Thermal Chucks
control DUT's thermal state. Wafer
See Also: Temperature Forcing Systems, Wafer Probers, Temperature Chucks
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Product
Thermal Wafer Chucks
HC6000 Series
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American Probe & Technologies, Inc.
American Probe & Technologies has introduced the HC-6000 Series of thermal chucks to provide accurate thermal control and surface uniformity required by the Semiconductor Industry. With the heated chuck optimized for DC parametric or CV testing, APT has several configurations to meet your specific test applications.
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Product
Hot Chuck
HC5000 Series
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American Probe & Technologies, Inc.
Specialized thermal wafer chucks used in semiconductor testing and analytical probing to heat silicon wafers to precise temperatures during electrical characterization.
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Product
Chamber/Pyroelectric Task
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Radiant's Chamber/Pyroelectric Task sets the sample to a series of temperatures by performingGPIB control of an external thermal device. At each temperature it captures the sample’s polarization response and/or small-signalcapacitance. These are combined to calculate the pyroelectric coefficient. The Pyroelectric Task is to be used with a Radiant Test System and a Linkam Stage (-196C to 600C), Thermal Chambers, Hot Chucks, or a Furnace to automatically measure the Pulse Polarization response and Small Signal Capacitance of a Pyroelectric material that is being heated and/or cooled. Radiant's Pyroelectric measurement Task can be added to Vision at additional cost. This measurement suite fully characterizes the pyroelectric charge (polarization) response of the sample under test. The Pyroelectric Task suite controls various thermal controllers such as Quantum Design, Lake Shore, Delta Design, and many others. Detailed Listing of Thermal Controllers Registered in Vision. The Chamber/Pyroelectric Task is quoted upon request.
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Thermal Chuck Systems
C-Series
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Advanced Temperature Test Systems GmbH
Looking for a chuck system that gives you the possibility to cool down to - 60C and up to + 300C. The C-Series represents a product line of air cooled thermal chuck systems for a wide temperature range
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Product
Vacuum Chuck Temperature Controlled Test Stations
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These test stations offer the same reliable repeatable measurement capability of our temperature monitored stations with the added dimension of temperature control.
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Product
Thermal Chuck Systems
A-Series
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Advanced Temperature Test Systems GmbH
The A-Series represents a productline of air cooled thermal chuck systems for a temperature range between -30C up to +400C. The basic product offers an active cooled chuck system without an external chiller for a temperature range between +25C up to +200C at a very competitive price to common Hot Chucks.
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Product
Thermal Controlled Chucks & Plates
TOP Cool
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Mechanical Devices newest innovation in thermal testing. Each TP system contains a thermal chuck or thermal plate and a self-contained thermal control unit.The TP chuck and platforms is a breakthrough product that introduced the use of refrigerant for active cooling & heating of wafers and other components with no need of chiller, CDA, or consumable and expensive refrigerants such as liquid nitrogen and liquid carbon dioxide. It can be a perfect replacement system in the industry for uncompromising thermal and mechanical performance with a temperature ranging from -60 to +220°C.
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Product
Semi-Automatic Probe Station
P300A
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The P300A probe station is the most stable, intuitive, and space efficient 300mm semi-automatic analytical probe station available today. Designed for low current, sub-micron positioning applications, the P300A comes standard with features such as single-point ground, dry/dark environment, and integrated thermal chuck plumbing.
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Thermal Chuck Systems
L-Series
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Advanced Temperature Test Systems GmbH
The perfect system for high power applications with an extraordinary performance at a wide temperature range between - 65C and + 300C.Each system contains a high performant liquid-cooling unit.
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Product
On-Wafer Measurements
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Accurate DC/CV (and RF) statistical modeling of semiconductor devices requires collecting a significant amount of measured data from different wafers across several temperatures. Keysight Technologies recommends IC-CAP WaferPro as a turn-key DC/CV and RF automated characterization solution to help modeling and device engineers achieve more efficient on-wafer measurements across temperature. This new breakthrough solution is based on IC-CAP modeling software and efficiently controls DC/CV analyzers, network analyzers, probers, switching matrixes, and temperature chucks, as well as the powerful 407x and 408x Series of Keysight parametric testers.
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Product
Thermal Wafer Chucks
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American Probe & Technologies, Inc.
Looking for a heated wafer chuck for your prober? Begin here with several standard and custom thermal wafer chucks for your existing or new analytical prober. Models also available for many series of Electroglas, TEL, KLA autoprobers.
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Product
Electrostatic Chucks
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Chucks grip for micropatterning, temperature control, or robotics ...*insulating substrates,*hard disk drive head substrates,*semiconductor wafers,*InP-coated sapphire,*metal foils,*... and many other materials.
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Product
Metal Foil Chucks
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Electrostatic chucks are the most reliable solution for gripping delicate, microfabricated metal foils - even in air. These chucks induce no distortion, are easily cleaned, are amazingly robust, economically priced, and exhibit uniform grip forces over their entire area.
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Product
Thermal Wafer Chuck
HC4000 Series
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American Probe & Technologies, Inc.
A specialized hardware component used in semiconductor testing to hold and heat or cool silicon wafers during analytical probing.
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Product
Wafer Chucks
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ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Product
Thermal Anemometers
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Thermal Anemometers for the measurement of air velocity. Devices are also known as Hot Wire Anemometers, and the instruments can come with telescopic as well as articulated 90° angled probes.
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Wafer Chucks
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American Probe & Technologies, Inc.
A precision testing fixture used in the semiconductor industry to hold, position, and thermally regulate silicon wafers during testing on analytical probers and autoprobers.
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Product
Thermal Imaging Camera
TI160 - P5
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TI 160-P5 is a special thermal imaging camera for human body temperature measurement only. Its has Accurate temperature measurement, real-time imaging, ability to quickly lock the hot-spot. It is been widely used in airports, docks,railway stations, schools, shopping malls and other public places to check human body temperature abnormalities. Palmetto design, compact and lightweight, integrated visible light function. Reliable performance and accurate temperature measurement can effectively improve the efficiency of detection.
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Product
Thermal Imaging
JOHO307
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Wuhan JOHO Technology Co., Ltd
JOHO307 thermal imaging binocular is available to work at day and night at any harsh environment for solider excuting combat surveillance, target seraching, tracking and monitoring and other mission
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Product
Thermal properties sensor
TP01
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Hukseflux Thermal Sensors B.V.
TP01 is designed for long term (permanent) installation in soils. It covers the thermal conductivity (λ) range of 0.3 to 4 W/m.K, which is sufficient for most inorganic soil types. The core of TP01 is a differential temperature sensor (2 thermopiles) (1) measuring the radial differential temperature with record breaking sensitivity. The sensor performs a temperature measurement around a heating wire (2).
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Product
Thermal Analysis
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The TORC (Thermo-optical Oscillating Refraction Characterization) technique applies decades of know-how in optical instrumentation to thermal analysis in a novel and unique way. The technique requires minimal sample preparation at maximal tolerance for sample properties. You can determine the coefficient of thermal expansion, glass and phase transitions as well as polymerization for various samples: liquids, gels, pastes, and certain solids. For example: cured and uncured resins, adhesives, glues, etc. can easily be characterized. Both thermal and time-dependent processes can be monitored with minimal effort.
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Product
Drill Chuck Grips
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Metal rods, wires, and plates and electronic components can be tensile tested using drill chuck grips. Electronic components are tested by placing the metal legs of the components in the grips, allowing different shaped components to be tested with the same set of grips.
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Product
Hot Chucks
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Materials Development Corporation
Probe stations to suit all measurement requirementswhether production, engineering or research. See individual data sheets for more details.
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Product
Thermal Analysis Instruments
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Typically measure heat flow, weight loss, dimension change, or mechanical properties as a function of temperature.
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Product
Thermal Data Logger
51101 Series
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It is a general requirement to record temperatures, voltages, currents, and many physics quantities during research, product development, productions, and quality assurance processes. The number of record channels can be a simple one to several complicated set of hundreds. Thermal/multi-function data loggers are prefect solutions to serve for these measurement and tracking needs.
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Product
Thermal Conductivity Analyzers
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Teledyne Analytical Instruments
Thermal Conductivity Analyzers by Teledyne Analytical Instruments
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Product
Thermal Engineering Projects
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Precision Development Consulting Inc
Open loop temperature controller, LED process tool, Single wafer CVD chamber, Batch CVD Tool, Batch ALD Tool, MOCVD equipment, Device cooler
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Product
Thermal Flow Splitter
FS-3000
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FS-3000 combines HORIBA STEC’s mass flow controller (MFC) and MuCube (Master controller). By controlling MFC from MuCube equipped with the HORIBA STEC’s proprietary control algorithm, FS-3000 achieves stable splitting control.
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Product
Thermal Shock Testing
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Thermal shock is a very important test for determining the reliability of a product when subjected to sudden changes in temperature and how this stress source can accumulate deterioration or physical damage in performance.
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Product
Thermal Shock Chamber
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Wewon Environmental Chambers Co, Ltd.
Makes it possible to quickly and autonomously transfer test items back and forth repeatedly between a hot and cold environment.
