Wafer Probers
bring the wafer in contact with the set of wafer probes.
See Also: Probers, Wafer, Flying Probes, Thermal Chucks
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Product
Wafer Analyzer
RAMANdrive
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RAMANdrive is the specialized Raman microscope for wafer analysis equipped with our dedicated 300 mm stage. RAMANdrive gives you an ultra-fast, highest resolution analysis of the whole wafer with unique stability and accuracy
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Product
Semiconductor Wafer Microscope Inspection System
MicroINSPECT
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MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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Product
Wafer Testing
Trio Vertical
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SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
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Product
Wafer Back Side Cooling System
GR-300 Series
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The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems.
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Product
Sapphire/SIC Wafer Flatness and Surface Appearance System
FM200
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Sapphire/SIC wafer flatness and surface appearance system provide a previous surface flatness testing solution, though non-contract lighting testing to record the whole information of the surface, rapid and fast measurement for various of surfaces, line and all kinds of surface information.
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Product
Wafer Probe Loadboards/PIB
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DTS has a full line of standard PIBs for all major tester platforms. Custom PIB designs can accommodate any test head, prober and manipulator configuration, including probe card changers, overhead direct dock setups and cable interfaces. DTS wafer test loadboards are compatible with a variety of pogo pin interface towers. All PIBs are constructed with impedance control, precision matched line lengths, full power and ground planes and both analog and digital resources to provide high quality signal integrity directly to the device.
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Product
Non-contact Measurement Wafer Sorting System (Robot Hand Tranceportation)
NC-3000R
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*High accuracy measurement system for large diameter wafer*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Compact design of Two-stage by measuring area and transfer area*Number of cassette station can be changed by customers request Option : Add wafer flattness measurement system(FLA-200)
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Product
Non-contact Inline P/N Checker Module For Solar Wafer
PN-100BI
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*Principle: Photovoltaic effect with the laser diode*Suitable for production line and tranceportation system*Connect to host PC by LAN to send measurement command and data
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Product
Wafer/Dicing Frame Prober
WDF 12DP+
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The WDF 12DP is a prober/handler capable of transporting and testing standard 300-mm wafers and dicing frames without need of a changeover kit. To support multiple tests after dicing, it has a special positioning function that differs from former types, as well as image-processing functions such as wafer level packaging.
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Product
Wafer Inspection System
AutoWafer Pro™
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AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Product
In-situ Wafer Temperature Monitoring
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CI Semi's family of noncontact temperature monitors (the NTM line), offers high end pyrometry products for the measurement of wafer temperatures during process. CI Semi’s flag ship of the line, the NTM Delta, incorporates real-time, same point emissivity measurement and compensation making it the ideal solution for in situ monitoring for processes such as RTP, CVD and PVD. The NTM family is sold to leading tool manufacturers.
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Product
Photonics Wafer Probing Test System
58635
Test System
The advancement of the photonics device technology continues to enable broader and more demanding applications in the industry.
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Product
Bond Tester for Wafers 2 - 12 inch
Sigma W12
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Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
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Product
Wafer Inspection System
INSPECTRA® Series
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INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
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Product
Contactless Wafer Gauge for Resistivity, Thickness
MX 60x
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The MX60x series measure Resistivity or Sheet Resistance of silicon and other materials.
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Product
LED Type Wafer Alignment Sensor Controller
HD-T1
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Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
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Product
Production Wafer Level Burn-in
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TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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Product
High Resolution Wafer Thickness & Thickness Variation Gauge
MX 10x series
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The MX10x series measure thickness and thickness variation on silicon wafers. It has a resolution of 10 nanometers and can be adapted to different thickness ranges within a few seconds.
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Product
Die-To-Wafer Bonding Systems
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Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
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Product
Manual Contactless Wafer Detector
HS-NCS-300
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Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.
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Product
Wafer Analysis Systems
Tropel®
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Corning Specialty Materials has a long heritage of providing solutions to semiconductor equipment manufacturers. The Tropel line of wafer analysis equipment enables measurement of wafer substrates from 2” to 450mm regardless of material type and surface finish.
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Product
Wafer Manufacturing
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Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
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Product
Stand Alone Wafer Sorter
MicroSORT
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The Microtronic MicroSORT semiconductor wafer sorter is designed to maximize throughput while minimizing wafer handling in a user-friendly operating environment. This stand-alone semiconductor wafer sorter enables sophisticated semiconductor wafer sorter routines for up to 4 wafer-cassette platforms. MicroSORT semiconductor wafer sorter reads OCR scribes from the top, bottom, or simultaneously, allowing for enhanced semiconductor wafer tracking and sorting. The MicroSORT semiconductor wafer sorter’s basic functions include the ability to move, compress, randomize, find, align, verify, and split semiconductor wafer lots. With our virtual tweezer mode, an operator can click on wafer icons to move wafers between cassettes, read semiconductor wafers, and swap wafer positions.
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Product
Wafer Thickness Measuring System
WT-425
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Contact type can measure any materials within 0.2 µm (2 σ at 20℃ ±1℃). The wafer floats positions while measurement points change and it does not damage even thin wafers. Best for the process control of compound wafers and oxide wafers. (SiC, GaN, LT, Sapphire and Bonded Wafers)
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Product
Full Wafer Test System
FOX-1P
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Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
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Product
System to Handle Wafer Levels
AMI AW Series
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Operator-Free Wafer Inspection, Analysis and Sorting The AW Series are advanced high-capacity, high throughput automated wafer C-SAM® instruments specialized to deliver maximum sensitivity for the evaluation of wafer and device level applications.
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Product
Auto Macro Wafer Defect Inspection
EagleView
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EagleView automated macro defect semiconductor wafer inspection system provides industry leading throughput, defect detection accuracy, and wafer classification for semiconductor manufacturing. EagleView systems have inspected over 100 million semiconductor wafers worldwide. The EagleView macro defect inspection tool resolves many of the problems and pitfalls of manual and micro wafer inspection by automating and standardizing semiconductor wafer inspection processes while creating complete images of every wafer in the cassette. Unlike manual micro defect wafer inspection, EagleView’s automated wafer inspection is always consistent, tireless, reliable, and fast. EagleView helps find macro defects while there’s still time to take corrective action.
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Product
Wafer Defect observing instrument
HS-WDI
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Application■Semiconductor wafer■Solar wafer■Solar Cell■Thin-film Cell
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Product
Non-contact Measurement Wafer Sorting System (Belt Drive Tranceportation)
NC-6800
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*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Number of cassette station can be changed by customers request*Eddy current method for resistivity, Electric capacitance method for wafer thickness*Temperature correction for silicon wafer function
