, Petroleum Testing, Natural Gas Testing.
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Thermo Fisher Scientific Inc.
Identify and help correct ESD and latch-up susceptibility issues on sensitive integrated circuit components prior to full-scale production with the Thermo Scientific™ MK.2-SE ESD and Latch-Up Test System. The MK.2-SE test system provides advanced capabilities to test high pin count IC devices to Human Body Model (HBM) and Machine Model (MM) ESD standards. The system’s pulse delivery design addresses wave form hazards such as trailing pulse and pre-discharge voltage rise, and performs Latch-Up testing per the JEDEC EIA/JESD 78 Method.
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40-262-102 -
Pickering Interfaces Ltd.
The 40-262 is a 3U PXI module range that supports 6 (in one slot), 12 or 18 (in two slots) channels of RTD simulation. Based on the 40-260 design principles the module can provide a setting resolution of <8mΩ (PT100) or <90mΩ (PT1000) and a resistance accuracy of better than 0.1% on all channels. Each simulation channel is able to provide a short or open circuit setting to simulate faulty wiring connections to a sensor. Calibration or verification of each resistor channel can be verified by using the calibration port connected to a high performance DMM and a supplied software package.
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Dongguan Amade Instruments Technology Co., Ltd
Lithium battery test chambers are used to simulate various extreme conditions such as crush, impact, penetration, overcharge etc the lithium ion cells and batteries are subjected to during use, transportation, storage and disposal to determine the safety performances, tests including altitude simulation test, thermal test, vibration test, shock test, external short circuit test, impact/crush test, overcharge test, discharge test etc based on UN38.3, IEC62133, UL1642 standards. Applicable to communication products, computer products, consumer electronics, automobile power supplies and so on.
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PPTM01AS -
Matco Tools
*Connects with the new Power Probe Tek application for greater diagnostic functionality*The Maestro and Power Probe Tek App will be compatible to connect with a majority of diagnostic scan tools*Trace mode offers scope-like functionality*Stream and record visual traces of electrical issues found when diagnosing*DC voltmeter with the capability of applying battery supplied voltage or ground*AC voltmeter: TRMS, peak-to-peak/min/max, frequency, duty cycle*Resistance testing with a live or unloaded circuit*Fuel-injector test mode*Driver test for testing module drivers
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Wewon Environmental Chambers Co, Ltd.
In Wewon, We have 2 powerful Vibration Testing Equipment. The Vibration Testing Equipment A is : EV210H0808VCSusb-E; The Vibration Testing Equipment B is: EV232H0809VCSusb-E. Technical parameters as below blank forms mentioned, The mainly difference is Sine Excitation Force, Frequency Range, Vibration Table’s size. Application for Vibration Test Equipment : The vibration test is to inspire or impact a part or device to see how it reacts in a real environment. The application of vibration test is very extensive, from the circuit board, aircraft, ships, rockets, missiles, automobiles and household appliances and other industrial products.
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PP007-WS-1 -
Teledyne LeCroy
The PP007 embodies leading technology in passive probe design. The small probe is optimized for maximum waveform fidelity, including high frequency signal components, in a rugged probe suitable for every day.The sharp probe tip* is spring loaded, allowing it to retract into the narrow probe head. The tip does not slip off the object being probed—important when probing small geometry surface-mounted components. Probing dense circuits is easier with the small 2.5 mm ground sleeve, which provides much better visibility than 5 mm and 3.5 mm probes.
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PP007-WR-1 -
Teledyne LeCroy
The PP007 embodies leading technology in passive probe design. The small probe is optimized for maximum waveform fidelity, including high frequency signal components, in a rugged probe suitable for every day.The sharp probe tip* is spring loaded, allowing it to retract into the narrow probe head. The tip does not slip off the object being probed—important when probing small geometry surface-mounted components. Probing dense circuits is easier with the small 2.5 mm ground sleeve, which provides much better visibility than 5 mm and 3.5 mm probes.
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Teledyne LeCroy
Passive probes are the standard probe provided with most oscilloscopes. Typical passive probes provide a /10 attenuation and feature a high input resistance of 10 MOhm. This high input resistance means that passive probes are the ideal tool for low frequency signals since circuit loading at these frequencies is minimized. Passive probes are designed to handle voltages of at least 400 V, some as high as 600 V. Teledyne LeCroy passive probes feature an attenuation sense pin which tells the oscilloscope to scale the waveforms automatically requiring no user input.
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50-201-004 -
Pickering Interfaces Ltd.
This high bandwidth differential PCI fault insertion card is designed to simulate common faults on high speed two wire communication interfaces such as Ethernet. This card supports 4 or 8-channels of two wire serial connections and can be used for simulating faults on Ethernet, AFDX, Broad R-Reach, 100BaseT and 1000BaseT interfaces. Any wire can be set to an open circuit, shorts can be applied across the wire pair, or to the adjacent pair. Fault connections can be made to one of four external signals via two fault buses, typically simulating connections to a supply voltage or ground.
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50-201-008 -
Pickering Interfaces Ltd.
This high bandwidth differential PCI fault insertion card is designed to simulate common faults on high speed two wire communication interfaces such as Ethernet. This card supports 4 or 8-channels of two wire serial connections and can be used for simulating faults on Ethernet, AFDX, BroadR-Reach, 100BaseT and 1000BaseT interfaces. Any wire can be set to an open circuit, shorts can be applied across the wire pair, or to the adjacent pair. Fault connections can be made to one of four external signals via two fault buses, typically simulating connections to a supply voltage or ground.
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60-510-001 -
Pickering Interfaces Ltd.
The 60-510 is a high density 1-pole matrix module controlled via LXI. It has excellent thermal stability and substantially reduced thermal EMF figures when compared to a conventional switching matrix. Typical applications include signal routing in ATE, selecting thermocouple inputs, switching amplifier gain circuits and high accuracy DC micro-volt measurements. Ruthenium reed switches are used because of their good low level switching capability. They also have a very long life with excellent contact resistance stability, minimal wetting current and low thermal offset.
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60-510-021 -
Pickering Interfaces Ltd.
The 60-510 is a high density 1-pole matrix module controlled via LXI. It has excellent thermal stability and substantially reduced thermal EMF figures when compared to a conventional switching matrix. Typical applications include signal routing in ATE, selecting thermocouple inputs, switching amplifier gain circuits and high accuracy DC micro-volt measurements. Ruthenium reed switches are used because of their good low level switching capability. They also have a very long life with excellent contact resistance stability, minimal wetting current and low thermal offset.
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60-510-003 -
Pickering Interfaces Ltd.
The 60-510 is a high density 1-pole matrix module controlled via LXI. It has excellent thermal stability and substantially reduced thermal EMF figures when compared to a conventional switching matrix. Typical applications include signal routing in ATE, selecting thermocouple inputs, switching amplifier gain circuits and high accuracy DC micro-volt measurements. Ruthenium reed switches are used because of their good low level switching capability. They also have a very long life with excellent contact resistance stability, minimal wetting current and low thermal offset.
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HD-T1 -
Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
