Showing results: 346 - 360 of 643 items found.
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EDGEINSPECT -
NOVACAM Technologies, Inc.
NOVACAMTM EDGEINSPECTTM system is a modular, non-contact 3D metrology system that:Measures, down to the micron, any type of edge: cutting edges, inside or outside edges, edges on round holes, straight edges, etc.
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GEA 3 -
PASI srl
Gea3 is a 24-bit real data acquisition seismograph in a waterproof container.This small, extremely lightweight instrument is equipped with 3 channels+one displayable trigger channel and is the perfect solution for a variety of applications: *DOWN-HOLE seismic measurements with the use of a 3D well geophone (such as PASI Mod.GFA or Mod.DHTG)*CROSS-HOLE seismic measurements combined with a 3D well geophone (such as PASI Mod.GFA or Mod.DHTG) and a P/S hole energizersmall-scale seismic refraction with surface geophones and 3-channel seismic cable*MASW and Vs30 profiles with a special triaxial geophone (like PASI Mod.3DLG - 2Hz)
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BuildIT Construction -
BuildIT Software & Solutions Ltd.
BuildIT Construction is a construction verification software solution that enables AEC professionals to facilitate and accelerate prefabricated part positioning and monitoring, validation to BIM and project evaluation with high accuracy by using 3D analysis in adherence to design and structural specifications. Utilizing BuildIT Construction allows users to drastically reduce costs and detect errors early on to avoid expensive rework. Leveraging the robust and powerful platform of BuildIT’s cutting-edge 3D metrology software for manufacturing, BuildIT Construction addresses all quality assurance and quality control processes throughout the building and facility lifecycle.
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E3300 Family -
Advantest Corp.
The E3310 is a WAFER MVM-SEM* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Bruker Corporation
Have you ever seen images from a medical CT-scanner? Now, the same technique can be applied to your micro samples! SkyScan systems from Bruker microCT allow you to cut virtual sections or even fly through samples non-destructively. No preparation, coating or vacuum treatment is needed. Bruker microCT micro-tomography is available in a range of easy-to-use desktop instruments, which generate 3D images of your sample’s morphology and internal microstructure with resolution down to the sub-micron level. Software for visualization and analysis in 3D is included with all SkyScan systems.
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Pixie -
Ginolis Ltd.
3-D Metrology for automation. Pixie is a standard system for automated optical quality inspection. Pixie can be configured with 2 to 5 servo driven axis movement and the high-speed measurement capabilities make it suitable for inline and stand-alone solutions.
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Aerotech, Inc.
Aerotech supplies high-performance 2D, 3D and 5D laser scan heads to meet a diverse range of precision manufacturing challenges. Choose from standard options or leverage our expertise in designing laser manufacturing systems.
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Fraunhofer-Gesellschaft
The Fraunhofer IOF develops optical measurement methods and systems to customer requirements. Key areas include the characterization of optical and non-optical surfaces, coatings, components and systems in the micro and sub-nano range as well as 3D shape acquisition.
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Laser Design Inc.
3D Laser Scanning Probes for your existing CMM are options for full-time or part-time use. Laser Design’s broad range of scanning probes ensures a perfect fit between the scanner and the size and detailed features of your parts.
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Basler Vision Components AG
The Basler Time-of-Flight (ToF) Camera provides high resolution 3D images at a very attractive price/performance ratio. It delivers 20 frames per second with VGA resolution and has a working range of 0 to 13 meters.
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VisionX Inc.
Fully-automated and high-accuracy 3D inspection and measurement systems. High-power, long working distance optics and high-resolution digital camera are perfect for high-magnification applications. These are full-color systems capable of high-accuracy measurements, automated defect detection and color verification.
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Crystal instruments
EDM Modal Geometry/ODS/Animation is the primary EDM Modal software module, and is required for every EDM Modal system. This option provides fast and efficient structural model generation and full 3D visualization of test and analysis results.
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ZEISS Xradia Ultra -
Carl Zeiss AG
Synchrotron X-ray nanotomography enables non-destructive 3D imaging at the nanoscale but you have to apply for very limited beamtime. What if you didn’t have to wait for synchrotron time anymore? Imagine if you had synchrotron capabilities in your own lab. With the ZEISS Xradia Ultra family, you have 3D non-destructive X-ray microscopes (XRM) at hand that deliver nano-scaled resolution with synchrotron-like quality. Choose between two models: both ZEISS Xradia 810 Ultra and ZEISS Xradia 800 Ultra are tailored to gain optimum image quality for your most frequently-used applications.
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QWED Sp. z o.o.
QW-Modeller for QuickWave is a workbench for the open source FreeCAD general purpose parametric 3D CAD modeller (http://www.freecadweb.org). FreeCAD features tools are similar to Catia®, SolidWorks®, or Solid Edge®. It is a feature-based parametric modeller with a modular software architecture, which makes it easy to provide additional functionalities without modifying the core system. The CAD capabilities of FreeCAD are based on the OpenCasCade® kernel, a professional-level CAD kernel, featuring advanced 3D geometry manipulation on complex shape types, a wide range of geometric entities, boolean operations and fillets, and built-in support of STEP and IGES formats.
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E3310 -
Advantest Corp.
The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
