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Kitless Pick-and-Place Handler
900
Exatron now offers a new breed of Benchtop Pick & Place Handlers: the Model 900 series. The Model 900 is an extremely efficient yet inexpensive PC controlled Pick & Place System
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Wafer Test
WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
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Wafer Probers
Devices to align probes to test the electrical properties of IC chips or TEGs (Test Element Groups) formed on wafers. The vast options available will meet various needs, from research to mass production.
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Wafer Analyzer
RAMANdrive
RAMANdrive is the specialized Raman microscope for wafer analysis equipped with our dedicated 300 mm stage. RAMANdrive gives you an ultra-fast, highest resolution analysis of the whole wafer with unique stability and accuracy
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Wafer Tester
Tokyo Electronics Trading Co., Ltd.
A vital step in the Semiconductor Value Stream, focusing on electrical screening and consumption of Known Good Die (KGD).
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Configurable OSAT Friendly Pick-and-Place Handler
Delta Eclipse
Eclipse delivers scalable performance for testing a wide range of semiconductors, from analog ICs to high-performance CPUs and mobile processors. The Eclipse is a high-speed pick-and-place handler designed to test up to 16 Integrated Circuits (ICs) in parallel, at temperatures from -45°C to +155°C*, with throughput up to 13,000 UPH.
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Solar Wafer Transfer Tool
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Solar Wafer Transfer Tool
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Wafer Probe Loadboards/PIB
DTS has a full line of standard PIBs for all major tester platforms. Custom PIB designs can accommodate any test head, prober and manipulator configuration, including probe card changers, overhead direct dock setups and cable interfaces. DTS wafer test loadboards are compatible with a variety of pogo pin interface towers. All PIBs are constructed with impedance control, precision matched line lengths, full power and ground planes and both analog and digital resources to provide high quality signal integrity directly to the device.
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LED Tester For Chip And Wafer
Electrical Testing: Forward：VF,DVF,VFDReverse：VZ,IROptical Testing: can test LOP in cd/mcd/W/mW/lm... from different optical componentsWavelength λp,λd,λc,hw,purity,(x,y),CCT,CRIFour-wire measurement and contact resistance in case of deviation.Auto polarity identification and preheat function.Compatible mechanical interface.Optional ESD static test system or polycrystalline test system
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Full Range Active Thermal Control Handler
3110-FT
Chroma 3110-FT is an innovative pick & place system ideal for characteristics evaluation, development, and IC final test.
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High-Throughput Film Frame Handler
MCT FH-1200
FH-1200™ film frame test handler is designed to handle leadless devices mounted on film frame, such as QFN, DFN, WLCSP, BGA, µBGA and eWLB packages. The FH-1200 enables high parallelism testing of post-saw IC devices at ambient temperature. It can accommodate 200 mm and 300 mm wafer rings and custom shapes onto which multiple strips can be mounted. No change kits are required regardless of package size (if same frame is used).
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WAFER MVM-SEM® E3300 Series
E3310
The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Wafer Sorter and Inspection
SolarWIS Platform
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Logic Test Handler
M620
- Maximized Productivity- Handles various device size- Short conversion time- Easy mantenance- Minimized footprint
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6TL36 Plus In-line Test Handler w/Bypass
EA923
- Test handler 6TL36 Plus.- Dual line (bypass)- 1096 x 1875 x 1851mm [WxDxH]- Expandable to form a group with several 6TL36 modules (adapt line to production volumes).- ICT, FCT with RF, ISP or Combined test (ICT+FCT)- Servocontrolled DUT stop (stopper-less system)- Exchange time 3,2s- Max. PCB dimension 600x450mm- 19” rack space for instruments integration: 28UH- Receiver 25 slots in probe plate + 4 slots in push plate- Automatic Conveyor width adjustment- Optional Return Conveyor- High dynamics conveyors (1500 mm/s)- 90mm Top-30mm Bottom Component clearance- SMEMA and Hermes standard- CE
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Inline Handler W/Bypass Line Master
6TL35
A perfect basis for a heavy-duty, reliable, high precision, and automatic integrated Test system for medium to high demanding environments. Important technical and economic advantages due to their modular structure and expansion capability are evident. The production testing environment will be flexible and efficient, helping towards the always valued Return of Investment.
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Inline Wafer Electrical quality Inspection
ILS-W2
the Ultimate Wafer Electrical Quality Inspection Unit for Wafer Inspection Systems
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Bond Tester for Wafers 2 - 12 inch
Sigma W12
Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
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Ultrasonic Wafer Scanner
AutoWafer
Installed in more wafer applications than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, production-ready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.
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Wafer Flatness Measurement System
FLA-200
*Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)*Measures all materials including Si, GaAs, Ge, InP, SiC*Full 500 micron thickness measurement range without re-*calibration2-D /3-D Mapping software
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Hybrid Single Site Test Handler
3110
Chroma Hybrid Single Site Test Handler 3110 is a full range ATC (Active Thermal Control) test handler capable of handling device bodies up to 120x120mm with 450kg force load.
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WAFER MVM-SEM
E3300 Family
The E3310 is a WAFER MVM-SEM* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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High Resolution Wafer Thickness & Thickness Variation Gauge
MX 10x series
The MX10x series measure thickness and thickness variation on silicon wafers. It has a resolution of 10 nanometers and can be adapted to different thickness ranges within a few seconds.
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Wafer Thickness Measuring System
WT-425
Contact type can measure any materials within 0.2 µm (2 σ at 20℃ ±1℃). The wafer floats positions while measurement points change and it does not damage even thin wafers. Best for the process control of compound wafers and oxide wafers. (SiC, GaN, LT, Sapphire and Bonded Wafers)
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High Speed Gravity Handler
MT9928 xm
This well-established test handler provides field-proven reliability and performance. Its modular and scalable design and variety of options allow configuration of the MT9928 exactly according to the test needs. Easy-access design and easy-to-change conversion kit parts support fast and easy package style changes. The MT9928 has a large soak capacity and features the entire tri-temp range at outstanding temperature accuracy and stability.
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Inline Handler W/By-Pass Line Master Push Down
6TL33
A perfect basis for a heavy-duty, reliable, high precision, and automatic integrated Test system for medium to high demanding environments. Important technical and economic advantages due to their modular structure and expansion capability are evident. The production testing environment will be flexible and efficient, helping towards the always valued Return of Investment.
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Sapphire/SIC Wafer Flatness and Surface Appearance System
FM200
Sapphire/SIC wafer flatness and surface appearance system provide a previous surface flatness testing solution, though non-contract lighting testing to record the whole information of the surface, rapid and fast measurement for various of surfaces, line and all kinds of surface information.
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Wafer Thickness Measurement System
MPT1000
Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by Creden Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height, bow and warp measurements)
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Photonics Wafer Probing Test System
58635
The advancement of the photonics device technology continues to enable broader and more demanding applications in the industry.
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Wafer Prober Networking System
PN-300
The Wafer Prober Networking System PN-300 utilizes a database to facilitate data access from other systems and provides an environment that enables the user to edit data and handle processing. The system achieves wide-ranging compatibility by adopting standard hardware and operating system. In addition, it is equipped with an N-PAF (Network-based Prober Advanced Function) to provide robust support for wafer prober operation and maintenance.
