-
Product
Wafer Inspection System
INSPECTRA® Series
-
INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
-
Product
Contactless Wafer Gauge for Resistivity, Thickness
MX 60x
-
The MX60x series measure Resistivity or Sheet Resistance of silicon and other materials.
-
Product
LED Type Wafer Alignment Sensor Controller
HD-T1
-
Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
-
Product
Production Wafer Level Burn-in
-
TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
-
Product
High Resolution Wafer Thickness & Thickness Variation Gauge
MX 10x series
-
The MX10x series measure thickness and thickness variation on silicon wafers. It has a resolution of 10 nanometers and can be adapted to different thickness ranges within a few seconds.
-
Product
Die-To-Wafer Bonding Systems
-
Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
-
Product
Tri-Temp Pick-and-Place Handler
MT9510 XP / x16
-
MT9510 XP™/ MT9510 x16™ test handler provides full temperature control during test in extreme environmental conditions from -55˚C to +175˚C. A variety of options, upgrades and retrofits are available to configure the product to customer applications such as; automotive battery management systems (BMS) for electric (EV) and hybrid electric vehicles (HEV) and precision power regulators.
-
Product
MEMS Handler
4664-IH
-
The ULTRA P is a high performance production handler that provides thermal conditioning, full 6 DOF mechanical stimulus and an electrical ATE signal path for testing Micro-Electro-Mechanical Systems (MEMS) Accelerometers and Gyroscopes.
-
Product
Wafer Prober
Precio octo
-
200mm wafer prober. The system adapts ultra-high speed indexing and high-speed wafer exchange functions to reduce test cost and improve overall equipment effectiveness (OEE) markedly enhancing productivity.
-
Product
Manual Contactless Wafer Detector
HS-NCS-300
-
Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.
-
Product
Logic Test Handler
M620
-
- Maximized Productivity- Handles various device size- Short conversion time- Easy mantenance- Minimized footprint
-
Product
6TL60 Rotary Test Handler
H79006010
Test Platform
6TL60 has been designed according to the 6TL philosophy, following the concepts of flexibility, modularity and scalability, and with the aim of improving production efficiency as well as increase production capacity and reduce costs.The 6TL60 is the best production solution to automate test processes to reduce the cycle time and the footprint used in the manufacturing plan
-
Product
Wafer Prober Networking System
PN-300
-
The Wafer Prober Networking System PN-300 utilizes a database to facilitate data access from other systems and provides an environment that enables the user to edit data and handle processing. The system achieves wide-ranging compatibility by adopting standard hardware and operating system. In addition, it is equipped with an N-PAF (Network-based Prober Advanced Function) to provide robust support for wafer prober operation and maintenance.
-
Product
High Speed Pick and Place Handler
Commander 2000
-
At throughput rates in excess of 2000 Units per Hour the HT Commander 2000 system provides unparalleled performance for the production handling and programming of flash memory devices or modules.
-
Product
Wafer Analysis Systems
Tropel®
-
Corning Specialty Materials has a long heritage of providing solutions to semiconductor equipment manufacturers. The Tropel line of wafer analysis equipment enables measurement of wafer substrates from 2” to 450mm regardless of material type and surface finish.
-
Product
High Parallel Test Handlers
-
High parallelism test in strip or singulated device batch handling on carriers, WLCSP post singulation test.
-
Product
Wafer Manufacturing
-
Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
-
Product
Equipment Front End Module Wafer Handler
Sigma EFEM
-
Integration transforms the bond tester into a fully automated system. We offer various types of EFEM (Equipment Front End Module) wafer handlers, to combine with a Sigma W12 for operator-free bond testing.
-
Product
Hybrid Single Site Test Handler
3110
-
Chroma Hybrid Single Site Test Handler 3110 is a full range ATC (Active Thermal Control) test handler capable of handling device bodies up to 120x120mm with 450kg force load.
-
Product
Full Range Active Thermal Control Handler
3110-FT
-
Chroma 3110-FT is an innovative pick & place system ideal for characteristics evaluation, development, and IC final test.
-
Product
High-Speed Laser Mark Handler
MCT MH-3300
-
MH-3300™ high-speed laser mark handler is used for marking of 2DID codes on the lead frame in support of strip testing, marking of reject devices, and for final package marking in strip test or assembly operations. The MH-3300 offers unparalleled throughput performance and the best cost-of-ownership in the industry.
-
Product
Stand Alone Wafer Sorter
MicroSORT
-
The Microtronic MicroSORT semiconductor wafer sorter is designed to maximize throughput while minimizing wafer handling in a user-friendly operating environment. This stand-alone semiconductor wafer sorter enables sophisticated semiconductor wafer sorter routines for up to 4 wafer-cassette platforms. MicroSORT semiconductor wafer sorter reads OCR scribes from the top, bottom, or simultaneously, allowing for enhanced semiconductor wafer tracking and sorting. The MicroSORT semiconductor wafer sorter’s basic functions include the ability to move, compress, randomize, find, align, verify, and split semiconductor wafer lots. With our virtual tweezer mode, an operator can click on wafer icons to move wafers between cassettes, read semiconductor wafers, and swap wafer positions.
-
Product
Wafer Thickness Measuring System
WT-425
-
Contact type can measure any materials within 0.2 µm (2 σ at 20℃ ±1℃). The wafer floats positions while measurement points change and it does not damage even thin wafers. Best for the process control of compound wafers and oxide wafers. (SiC, GaN, LT, Sapphire and Bonded Wafers)
-
Product
Test Handler
M4841
-
High-Throughput Device Handler for Volume Production Testing of MCUs and DSPs.
-
Product
Full Wafer Test System
FOX-1P
-
Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
-
Product
System to Handle Wafer Levels
AMI AW Series
-
Operator-Free Wafer Inspection, Analysis and Sorting The AW Series are advanced high-capacity, high throughput automated wafer C-SAM® instruments specialized to deliver maximum sensitivity for the evaluation of wafer and device level applications.
-
Product
Wafer Probers
-
Devices to align probes to test the electrical properties of IC chips or TEGs (Test Element Groups) formed on wafers. The vast options available will meet various needs, from research to mass production.
-
Product
Auto Macro Wafer Defect Inspection
EagleView
-
EagleView automated macro defect semiconductor wafer inspection system provides industry leading throughput, defect detection accuracy, and wafer classification for semiconductor manufacturing. EagleView systems have inspected over 100 million semiconductor wafers worldwide. The EagleView macro defect inspection tool resolves many of the problems and pitfalls of manual and micro wafer inspection by automating and standardizing semiconductor wafer inspection processes while creating complete images of every wafer in the cassette. Unlike manual micro defect wafer inspection, EagleView’s automated wafer inspection is always consistent, tireless, reliable, and fast. EagleView helps find macro defects while there’s still time to take corrective action.
-
Product
Wafer Defect observing instrument
HS-WDI
-
Application■Semiconductor wafer■Solar wafer■Solar Cell■Thin-film Cell
-
Product
Non-contact Measurement Wafer Sorting System (Belt Drive Tranceportation)
NC-6800
-
*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Number of cassette station can be changed by customers request*Eddy current method for resistivity, Electric capacitance method for wafer thickness*Temperature correction for silicon wafer function
