Wafer Level Reliability
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Product
Probe Card
VC20E Series
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The 20mm VC20 is a highly adaptable probe card solution for a wide variety of tests including Modeling & Characterization, Wafer Level Reliability or Parametric Test. It can be easily combined with different interfaces to create modular probe cards supporting Keithley, Keysight or other custom tester platforms. Probes can be configured in either single or dual layer.
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Product
MPI Automated Probe Systems
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MPI Advanced Semiconductor Test
MPI’s 200 mm and 300 mm automated probe systems are dedicated and designed to address current and future requirements for all facets of Device Characterization for Modeling and Technology/Process Development, Failure Analysis, Design Verification, IC engineering, Wafer Level Reliability as well as special requirements for MEMS, High Power, RF and mmW device testing.
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Product
Probe Card
VC43™/VC43EAF™
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VC43™/VC43EAF™ probe cards offer a larger format version of the popular VC20. In addition to saving time, another advantage of the modularity is the ability to leave the interface in place and simply install the VC43™ topside using Celadon’s twist and lock insertion tool which minimizes the possibility of triboelectric or interconnect issues that can occur during typical probe card changes. The VC43™ can be used for production parametric test, modeling, characterization, and wafer level reliability testing. Cards can be configured up to 104 probes in either single or dual layer with near vertical probes to minimize scrub lengths on pads allowing the VC43s to probe pads as small as 30 microns.
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Product
Multisite Probe Card
T300 ButtonTile™
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The Celadon T300™ probe cards are designed for long-term, multi-site, high-density wafer level reliability or burn-in tests up to 400°C. In today’s economic environment, conventional reliability data is needed quickly while eliminating the cost, electrical stress, and delay of parts packaging while maintaining a wafer performance map.
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Product
Semi-Automated Probe Stations
SPS 2600, SPS 2800, and SPS 12000 Series
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The SPS 2600, SPS 2800, and SPS 12000 Series systems are MicroXact’s semi-automated probe stations designed to be flexible and easy to use when performing high productivity device characterization, wafer level reliability testing and failure analysis. These semi-automatic probe station systems are designed to support manual and semi-automatic probing of up to 200mm wafers.
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Product
Probe Card
T90™ Series
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The 90 mm tile was designed for mounting on a standard 4.5″ probe card holder for multi-site wafer level reliability testing. The 1.6 mm (0.062″) thick rails allow the chassis to slip into planarity adjustable probe card holders for most analytical probe stations.
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Product
MultiSite Test sockets and Wafer Level
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multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Product
Wafer Level Multi-Die Test System
ITC55WLMD
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The ITC55WLMD series of test systems has been developed by ITC to be stand-alone UIL test systems configured specifically to test on wafer. The systems include an ITC55series UIL tester and inductor box, a current limiter module and a system controller
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Product
Reliability Testing Services
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Innovative Circuits Engineering, inc
Our Reliability Testing Services make it possible for us to work with many different customers who manufacture devices that need tests such as pressure pot, temp cycle and more.The focus of our reliability testing lab is to provide our customers with an array of services and tests that fulfill all of their reliability testing needs. Whether you need preconditioning, thermal shock, pressure pot, or many other reliability testing needs, we are happy to be of service.
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Product
Wafer Level Test
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Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
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Product
Wafer Tester
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Tokyo Electronics Trading Co., Ltd.
A vital step in the Semiconductor Value Stream, focusing on electrical screening and consumption of Known Good Die (KGD).
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Product
Inspects MEMS and Wafer Level Devices
NorCom 2020-WL
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The NorCom 2020-WL is specifically designed for wafer-level inspection and leak tests up to 1000 devices per cycle. The system can inspect up to an 8” wafer on or off a saw frame. It is designed to test MEMS and other wafer level devices that have a cavity.
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Product
Reliability Testing
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ELES Semiconductor Equipment SpA
ELES designs and manufacturers reliability test solutions to verify the performance of integrated circuits from concept validation to high volume production during all the test phases. No other company can provide universal equipment for all the reliability tests, or can guarantee a seamless data flow between phases or can apply on chip embedded reliability engineering for data tracking and failure investigation. Clients use our functional test data to proactively analyse variations between lots, between temperature extremes and during lifetime (often these defects escape ATE). The improvements to products and processes needed to arrive at zero defects cannot be driven by the quantity of Big Data alone, the quality of reliability data is a strategic advantage that only ELES can provide.
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Product
Wafer Inspection Machine
IV-W2000
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The IV-W2000 is a wafer inspection machine that features on-the-fly scanning and inspection as well as automatic handling of 6/8/12-inch wafers. With the option to have a Chinese language UI, this machine is also known for being intuitive and user-friendly.
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Product
Wafer Sort
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TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
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Product
MBP Reliability Module MOSRA - TMI
W8614EP
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The W8614EP Model Builder Program (MBP)Reliability Module MOSRA - TMI includes the extraction package for MOS Reliability Analysis (MOSRA) and the TSMC Model Interface (TMI) aging model.
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Product
Level Measurement
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Omega provides contact and non-contact instruments for liquids, and non-contact instruments for solids. Choose from continious measurement or point level measurement with one of our level switches.
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Product
Wafer Thickness Measuring System
WT-425
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Contact type can measure any materials within 0.2 µm (2 σ at 20℃ ±1℃). The wafer floats positions while measurement points change and it does not damage even thin wafers. Best for the process control of compound wafers and oxide wafers. (SiC, GaN, LT, Sapphire and Bonded Wafers)
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Product
Wafer Test
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Silicon Turnkey Solution, Inc.
Most foundries provide wafers already probed to a set of DC parameters at room temperature to ensure they meet a basic subset of the package-part specification. Beyond this basic set of tests, more rigorous testing is often needed to meet specifications requiring die to be 100 percent probed, identify and segregate devices with higher performance levels and guarantee that parts will perform to a certain specification level.
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Product
Contactless Wafer Geometry Gauge
MX 20x series
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The E+H geometry gauges are based on two heavy plates mounted parallel to each other. Embedded in the plate are a set of capacitive distance sensors. The wafer will be moved manual or automatically between the plates and measured without any movement.
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Product
Level Translators
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ADI’s level translators offer the most flexible level translation solutions in the industry. The ADG3241 series translators allow direct 3.3 V to 1.8 V translation by means of the innovative SEL pin function while allowing bidirectional data transfer. The ADG3231 series allows wide range 1.65 V to 3.6 V translation and the ADG3308 series allows the industry's widest 1.2 V to 5.5 V up or down translation while permitting bidirectional data transfer.
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Product
Reliable Evaluation of Damping Materials and Composites
Carrousel
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Carrousel measures the dynamic vibration properties of coated or non-coated materials. The method is based on the classic "Oberst" procedure where Autoneum has improved both the measurement procedure itself and the mathematical model used to evaluate the results. The Carrousel software automatically calculates the damping loss factor at various conditions and temperatures as well as controlling both the Carrousel apparatus and the all-important temperature when measuring in a temperature chamber.
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Product
Portable Wafer Probe Station
PS-5026B
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High Power Pulse Instruments GmbH
The PS-5026B is a rugged portable wafer probing solution which has been designed for high reliability, compact size and minimum cost.
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Product
Level AFM
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Is a flexible Atomic Force Microscope for scientists. It offers a wide range of modes, sophisticated spectroscopy options and the programming of user defined experiments. Besides standard options found in Anfatec's other AFMs, the level AFM allows to add Anfatec's full range of AFM options, such as KPFM, closed loop operation, automated sample motion, acoustic enclosure, humidity and temperature control ... Each instrument is adapted to the user's specific needs.
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Product
Lighting Reliability
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LED/OLED package lifetime is highly dependent on thermal management, and LED lamp performance can be dependent on the luminaire in which it is installed. Lighting reliability test system for LED/OLED Products are widely used for normal /accelerated aging, lumen maintenance measuring, lifetime evaluation and temperature characteristic testing for LED/OLED products including LED package, array, module, OLED module and luminaires.
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Product
Silicon & Compound Wafers
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Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
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Product
Sound Level Meter
3M SE-402 | VP 185057
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Maschinenbau Haldenwang GmbH & Co. KG.
The 3M SE-402 of quality class 2 is the ideal sound level measuring device for almost every acoustical environment. The frequency weighting can be done according to the characteristics A, C and Z and the time weighting can be set to 'Fast' or 'Slow'. Ergonomically arranged buttons and the clear digital display (resolution 0.1 dB) ensure a high level of user-friendliness.
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Product
RF Automated Accelerated Reliability Test Station (AARTS)
RF-HTOL
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The RF Automated Accelerated Reliability Test Station (AARTS) systems are designed to stress devices with RF, DC, and thermal stimulus. The systems were designed from their inception to include RF stimulus - it was not added as an after-thought. Hence, the software and hardware are fully integrated and provide full-featured support.
