AOI & SPI

AOI & SPI

Most defects in circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition of to lead free soldering, a whole new spectra of problems have emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits, are failure modes that has increased in frequency since the transition to lead-free soldering.