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Showing results: 601 - 615 of 639 items found.

  • Multibeam Profiling Software

    MB-DataLogger - Teledyne Marine BlueView

    Teledyne BlueView's MB-DataLogger software provides a powerful tool for multibeam profiling applications. From mission setup to data playback, review, and export, MB-DataLogger gives users full end-to-end mission support. Set up data collection parameters (sonar head range, ping rate, filename identifiers, etc.) for a SmartCore-enabled system prior to deployment, then review bathymetric profiles in a 2D or 3D waterfall display with or without navigation correction post mission. When regions of interest are identified, export batches of data files to georeferenced point clouds to be imported by third-party applications. MB-DataLogger is the software Swiss army knife for your BlueView multibeam profiling system.

  • OCEAN BOTTOM SEISMOMETERS (OBS)

    Güralp Systems Ltd

    Aquarius is a stand-alone free fall OBS with acoustic data telemetry for deployments at depths of up to 6000m for up to 18 months duration.The system is available in two variants depending on the application and required timescales between battery charge.Aquarius - for seismic research, when data transfer is needed only at the installation and at the recovery of the OBSAquarius+ - for seismic research and alert, when data transfer is required either on trigger, or on demand at any point during the deployment windowBoth systems are equipped with a digital feedback tri-axial broadband seismometer, operational at any angle and with a configurable long-period corner. A three-axis magnetometer and a MEMS accelerometer record the seismometer’s 3D position on the seabed for data rotation during post-processing.

  • Laser Scanner

    FARO Focus3D - FARO Technologies, Inc.

    The smallest and lightest laser scanners on the market - Focus3D X Series are ideal tools for indoor and outdoor applications. The fast and accurate laser scanners Focus3D offer everything you might expect from professional 3D laser scanners with FARO's established and well-known level of simplicity. Focus3D X 330 offers extra long range - 330m, Focus3D X 130 is a mid-range device offering precise scanning up to 130m. Both scanner models are equipped with GPS and offer the possibility to perform scanning even in bright sunlight. Remote scanning as well as almost limitless scan data sharing via SCENE Webshare Cloud make the laser scanning solution truly mobile.

  • Receiver

    vLoc3-Pro - Vivax-Metrotech Corp

    The vLoc3-Pro utility locator introduces new innovative tools for locating buried utilities assuring damage prevention while gathering information for analysis. With two sets of screened 3D antennas signal distortion is easily detected and displayed on the bright full color display. Along with classic locate screens the vLoc3 series locators offer new locate perspective screens of Vector Locate for fully automatic non-walk over locating, Transverse Graph showing both peak and null simultaneously providing immediate measurement of signal distortion, Plan View showing the relative orientation of the cable at any angle, and a new graphical Sonde screen with guidance arrows leading to the sonde location even when it is vertical.

  • Aurora®

    Northern Digital Inc.

    The Aurora® electromagnetic tracking solution provides unobstructed real-time tracking of micro sensors that can be embedded into rigid and flexible OEM medical instruments such as ultrasound probes, endoscopes, catheters, guidewires – even at the tip of a needle. With the Aurora® electromagnetic tracking solution, no line-of-sight is needed for in-vivo tracking of instruments through twisting anatomical tracts. When integrated as a component into the workflow of OEM image-guided surgery or interventional systems, the Aurora acts as the link between patient image sets and 3D space, enabling the instruments’ positions and orientations to be instantly localized and visualized within the operative field. It does so with the exceptional speed, accuracy, and precision required by today’s most demanding minimally invasive approaches.

  • SIMRC - 16 x Uncommitted Reed Relay, SPDT

    1010-R-16-1-5/3D - Pickering Interfaces Ltd.

    Our small format embedded switching (SIM relay) cards offer a choice of switching configurations using low cost industry standard SIM connectors. They free the designer from the detail of routing complex switching circuits, you may select from a wide range of cards using the built in RS-232 and I2C interfaces. These low-cost embedded switching cards are intended to be mounted on to a simple motherboard. They may be used to construct very high density switching networks. SIM based switching cards also allow for very simple in-field maintenance.

  • Measurement Of Straightness, Flatness, Positioning Uncertainty Of Round Tables

    ELCOLEVEL - Software For 3D-straightness Measurement - Optik Elektronik Gerätetechnik GmbH

    ELCOLEVEL is a software with interfaces to electronic autocollimators and inclination levels of different manufactureres. This allows for example the 3D-Straightness measurement (twist-, roll- and yaw-angle) of slides in one and the same measuring procedure.

  • Vision Systems

    ADLINK Technology Inc.

    Embedded vision systems, also referred to as compact vision systems, offer an alternative to Smart cameras and computer-based systems. The ADLINK EOS series is a complete embedded system that offers image acquisition, processing, archiving, and display capabilities. It is equipped with a multi-core CPU, ideal for applications requiring high computing power and multi-camera imaging, such as 3D vision and robotics guidance. Featuring rich I/O connectivity with factory-floor networks, including RS-232/422/485, USB, and isolated digital I/O, as well as onboard storage, ADLINK’s embedded vision system is ready to deploy. A system monitoring feature, feeding back temperature and voltage data, combines with a watchdog timer to maximize robustness and reliability of the ADLINK EOS series in mission critical applications.

  • Optical Sensor Test

    Cohu, Inc.

    For optical sensor test Cohu offers a variety of solutions being driven by requirements for tri-temp, parallelism and stimulus spacing. Customized optical stimulus units are integrated into Cohu’s test handling systems. For light detector test, we implement different types of light sources, such as infrared, ambient- and colored light. We offer different solutions for 3D image sensors combining emitter and receiver tests of LiDAR, Time of Flight and Structured Light devices.

  • DUT Boards

    Robson Technologies, Inc.

    RTI designs and manufactures DUT boards for many types of special purpose test equipment including: ESD test systems, special purpose functional testers, automated curve trace equipment, as well as standard semiconductor test equipment. All designs are performed in-house using PCB design software (Mentor PADS, CAM350) and 3D mechanical design software (Solid Edge) if required. PCB fabrication is sub-contracted to one of our long-time fabrication partners.

  • MultiBeam System

    FIB - JEOL Ltd.

    An easy-to-use, out-lens type scanning electron microscope (SEM) equipped with a Schottky electron gun, as well as a new FIB column capable of large current processing (maximum ion current 90nA) installed into one chamber. JIB-4610F enables high-resolution SEM observation after high-speed cross-section milling with FIB, and high-speed analysis with a variety of analytical instruments, such as energy dispersive X-ray spectroscopy (EDS) that takes advantage of the Schottky electron gun delivering a large probe current (200nA), electron back scatter diffraction (EBSD) to perform crystallographic characterization, and cathodoluminescence (CLD). In addition, the 3D analysis function Cut & See is included in the standard configuration, allowing cross-section milling to be executed automatically at fixed intervals, while acquiring SEM images for each cross section.

  • Dissolved Ammonia Delivery System

    DI-NH3 - MKS Instruments

    MKS' DI-NH3 is a compact, stand-alone system providing dissolved ammonia water. With Semiconductor 3D IC architectures using new materials like Cu-Co and Si-SiGe, the ability to wet clean with precise alkaline chemistries is growing in frequency and importance. The DI-NH3 delivers dissolved ammonia, providing optimal cleaning capability in an alkaline chemistry, minimizing material loss and contamination and inhibiting Electrostatic Discharge (ESD). Using closed-loop control, conductivity and pressure are kept stable under changing flow conditions. The dissolved ammonia concentration is monitored and adjusted, delivering the specific NH4OH concentration needed. Dissolved ammonia’s alkaline chemistry provides ESD protection during rinsing, particle lift-off, and residual photoresist removal in middle-of-line (MOL) and prevents corrosion of cobalt/copper interfaces.

  • Wafer Bonding Systems

    EV Group

    ith over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions. Multiple bonding methods including anodic, thermo compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a unique modular bond chamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production.

  • Rapid Prototype Development

    ARC Technology Solutions

    Have time to market pressure and need to get a system or assembly or production line up and running quickly? Need to rapidly build out a solution, but don’t want to spend months on building up an architecture? Allow our rapid prototyping team to assist you – whether it is crafting 3D printed mechanical assemblies or a building up a high speed IO interface, you are in very capable hands with the ARC engineering team. Our DSX product, can help support your IP, implement your process or and be the core processing engine for your design, or if a larger system, DSX could be an integral part of your system. PVS, another tool that can help error-proof your assembly process, is ready to go in a flexible, software-centric solution that you can be reconfigured as needed to meet your changing demands.

  • Antenna Measurement Software

    Raymond RF Measurements Corp.

    Raymond RF's Antenna Measurement Software performs 2-D (polar/rectangular) and 3-D (spherical) antenna pattern measurements for passive antennas and active wireless mobile stations (cell phones). Insertion loss of passive devices is included as part of the calibration component. Data management and reporting of antenna properties such as half power beam-width, directivity, gain, radiation efficiency, total radiated power, and total isotropic sensitivity. AMS performs and reports all measurements required by the CTIA Over-the-Air Performance Test Plan.

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