Showing results: 616 - 630 of 644 items found.
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DI-NH3 -
MKS Instruments
MKS' DI-NH3 is a compact, stand-alone system providing dissolved ammonia water. With Semiconductor 3D IC architectures using new materials like Cu-Co and Si-SiGe, the ability to wet clean with precise alkaline chemistries is growing in frequency and importance. The DI-NH3 delivers dissolved ammonia, providing optimal cleaning capability in an alkaline chemistry, minimizing material loss and contamination and inhibiting Electrostatic Discharge (ESD). Using closed-loop control, conductivity and pressure are kept stable under changing flow conditions. The dissolved ammonia concentration is monitored and adjusted, delivering the specific NH4OH concentration needed. Dissolved ammonia’s alkaline chemistry provides ESD protection during rinsing, particle lift-off, and residual photoresist removal in middle-of-line (MOL) and prevents corrosion of cobalt/copper interfaces.
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EV Group
ith over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions. Multiple bonding methods including anodic, thermo compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a unique modular bond chamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production.
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ARC Technology Solutions
Have time to market pressure and need to get a system or assembly or production line up and running quickly? Need to rapidly build out a solution, but don’t want to spend months on building up an architecture? Allow our rapid prototyping team to assist you – whether it is crafting 3D printed mechanical assemblies or a building up a high speed IO interface, you are in very capable hands with the ARC engineering team. Our DSX product, can help support your IP, implement your process or and be the core processing engine for your design, or if a larger system, DSX could be an integral part of your system. PVS, another tool that can help error-proof your assembly process, is ready to go in a flexible, software-centric solution that you can be reconfigured as needed to meet your changing demands.
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Robson Technologies, Inc.
RTI designs and manufactures DUT boards for many types of special purpose test equipment including: ESD test systems, special purpose functional testers, automated curve trace equipment, as well as standard semiconductor test equipment. All designs are performed in-house using PCB design software (Mentor PADS, CAM350) and 3D mechanical design software (Solid Edge) if required. PCB fabrication is sub-contracted to one of our long-time fabrication partners.
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Raymond RF Measurements Corp.
Raymond RF's Antenna Measurement Software performs 2-D (polar/rectangular) and 3-D (spherical) antenna pattern measurements for passive antennas and active wireless mobile stations (cell phones). Insertion loss of passive devices is included as part of the calibration component. Data management and reporting of antenna properties such as half power beam-width, directivity, gain, radiation efficiency, total radiated power, and total isotropic sensitivity. AMS performs and reports all measurements required by the CTIA Over-the-Air Performance Test Plan.
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VQDM-100 -
VideoQ Inc
Versatile compact and robust multi-purpose tool for R&D and glass-to-glass QA/QC Instant visual-aural quality estimation plus automatic latency, AV sync and 3D LR sync measurement Multi-channel time-line analysis, including video frames continuity testing 4 Light Sensors with vacuum caps, 4 Audio inputs (standard line levels) 2 channels of AV timing analysis, simultaneous measurements of Video and Audio Latencies Real time multi-channel data acquisition via USB port Unique sophisticated set of static and dynamic test patterns up to 1080p@60fps - see more details in separate VQL page Source of VQDM, VQMA2, and VQMA3 Test Patterns for VideoQ Analyzers Multi-format digital and analog AV outputs: HDMI, YPrPb, S-video, SPDIF, LR analog audio Networkable unit, easy expansion with any external USB storage device: live clips, user content, etc.
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CEM300 -
Axiomtek Co., Ltd.
The CEM300, a COM Express® Type 10 module, supports Intel® Pentium® N3710 and Celeron® N3160/N3060 quad-core/dual-core processors (codename: Braswell) with support for 4 GB DDR3L memory onboard. Integrated with Intel® Gen 8 graphics, the COM Express® Type 10 computer-on-module provides excellent graphic performance including support for DirectX 11.1, OpenGL 4.2, and 3D features and resolution up to 4K (3840 x 2160 @ 30 Hz). The ultra-small mini module comes with 4 to 6 watts low power consumption, and provides wide range voltage power input of 4.75V to 20V for harsh industrial environments. The Axiomtek CEM300 is ideal for IoT-connected industrial controls, medical imaging, retail equipment, MMK (Multi Media Kiosk), industrial gateway, automation and POS terminals related applications.
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CAPA110 -
Axiomtek Co., Ltd.
Axiomtek's CAPA110, a high-end graphics 3.5" embedded board is equipped with the latest AMD G-series APU dual core T56N 1.65GHz and AMD FCH A50M chipset, which is a wonderful choice for graphics-intensive applications such as high-end medical imaging, digital signage, kiosks/POI, thin clients, and gaming machines. One SO-DIMM socket on the CAPA110 supports up to 4GB of DDR3 1333 memory. The integrated Radeon™ HD6320 graphics controller delivers unprecedented high definition visual experience and offers outstanding 3D performance with DirectX 11 supported. Dual display capability is supported via the VGA and DisplayPort connections on the coastline, as well as onboard 18-bit/24-bit LVDS interface. Besides, the CAPA110 provides high-bandwidth expansion capability with one PCI Express Mini card for custom system configurations. Moreover, the system only requires +12V DC power input.
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AOSense
Detailed description of item: Complete cold atomic beam sources for alkaline-earth precision experiments and atomic devices. Small chambers with patented permanent-magnet Zeeman slowers and in-vacuum 2D MOT optics allow high flux with low outgassing and no thermal beam flux at the cold atom port, which provides a CF-133 connection to customer vacuum chamber. Advanced thermal design of the effusion oven allows long-lifetime operation at minimal heating power, with no water cooling. An integrated low-outgassing hot window is provided for coupling of on-axis Zeeman cooling light. Ion and getter pumps integrated into the chamber manage outgassing from the oven at temperatures up to 520 °C. Operating baseline pressures below 1×10-11 mbar can be attained in the customer’s downstream cold atom (typically 3D MOT) science chamber, with suitable pumping speed provided at the differentially-pumped cold beam output port.
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AMP-204C/AMP-208C -
ADLINK Technology Inc.
ADLINK"s new AMP-204C/AMP-208C DSP-based 4/8-axis advanced pulse-train motion controllers incorporate up-to-date floating-point DSP and FPGA technology, enabling high pulse output and encoder input frequency up to 6.5 MHz and 20 MHz respectively. Leveraging ADLINK" s Softmotion technology, the AMP-204C/AMP-208C offer impressive comprehensive and application-oriented motion functionality to reduce development time while maintaining superior throughput and accuracy. Superior synchronous motion control performance combines with point-table function integrating multi-dimensional interpolation, such as 3D linear/circular/spiral interpolation with enhanced trajectory and velocity planning, for contouring applications in semiconductor, display and conventional manufacturing industries. The AMP-204C/AMP-208C also support PWM control with three different control modes for frequency or duty cycle, benefiting laser engraving/marking/cutting applications. Moreover, hardware-based position comparison and trigger output are applicable in AOI applications.
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Machine Vision Products
Machine Vision Products, Inc. has extensive experience in a wide range of Microelectronics and Packaging applications. MVP works with the world’s leading manufacturers on a global basis. From multiple die and wire technologies to leadframe, ball grid array and surface inspection applications, MVP has the widest applications toolbox of any AOI provider. MVP takes pride in the fact that they supply many complex inspection solutions to diverse industries such as Automotive, Telecoms, Medical Devices, Military, and Space. MVP’s 900 Series is the base platform upon which all Microelectronics and Packaging inspection solutions are based. The 900 series 2D capabilities provide metrology and defect detection using a propriety Quad-Color lighting, Telecentric optics and resolutions down to 1um. 3D height measurement capabilities allow for in-line high speed inspection of Dies, paste deposition, positional accuracy, volume and height with a resolution down to 1.13um.
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Sinowon Innovation Metrology Manufacture Ltd.
◆ The lifting system adopts linear guide rail and precision screw drive, which makes the lift drive more comfortable and stable;◆ With precision toothless rod and fast movement locking device, ensure return error is within 2um;◆ High accuracy A optical scale and precision working stage, ensure machine accuracy is within 3+L/200 um;◆ HD zoom lens and HD color digital camera, ensure clear image without distortion;◆ With programmable surface 4-ring 8-division LED cold light and contour LED parallel illumination, it can control the brightness of the 4-ring 8-division independently;◆ With powerful iMeasuring2.1 software system , to enhance the control quality;◆ Optional imported contact probes and 3D measuring software, it can help upgrade the machine to be coordinate measuring machine;◆ Optional FexQMS measurement data analysis and real-time monitor software, enhance process control, reduce material consumption;
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MANO120 -
Axiomtek Co., Ltd.
The MANO120, a graphics-rich Mini ITX motherboard is based on the new AMD G-Series APU dual core T56N with AMD A55E FCH. Integrated with Radeon™ HD 6320 graphics with DirectX 11 technology, the MANO120 offers advanced 3D graphics and dual views via VGA and HDMI connection on the rear I/O, as well as onboard 18 bit single channel LVDS interface. The onboard SO-DIMM socket supports up to 4 GB of DDR3 1333 memory. It also has a wide range of storage with five SATA-600 ports and a mainstream CFast™ slot. To satisfy expansion capability requirement for industrial application needs, the MANO120 comes with one PCIe x4 slot and one PCI Express Mini Card slot. With advanced performance in both computing and graphics, this industrial grade motherboard meets the requirement of system developers in the gaming, digital signage, DVR, and NVR.
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Keysight Technologies
GoldenGate RFIC Simulation and Analysis Software is an advanced simulation and analysis solution for integrated mixed signal RFIC designs that is fully integrated into the Cadence Analog Design Environment (ADE). GoldenGate is part of Keysight's RFIC simulation, analysis and verification solution that also includes Momentum for 3-D planar electromagnetic simulation, SystemVue & Ptolemy wireless test benches for system-level verification, and the Advanced Design System (ADS) Data Display for advanced data analysis. This suite links the RF system, subsystem, and component-level design and analysis as part of a unique and comprehensive RFIC design flow.
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EP100 -
Axiomtek Co., Ltd.
The EP100 EPIC board, supporting either the AMD G-Series APU dual core T56N with Radeon™ HD 6320 graphics or AMD G-Series APU single core T40R with Radeon™ HD 6250 graphics, combined with the AMD A50M FCH, is ideal for graphics-intensive applications such as high-end medical imaging, digital signage, kiosks/POI, thin clients, and gaming machines. The onboard SO-DIMM socket supports maximum up to 4 GB of DDR3 1333 memory. Integrated AMD HD graphics with DirectX 11 technology, the small foot print embedded board offers stunning 3D visual effects and dynamic interactivity. The EP100 comes with three display outputs with two combinations: two DisplayPort and one VGA or one DisplayPort plus a VGA and 18/24-bit single/dual channel LVDS. Additionally, it provides dual gigabit LAN ports for high-speed wired communication and two PCI Express Mini card expansion interfaces, one with SIM slot, for seamless wireless communication (WiFi + 3/4G).
