Sockets
receive conductors.
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Product
Test Sockets
Non Standard
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Chances are good Ardent can help you with that. We can adapt our technology to just about any package, device or module. Small volumes of custom sockets for higher bandwidth applications are a niche all in their own, and our engineering team has many years of experience designing custom sockets for all kinds of applications.
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Qualification Hardware & Sockets
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Reltech Limited holds over 35 years’ experience in the design and manufacture of all types of qualification test hardware. Our advanced technology products include: HTOL Boards (Mother and Daughter cards) Burn-In Boards HAST Boards THB (humidity) Boards Burn-In Modules and frames Dynamic Driver cards (Digital, Analogue and Mixed signal) Back Planes Voltage regulator cards Custom electro-mechanical assemblies DUT Cassettes and test Fixtures
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High Performance Chipscale Test Sockets
SC
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Ardent Concepts Test Sockets for ATE test deploy patented SC Contact Sets. This technology is capable of over 2 Million mechanical insertions in production environments and uses easy to replace pins with no complicated assembly procedure. It is designed to be drop-in compatible with 1mm offset and straight through footprints to ease implementation, and RC SC’s simple and robust design is extremely cost effective when compared with existing “roll” type test contactors and sockets. Designed specifically for JEDEC QFN and MLF applications, SC High Performance Test Sockets are available for most handler set-ups and offer exceptional AC performance.
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Aspen Sockets
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Ironwood Electronics’ Aspen line of sockets are designed in standardized stepped footprint configurations, incorporating industry standard high performance spring pins. Sockets can be designed to work with any type of IC package; BGA – LGA – QFN – DFN and even leaded devices where you have minimal space to fit a socket in place of your device to allow fast, easy testing and development.
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Product
4G Concurrent Device Programmer for PC /USB (4 sockets)
ProMax 4G
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ProMax is the most innovative and cost effective 4- or 8-gang programming solution on the market. ProMax supports a wide variety of programmable devices. Its state-of-the-art technology and high-speed programming algorithms optimize throughput, reliability and yields.
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Test Sockets
QFN/QFP
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For today’s chipscale packages, finding the right socket solution can be challenging. With SC™ sockets from Ardent, you can count on the right design, the best performance, and quick turns for even the most challenging custom designs
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Product
Test Sockets
MEMS Device
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Patented MEMS Sockets from Ardent Concepts use a unique scrubbing action contact set which is ideal for today’s sensitive MEMS devices, including accelerometers, gyroscopes, MEMS microphones and other specialized devices used in mobile electronics applications
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QFN Sockets
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With the largest QFN catalog in the world, Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages. These sockets offer a modular design in a small outline with very low inductance. The Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version.
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Test Sockets
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Yamaichi Electronics Co., Ltd.
A test socket is the ideal point to test your home’s internal phone wiring for faults. You can also use it to identify any potential faults with the phone line outside. Your test socket is located in your master socket. It is the point between the internal phone wiring in your house and the phone line outside. That means by plugging into your test socket you can bypass all the internal wiring and test your device directly on the phone line.
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LGA Sockets
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We’ve taken our QFN expertise and combined it with the versatility and performance of the H-Pin® to leverage an LGA socket platform that serves the demanding requirements of today’s market. Plastronics LGA sockets using the H-Pin provide a high-performance socket that is affordable for all burn-in operations. These LGA sockets meet the power, temperature and signal performance needs of the higher density, larger package outline, and sometimes mix-pitch LGA designs. The LGA platform serves package sizes from as small as 2.0mm X 2.0mm to the industry’s largest standard socket for 60.0mm X 60.0mm packages.
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MultiSite Test sockets and Wafer Level
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multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Smart Sockets
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Ironwood Electronics extended its high performance socket product line with smart features. Sockets are typically rated for 2K to 500K cycles. How do we know if the sockets are used for 100K or 200K insertions? Solution is electronic chip insertion counter. Our sockets can be integrated with electronics counter into the compression mechanism of the socket lid. A push button is exposed on the compression plate. Every time a chip is compressed, push button is actuated which in turn activates the electronic circuitry inside the lid. These activations are counted by the counter IC and displayed in LCD. Let’s say a contact element is rated for 2K insertions. After 2K insertions, this contact element will be replaced by new contact element. Now, the counter has to start the counting from the beginning. To achieve this function, a reset option is included in the electronics circuitry. When reset is actuated, LCD display will go to “0”.
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Open Top BGA Sockets
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Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
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GHz Elastomer Sockets
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Ironwood’s GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA or QFN device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss up to >40GHz and supports BGA or QFN/MLF pitches down to 0.3mm was utilized in these sockets. GHz BGA sockets are mechanically mounted over a target system’s BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry’s smallest footprint). They support IC devices with body sizes ranging from 55mm down to 1mm. Larger body sizes may require a backing plate. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed. This insulation plate sandwiches between the backing plate and target PCB.
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Product
DU Sockets
445012
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DU bushings are rolled dry sliding bearing bushings and also serve to properly guide the guide pins into the pin carrier plate.
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Product
40-Pin DIP-to-Socketable PLCC Adaptor
1111163
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40 Pin DIP to Socketable PLCC Adapter. Can be used with Intel 80/83C652 and 80C251 microprocessors and any IC that follows standard DIP to PLCC pinout conventions. Allows user to switch package styles and avoid shortage problems. Designed to plug directly into your 44 pin PLCC socket.
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Product
Hot Socket Simulator
Hot Socket Simulator
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The new TESCO Hot Socket Simulator gives you the ability to investigate meter failure issues related to hot socket phenomenon. The Simulator is equipped with one 2S meter socket with four jaws, one of which is the heated jaw. The arcing/heating apparatus can be moved to any of the four jaws (jaw 1 is the standard). Additional arcing/heating elements can be provided as an option for multiple hot jaws on the existing socket.
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Product
Interior Temperature Transmitter
T0118
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Temperature transmitter is specially designed for use in exacting interiors in building energy management and HVAC systems. It designed for easy installation on ordinary KU68 wiring boxes for household switches and sockets. Large dual line LCD is possible to switch off. Computerized design ensures long term stability and fail indication. Transmitter is designed for use in non-aggressive environment.
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Fanless Embedded System With Intel® Celeron® J1900, HDMI, VGA, 2 GbE LAN, 4 USB, 3 COM And 10 To 34 VDC
eBOX626-842-FL
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The eBOX626-842-FL is the energy-efficient fanless embedded box PC suited for rugged and extreme applications with its extended temperature and wide range voltage capability. The extreme compact box PC utilizes an onboard Intel® Celeron® quad core processor J1900 2.0GHz (codename: Bay Trail-D) to boast both excellent performance and ultra-low power consumption. The ultra-slim fanless embedded computer supports system memory up to 8 GB with one DDR3L-1066/1333 SO-DIMM socket and offers HDMI and VGA display outputs, offering not only high computing capability but also excellent graphics performance. Integrated single-chip design, the brand new ruggedized embedded system is lighter and thinner compared to previous eBOX620 series. Supporting wide operating temperature between -20°C to +55°C and 10 to 34VDC wide DC input voltage, the fanless embedded PC is excellence for wide range of industrial applications. Its passive cooling design also offers quiet, fanless operation with low power consumption, and all at an attractive price point. With full-featured of I/O interfaces, the Intel® Celeron®-based eBOX626-842-FL supports two RS-232/422/485 ports, one RS-232 port, VGA, HDMI, audio, dual Gigabit Ethernet LAN ports, four high-speed USB 2.0, three SMA type connector openings for antenna, 10-34VDC power input connector, and one ATX power switch. One 2.5" SATA HDD drive bay and mSATA are also embedded in the embedded computer to possess sufficient storage.
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Product
Robust DIN-rail Fanless Embedded System With Intel® Celeron® Processor N3350, COM Or CAN, 2 LAN, 2 USB And DIO
ICO120-83D
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The ICO120-83D is powered by the Intel® Celeron® processor N3350. The embedded filed controller supports one DDR3L-1866 SO-DIMM slot with up to 8 GB of system memory. It is equipped with one full-size PCI Express Mini Card slot, one half-size PCI Express Mini Card slot in support of mSATA, and one SIM socket to provide flexible extension capability. The ICO120-83D measuring only 31 x 100 x 125 mm is well-suited for space-constrained deployments. It offers an IP40 extruded aluminum and heavy-duty steel design for durable use. This powerful industrial IoT gateway can withstand harsh operating conditions with an extended temperature range of -20°C to 70°C and vibration resistance up to 2G. Additionally, the unit supports a wide voltage range of 12V to 24V DC power input with overvoltage and reverse protection.
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Product
Universal SOIC-to-0.600 [15.24] DIP Adaptor
Series 647
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Universal SOIC to .600 [15.24] DIP Adapter. 44 pin adapter for mounting Aries Series 547 Universal SOIC ZIF (zero insertion force) Test Socket to .600 [15.24] DIP PCB layout. Consult Data Sheet No. 10015 for test socket information.
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Product
Impedance Stabilization Network
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Beijing KeHuan Century EMC Technology Co,.LTD
KH8158 is a device for measuring the common mode interference voltage of unshielded twisted pair cables. Cable testing according to CISPR 16-1-2. The equipment under test (EuT) and auxiliary equipment (AE) are directly connected to the corresponding ports. The port adopts RJ-45 socket (the distribution conforms to T568A/B.) This equipment is divided into three specifications: CAT3, CAT5, and CAT6, and the corresponding equipment is selected according to the cable model.
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Product
VP998 Universal Programmer
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*Equipped with 48 pins zif socket. Database of supported devices is regularly updated.*Software is compatibled with WindowsXP/Vista/ Windows 7/8/10 *Communication with comuputer through USB port
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Fanless Embedded System With LGA1151 Socket 8th Gen Intel® Core™ & Celeron® Processor, Intel® H310, HDMI, DisplayPort, 6 USB, 2 COM And 8-CH DI/DO
eBOX640-521-FL
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*LGA1151 socket 8th gen Intel® Core™ i7/i5/i3 & Celeron® processor (Coffee Lake)*Supports 2 COM, 6 USB and 8-CH DI/DO*Two 2.5" SATA drive bay*M.2 Key E 2230 for Wi-Fi*Front I/O connectivity design*12/19 to 24 VDC power input via DC-Jack*Flexible I/O window supported
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Extended Version CODE300-32
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Code300-32 Extended allows the running of two sessions of the program at the same time. This means that with two audio cards the system can handle up to 4 audio channels simultaneously: One could have two receivers, one into the Right (R) channel and the other into the Left (L) channel of the LINE IN input socket of the first audio card and the same configuration for the second audio card.
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Product
Interior Temperature, Humidity Transmitter
T3318
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For exacting interiors in building energy management and HVAC systems. Are designed for easy installation on ordinary KU68 wiring boxes for household switches and sockets.
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Product
1U Rackmount Network Appliance Platform With LGA1150 Socket Intel® Xeon® E3/Core™ Family Processor, Intel® C226 And Up To 24 LANs
NA570
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NA570 1U rackmount Network Security Platform, supports the 4th generation Intel® Xeon® E3 / Core™ processor family, formerly codenamed "Haswell". NA570 offers greatly improved performance and reduced power consumption base on the new Intel architecture marked improvements in power efficiency and performance. The system supports up to 32GB DDR3 1600 non-ECC / ECC (only NA570) memory. NA570 support 4 pairs of LAN Bypass function. Bypass ports allow users to experience uninterrupted network traffic even if a single in-line appliance hangs or sudden shutdown. Expandable LAN Modules via the PCIe 3.0, support up to 24 GbE ports, or up to 4 ports at 10GbE, and a future upgrade to 40GbE, port density and optional networking ports to suit your demands.
