Stamped Spring Pin Sockets
Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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Unlisted Product
Lever Actuated Stamped Spring Pin Socket for PCBA Module
CBT-LGA-5012
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Ironwood Electronics recently introduced a new LGA socket addressing high performance requirements for 1.2mm pitch devices - CBT-LGA-5012. The contactor is a stamped spring pin with 31 gram actuation force per pin and cycle life of 500,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss of < 1 dB at 15.7 GHz and capacitance 0.097pF. The current capacity of each contactor is 4 amps. Socket temperature range is -55C to +180C. Socket also features an IC guide for precise PCBA (Printed Circuit Board Assembly) edge alignment. The specific configuration of the package to be tested in the CBT-LGA-5012 is PCBA, 58x47mm body size and 1.2mm pitch. The socket has center opening for accessing top side of PCBA module. To use, drop IC into the socket, close the clamshell lid, and apply down force by actuating the lever. The socket compression mechanism utilizes cam/follower technology that enables to apply large force with very little effort. This socket can be used for hand test, screening modules and custom burn-in applications with the most stringent requirements.
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Unlisted Product
Lever Actuated Spring Pin Socket for QFN module
CBT-QFN-7055
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QFN socket addressing high performance requirements for custom size devices - CBT-QFN-7055. The contactor is a stamped spring pin with 31 gram actuation force per pin and cycle life of 125,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss of < 1 dB at 15.7 GHz and capacitance 0.097pF. The current capacity of each contactor is 4 amps at 40C temperature rise. Socket temperature range is -55C to +180C. Socket also features an IC guide for precise QFN edge alignment. The specific configuration of the package to be tested in the CBT-QFN-7055 is QFN, 50x40mm body size and 0.92mm pitch.
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Unlisted Product
Production test Socket for eMMC
CBT-BGA-7037
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Ironwood Electronics recently introduced a new Stamped spring pin socket addressing high performance requirements for testing BGA153 - CBT-BGA-7037. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 500,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss < 1 dB at 15.7 GHz and capacitance 0.097pF. The current capacity of each contactor is 4 amps at 40C temperature rise. Socket temperature range is -55C to +180C. Socket features a clamshell lid design for ease of chip replacement in production environment. It also has an integrated compression plate for vertical force without distorting device position. The specific configuration of the package to be tested in the CBT-BGA-7037 is a BGA, 11.5x13mm, 0.5mm pitch 14x14 array with 153 balls. The socket is mounted using supplied hardware on the target PCB with no soldering, and uses the smallest footprint in the industry. The smallest footprint allows inductors, resistors and decoupling capacitors to be placed very close to the device for impedance tuning. To use, place BGA device into the socket and close the lid by snapping to the latch. Vertical force is applied by the springs integrated into the socket lid. This socket can be used for quick device screening, device characterization at extreme temperatures as well as final production test.



