Showing results: 3151 - 3165 of 3346 items found.
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COM Express Type 10 Starter Kit Plus -
ADLINK Technology Inc.
The COM Express Type 10 nanoX Starter Kit Plus consists of a COM Express Type 10 core module reference carrier board that provides two PCIe Mini Card slots, 2 RJ-45 LAN ports, 2x USB 3.0, 2x USB 2.0, 1x USB client, 2x DB-9 COM, 1x SD card socket, and Mic/Linein/ Line-out. ADLINK also provides additional development tools including a verified 10.1" LVDS panel (optional), power supply, thermal solution and cabling accessories.
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40-550-002 -
Pickering Interfaces Ltd.
Connections are made via a front panel 37-way D-Type male connector or two 20-way GMCT male connectors. Used for switching inductive/capacitive loads up to 5A at 250VAC. Power matrix modules are intended for switching heavy AC or DC loads or for slaving up to large external relays, contactors and solenoids. Used for applications requiring switching of either mains voltage or direct current. These modules are fitted with electro-mechanical power relays, gold-flash over silver alloy. A spare relay is built onto the circuit board to facilitate easy maintenance with minimum downtime.
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Delta MATRiX -
Cohu, Inc.
Cohu’s MATRiX handler has a highly flexible test site configuration that’s well suited for a wide range of test applications, including analog ICs with short test times and high throughput, automotive devices requiring accurate thermal control, small pitch wireless-communication products, high parallel microcontroller testing, MEMS device testing, and many other device market segments with their unique requirements. The MATRiX has a highly flexible test site configuration that enables customers to reuse existing load-boards, including boards made for competitor’s legacy handlers.
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MISS -
BioAge s.r.l.
The Micro Smart System is one of the many autonomous systems with very low consumption designed by BioAge. The system is characterized by autonomous operation with very low energy consumption thanks to its operation in "Energy Harvesting" which allows to exploit the power supply from a micro solar panel with which each sensor is equipped. Furthermore, these systems are equipped with radio frequency communication able to remotely transmit the information acquired by the sensors on board, it is therefore possible to create a network of sensors, operating autonomously and with a very high autonomy thanks to solar energy.
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Analog Devices Inc.
Analog Devices digital-to-analog converter (DAC) portfolio provides solutions for your high speed and precision DAC applications. Thanks to complete data sheets and evaluation boards, as well as broad support among our clock and timing, RF, power management, and op amp portfolios, our DACs can help you reduce time to market and system design costs. A high speed range from 30 MSPS to multi-GSPS, 8- to 16-bit resolution, and a tiny package are just some of the features that make our industry-leading d/a converters stand out.
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Wewon Environmental Chambers Co, Ltd.
In Wewon, We have 2 powerful Vibration Testing Equipment. The Vibration Testing Equipment A is : EV210H0808VCSusb-E; The Vibration Testing Equipment B is: EV232H0809VCSusb-E. Technical parameters as below blank forms mentioned, The mainly difference is Sine Excitation Force, Frequency Range, Vibration Table’s size. Application for Vibration Test Equipment : The vibration test is to inspire or impact a part or device to see how it reacts in a real environment. The application of vibration test is very extensive, from the circuit board, aircraft, ships, rockets, missiles, automobiles and household appliances and other industrial products.
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GX3500 -
Terotest Systems Ltd.
The GX3500 is a user configurable 3U FPGA PXI card which offers 160 digital I/O signals for specific application needs. The card employs the Altera Cyclone III FPGA which can support clock rates up to 150 MHz and features over 55,000 logic elements and 2.34 Mb of memory. The 3U PXI FPGA card GX3500 can also accept an expansion card assembly which can be used to customize the interface to the UUT – eliminating the need for additional external boards which are cumbersome and physically difficult to integrate into a test system.
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GX5733 -
Terotest Systems Ltd.
The GX5733 is a 3U modular digital I/O card that offers up to 128 I/O channels. Designed for ATE, data acquisition, or process control systems where a large number of discrete I/O channels are required, the GX5733 offers the highest channel density and flexibility in the industry for a single slot, 3U PXI plug-in board. 96 channels support TTL levels and an additional 32 I/O channels can be customized by installing one of Marvin Test Solutions' GX57xx series I/O modules. Alternatively, the remaining port can be configured to support 32 TTL channels.
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HD-T1 -
Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
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TPCE278 -
TEWS Technologies GmbH
The TPCE278 is a standard height PCI Express Revision 3.0 compatible module that provides one slot for a single-width XMC module used to build modular, flexible and cost effective I/O solutions for all kinds of applications like process control, medical systems, telecommunication and traffic control. The TPCE278 is a versatile solution to upgrade well known XMC I/O solutions to the PCI Express signalling standard. The PCI Express x4 link from the host board to the XMC module is enhanced by a PCIe Gen3 Redriver, allowing safe operation of XMC modules on PCIe mainboards.
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HGM-MZ -
IMR Environmental Equipment, Inc.
The Multi-Zone Monitor provides continuous detection of refrigerant gas levels in up to 16 separate test zones and can be fitted with an optional two channel 4-20 mA current loop board for connection to remote monitoring equipment. Multi-Zone monitors retain a log of previous readings that can be easily accessed for analysis. Four relay contacts are provided that can be programmed to trigger external alarm devices in the event of a system fault, or if a leak (small), spill (medium) or evacuation (large) level of gas is detected, while audible and visual front panel indicators show alarm and fault conditions.
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NEOSEM TECHNOLOGY INC
The N3500 is Neosem Technology’s fourth generation memory test system. Specifically designed for Flash Components and Flash Cards, the N3500 tester-on-a-board architecture targets the broadest range of DUT technologies in various form factors and packages. Each Tester Board (or “Blade”) contains 288 I/O pins and 32 DPS supplies. Up to 64 Blades populated in one test head can test over 2000 DUTs in parallel. Neosem Technology’s high parallel DUT count architecture, combined with low capital cost, provides the absolute lowest HVM cost of test.
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WT-100 -
Thermal Engineering Associates, Inc.
The WT-100 Forced Convection (Moving Air) Wind Tunnel is designed in accordance with the EIA/JEDEC JESD51-6 standard for thermal characterization of semiconductor packages and devices. The vertical design minimizes laboratory floor space requiements. Air is drawn in at the bottom and exhausts at the top. The test section is large enough to accommodate the largest JEDEC and SEMI thermal test boards. Air velocity can be adjusted over the range of 0.5 to 5 m/s; air velocity is monitored with an included hot-wire anemometer connected to a digital display. A Type-T thermocouple is mounted in the test section for monitoring the moving air temperature.
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PIRT1280A1-12 -
Princeton Infrared Technologies, Inc.
This lattice matched InGaAs 2D SWIR focal plane array (FPA) allows for high resolution SWIR imaging at high frame rates >90fps. This small pitch array, 12μm, combined with the high quantum efficiency of the lattice matched InGaAs arrays enables impressive imaging in the SWIR band. It boasts an on board 14-bit A/D with very low read noise of <45e- per read. Princeton Infrared Technologies, Inc. offers this low power SWIR array by itself or in a TEC cooled package. It is also incorporated with camera electronics for a complete solution.
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ScanExpress TPG -
Corelis, Inc.
To deliver a product meeting the highest standards of quality and reliability, design engineers and test engineers alike must maintain test capabilities throughout the entire product life cycle, from prototype to manufacturing. Automation in test generation is essential to ensure that tests keep up with the rapid development of modern products.The ScanExpress TPG™ Intelligent Test Pattern Generator Software provides a highly advanced, automated boundary-scan test design environment—perfect for quick and efficient creation of complete boundary-scan tests for all IEEE-1149.1 and IEEE-1149.6 compliant circuit boards.
