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are a PCB format of instrument.

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Showing results: 3031 - 3045 of 3348 items found.

  • 3U CompactPCI 9th Gen Intel® Xeon®/Core™ i7 Processor Blade

    cPCI-3520 Series - ADLINK Technology Inc.

    The cPCI-3520 Series is a 3U CompactPCI blade available in single-slot (4HP), dual-slot (8HP) or triple-slot (12HP) width form factors with various daughter boards to provide a broad range of I/O requirements. Faceplate I/O in the single-slot (4HP) version includes 1x DVI-I, 2x GbE and 1x USB 3.0 port (these I/O are common to all versions). Faceplate I/O in the dual-slot (8HP) version includes additional 2x USB 2.0, 1x COM, 1x KB/MS and Line-in/Line-out on the cPCI-3520D or additional 2x DisplayPorts, 1x COM in RJ-45 connector, 1x KB/MS and 1x additional USB 2.0 port on the cPCI-3520G. Two more dual-slot options are the cPCI-3520L with additional 2x GbE, 1x COM and 2x USB and the cPCI-3520M with one 100-pin high density connector supporting additional 2x DVI-D, 2x USB 2.0, 2x COM, 2x KB/MS and Line-in/Line-out ports.

  • Ultra-Low Power Computing Module

    CM22303 - LinkedHope Intelligent Technologies Co.,Ltd.

    CM22303 uses Intel® 7th generation Kaby Lake-Y platform and Core M Ultra low-power SoC processors, and integrates the full functions of CPU, GPU and South/North Bridge on a single chip. The processor provides powerful computing and display performance with dual-core and four threads configuration. Its turbo frequency can boost up to 3.6 GHz and the display output resolution can be up to 4K. CM22303 has an amazing thermal design power consumption of only 4.5W (TDP) and can be used for a variety of high-performance fanless designs. SPI BIOS is designed on board to support dual-channel low voltage on board memory (up to 16GB), Gigabit Ethernet, TPM module and other functions. With high-performance and low power consumption, it can be widely used in the field of low power embedded systems. Meanwhile, CM22303 adopts COM Express standard and is compatible with Type10 pin out definition, and also provides rich peripheral interfaces such as USB3.0/2.0, PCIe, SATA, HD Audio etc.

  • FPGA PXI High-Performance Digital I/O Card

    GX3702 - Marvin Test Solutions, Inc.

    The GX3702 is a user configurable, FPGA-based, 3U PXI card which offers 160 digital I/O signals which can be configured for single-ended or differential interfaces. The card employs the Altera Stratix III FPGA, which can support SerDes data rates up to 1.2 Gb/s, digital I/O clock rates of 700 MHz, and features over 45,000 logic elements and 1.836 Kb of memory. The GX3702 is supplied with an integral expansion board providing access to the FPGA's 160 I/Os and is pin for pin compatible with the NI PXI 7813R and 7811R FPGA cards . Alternatively, users can design their own custom expansion cards for specific applications - eliminating the need for additional external boards which are cumbersome and physically difficult to integrate into a test system. The design of the FPGA is done by using Altera's free Quartus II Web Edition tool set. Once the user has compiled the FPGA design, the configuration file can be loaded into the FPGA directly or via an on-board EEPROM.

  • Test & Support Gear

    Atec, Inc.

    Atec has experience with rugged and reliable equipment required for oil-field applications and the reputation for customer responsiveness and quick deliveries. Our energy history includes several years of re-engineering and manufacturing several test and support energy products. We have the ability to design, re-engineer and assemble items such as: junction boxes, cables, harnesses, printed circuit boards, computer systems, data acquisition software, valves, solenoids, & gear boxes.

  • Fully Automatic Close Link Single Phase Energy Meter Test bench

    SY8125 - Hong Kong Songyang Industrial Ltd.

    The devices are fully made by aluminum alloy materials and the table board is composed of fireproofing and heat-proof materials. ● The output voltage and current use soft startup and stop. It has the protection functions of voltage short circuit, current open circuit and power amplification exception.● The device has the features of high stability, good reliability and large output power. ● High level of autoimmunization. The coexistence of special small keyboard and PCs, convenience to use.

  • CompactPCI® Intelligent Chassis Management Module (PICMG® 2.9)

    MIC-3927 - Advantech Co. Ltd.

    The MIC-3927 is a proprietary form factor Chassis Management Module (CMM) intended for use with PICMG* 2.1, 2.16, and 2.9-compliant systems (the CompactPCI* Hot Swap, Packet Switching Backplane, and System Management specifications respectively). The MIC-3927 plugs into a dedicated slot in compatible systems. It provides centralized management and alarm notification for system power supplies and fans as well as single board operation status. The CMM may be paired with a backup for high-availability applications.

  • Dummy Components

    TopLine Corp.

    BGA and CCGA Column Grid Array, solder columns and a wide range of daisy chain semiconductor packages, and test vehicle PC boards. TopLine assists thousands of customers define and refine their SMT and microelectronics assembly processes. ver 1000 different dummy packages and practice kits. Typical applications include machine evaluation, acceptance testing, solder training, temperature profiling, re-certification, prototype design, practice and demonstrations.

  • PCIe Gen3 4K at 500 Fps High Speed Compact Camera for Testing

    CB160MG-LX-X8G3 - XIMEA GmbH

    4K at 500 Fps High speed, compact, fast camera for: Vehicle Impact, Airbag Deployment and Safety Restraints Testing, Digital Image Correlation (DIC), Projectile, Explosives, Ballistics, Combustion and Missile Launch Tracking, Fluid and Flow Visualization, Sports Broadcasting, Commercial Film, Television and Studio Production, Fluidics and Particle Image Velocimetry (PIV), Flat panel inspection (FPD), printed circuit board (PCB) examination and more.

  • PCIe Gen3 4K at 500 Fps High Speed Compact Camera for Testing

    CB160CG-LX-X8G3 - XIMEA GmbH

    4K at 500 Fps High speed, compact, fast camera for: Vehicle Impact, Airbag Deployment and Safety Restraints Testing, Digital Image Correlation (DIC), Projectile, Explosives, Ballistics, Combustion and Missile Launch Tracking, Fluid and Flow Visualization, Sports Broadcasting, Commercial Film, Television and Studio Production, Fluidics and Particle Image Velocimetry (PIV), Flat panel inspection (FPD), printed circuit board (PCB) examination and more.

  • PCIe Gen3 Full HD, High Speed, Compact Camera for

    CB019MG-LX-X8G3 - XIMEA GmbH

    Full HD, High speed, compact, fast camera for: Vehicle Impact, Airbag Deployment and Safety Restraints Testing, Digital Image Correlation (DIC), Projectile, Explosives, Ballistics, Combustion and Missile Launch Tracking, Fluid and Flow Visualization, Sports Broadcasting, Commercial Film, Television and Studio Production, Fluidics and Particle Image Velocimetry (PIV), Flat panel inspection (FPD), printed circuit board (PCB) examination and more.

  • Memory Burn-in Tester

    B6700 Series - Advantest Corp.

    B6700 can test as many as 48 burn-in boards in parallel at speeds up to 10 MHz, which helps memory suppliers get their newest products to market faster while also reducing testing costs. An original high performance chamber improves yield by assuring high temperature accuracy while generating high temperature. It also shortens the temperature rise and fall time which leads to shortening the test time.

  • PCIe Gen3 Full HD, High Speed, Compact Camera for Testing

    CB019CG-LX-X8G3 - XIMEA GmbH

    Full HD, High speed, compact, fast camera for: Vehicle Impact, Airbag Deployment and Safety Restraints Testing, Digital Image Correlation (DIC), Projectile, Explosives, Ballistics, Combustion and Missile Launch Tracking, Fluid and Flow Visualization, Sports Broadcasting, Commercial Film, Television and Studio Production, Fluidics and Particle Image Velocimetry (PIV), Flat panel inspection (FPD), printed circuit board (PCB) examination and more.

  • Thermal Cycling Test Equipment

    Wewon Environmental Chambers Co, Ltd.

    IC welding to PCB, IC is integrated in the chip general purpose circuit, it is a whole. Once the inside is damaged, the chip will be damaged. The goal of printed circuit boards (pcbs) is to connect IC and discrete components to form a larger working circuit. Thermal cycling equipment can detect the defects and hidden dangers of welding components in the production process, decreasing failure rate. When it fails, components can be replaced in timehttps://www.wewontech.com/thermal-cycling-test-equipment/

  • Consulting Services

    TEM Consulting, LP

    Standards and Regulatory Management. Standards Development. Regulatory (FCC, FDA, Access Board). Areas of Technical Excellence: Electromagnetic Compatibility, Disability Access, Wireless Requirements, RF Safety (EMF & SAR), Product Compliance, Quality & Conformity Systems, Measurement of Electromagnetic Fields. Training - We offer a variety of course in various areas of compliance and technology. We also provide custom training, tailored to your needs, in our areas of expertise.

  • Transceiver Driver

    S-112 - Notice

    Transceiver Driver slot module of FOTS system is an efficient module for the characterization of SFP type transceiver and the test of optical line or components. This module is a kind of Small Form Factor Pluggable(SFP) host board that can be used to test SFP transceiver modules to define the modules’ performance. The transceiver driver slot has two SFP cage and 20-pin SFP connector sets to mount and control two SFP transceivers simultaneously.

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