Sockets
receive conductors.
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Product
Test Sockets
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Yamaichi Electronics Co., Ltd.
A test socket is the ideal point to test your home’s internal phone wiring for faults. You can also use it to identify any potential faults with the phone line outside. Your test socket is located in your master socket. It is the point between the internal phone wiring in your house and the phone line outside. That means by plugging into your test socket you can bypass all the internal wiring and test your device directly on the phone line.
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Product
Test Sockets
QFN/QFP
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For today’s chipscale packages, finding the right socket solution can be challenging. With SC™ sockets from Ardent, you can count on the right design, the best performance, and quick turns for even the most challenging custom designs
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Product
GHz Elastomer Sockets
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Ironwood’s GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA or QFN device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss up to >40GHz and supports BGA or QFN/MLF pitches down to 0.3mm was utilized in these sockets. GHz BGA sockets are mechanically mounted over a target system’s BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry’s smallest footprint). They support IC devices with body sizes ranging from 55mm down to 1mm. Larger body sizes may require a backing plate. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed. This insulation plate sandwiches between the backing plate and target PCB.
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Product
Silver Button Sockets
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For BGA, QFN, or LGA applications, GTP contact technology provides >94 GHz signal speed and can additionally be used in high cycle life applications such as ATE. These sockets support pitches from 0.2 mm to 1.27 mm. Ironwood's GT sockets are ideal for prototyping and testing almost any BGA device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 94GHz) and supports BGA packages with pitches down to 0.2mm was utilized in these sockets. GT BGA sockets are mechanically mounted over a target system's BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint).
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Product
Custom Sockets
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Plastronics socket designs range from off-the-shelf sockets ready for immediate delivery, semi-custom sockets that utilize universal components and totally custom one-of-a-kind sockets and fixtures.
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Product
QFN Sockets
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With the largest QFN catalog in the world, Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages. These sockets offer a modular design in a small outline with very low inductance. The Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version.
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Product
Custom Test Sockets
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RTI specializes in producing custom test sockets We work with your engineering team from prototype to production, ensuring your product meets your test requirements. Contact us for a free quote.
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Product
Sockets
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Ironwood Electronics Sockets – Embedded gold plated wire elastomer (SG) – Stamped & Etched spring pins (SBT) – Embedded silver ball elastomer matrix (SM/SMP)– Compressible silver button in polyimide (GT/GTP)– Surface mount adapters for sockets (SF)
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Product
Burn-In Test Sockets
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The selection of the test socket is critical to the performance of a device during qualification testing where electrical bias and signals are applied. Key factors such as mechanical compatibility, operating temperature, ability to withstand high moisture levels, signal speed and lead inductance/capacitance all need to be taken into account when selecting the best socket for the test application.
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Product
BGA Sockets
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Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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Product
LGA Sockets
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We’ve taken our QFN expertise and combined it with the versatility and performance of the H-Pin® to leverage an LGA socket platform that serves the demanding requirements of today’s market. Plastronics LGA sockets using the H-Pin provide a high-performance socket that is affordable for all burn-in operations. These LGA sockets meet the power, temperature and signal performance needs of the higher density, larger package outline, and sometimes mix-pitch LGA designs. The LGA platform serves package sizes from as small as 2.0mm X 2.0mm to the industry’s largest standard socket for 60.0mm X 60.0mm packages.
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Product
Stamped Spring Pin Sockets
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Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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Product
Near Zero Footprint SMT Spring Pin Sockets
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Ironwood Electronics socket is a device size or near device size footprint test socket incorporating industry standard high performance spring pins. Ironwood can design a socket to work with any type IC packages- BGA, LGA, QFN, DFN and even leaded devices where you need to fit a socket in place of your device to allow fast, easy testing and development.
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Product
Off-Set Kelvin Test Sockets
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This is an innovative and robust contact technology for making Kelvin contact to 0.5mm pitch QFNs. The contact uses a tip that is angled to one side, matched to an orientation that's flat on the tip. Two such contacts placed in opposition will touch the pad within 0.125mm. And because the tip is offset, the probe diameter is a robust 0.39mm and the load board pad pitch remains 0.5mm.
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Product
BGA Sockets
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Our BGA socket platform takes advantage of the H-Pin®, a high-performance stamped spring probe pin, to provide a pure vertical contact system that meets all BGA design challenges at an enabling cost.
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Product
4G Concurrent Device Programmer for PC /USB (4 sockets)
ProMax 4G
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ProMax is the most innovative and cost effective 4- or 8-gang programming solution on the market. ProMax supports a wide variety of programmable devices. Its state-of-the-art technology and high-speed programming algorithms optimize throughput, reliability and yields.
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Product
Evaluation Modules And Sockets
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Figaro USA offers a wide range of evaluation modules and sockets for test use.
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Product
High Performance Chipscale Test Sockets
SC
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Ardent Concepts Test Sockets for ATE test deploy patented SC Contact Sets. This technology is capable of over 2 Million mechanical insertions in production environments and uses easy to replace pins with no complicated assembly procedure. It is designed to be drop-in compatible with 1mm offset and straight through footprints to ease implementation, and RC SC’s simple and robust design is extremely cost effective when compared with existing “roll” type test contactors and sockets. Designed specifically for JEDEC QFN and MLF applications, SC High Performance Test Sockets are available for most handler set-ups and offer exceptional AC performance.
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Product
Interior Temperature Transmitter
T0218
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For exacting interiors in building energy management and HVAC systems. Are designed for easy installation on ordinary KU68 wiring boxes for household switches and sockets.
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Product
PXI/PXIe Power Relay Module, 36xSPST, 5 Amp, 50-pin SGMC Connectors, With Interlock
42-153-002-HI
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The 40/42-153-002-HI is a PXI/PXIe high density power relay module with 36xSPST switches rated at 5A and includes the hardware interlock option. User connection is via 2x50-pin SGMC male connectors, hardware interlock is via a 4-pin 00 series socket (mating plug is supplied).
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Product
1U Rackmount Network Appliance Platform
NA580
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The NA580 offers high reliability and performance through the LGA1151 socket Intel® Xeon® E3 and 7th/6th generation Intel® Core™ processors (codename: Skylake) with Intel® C236 chipset. The powerful network appliance supports up to 18 Gigabit LAN ports and allows system developers to configure their network solutions based on different performance requirements. Through the PCIe 3.0, the Axiomtek NA580 can integrate up to 18 Gigabit Ethernet ports. The standard configuration comes with 8 Gigabit Ethernet ports using Intel® i210 controller and supports 2 pairs of LAN bypass segments. Four DDR4 2133 MHz UDIMM sockets can provide storage of up to 32 GB and support both ECC and non-ECC memory types. To enhance reliability, this SMB network appliance platform supports data protection via 2 pairs of latch-type LAN bypass functions for fail-over option and features BIOS console redirection.
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Product
Digital Multimeter
DMT-4010RMS
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Monacor International GmbH & Co.
*True RMS measurement method*Dust and water protection according to IP class 67 with covered measuring sockets*Auto ranging for faster measurements*4000 digit resolution*Additional bar display*Voltage measurement up to DC/˜ 1000 V*Current measurement up to DC/˜ 10 A*Frequency measurement up to 10 MHz*Resistance measurement up to 40 MΩ*Capacitance measurement up to 40 mF*Temperature measurement -20 °C to +760 °C*Acoustic continuity test*diode test*Data hold (measured value memory)*peak hold*Maximum and minimum value recording*LC display with switchable background lighting*Automatic shutdown*overload protection*Supplied with test leads and protective case
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Product
Test Contactors/Probe Heads
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Cohu's line of test contactors, test sockets, and probe heads.
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Product
Semiconductor
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With ultra-multi pin count and fine pitch, our general-purpose IC socket lineup corresponds to every need. For semiconductor burn-in sockets for thermal acceleration tests, and test sockets for semiconductor electrical testing, we continue to hold a high market share all over the world.
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Product
Memory Tester for DDR4 DIMMS
RAMCHECK LX
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USBWith the RAMCHECK LX DDR4 memory tester package (part number INN-8686-DDR4) you can quickly test and identify DDR4 DIMMs that comply with JEDEC standards. Tests are fast, reliable and easy to do. The RAMCHECK LX DDR4 package includes the RAMCHECK LX base tester and 288-pin DDR4 DIMM adapter. (This package is also available with the DDR4 DIMM Pro adapter, featuring a very rugged test socket).
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Product
Automotive Contactor
Pad Series
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Johnstech International Corporation
Automotive Contactor is just the product you’re looking for! This Xtreme Temperature (XT™) capable product is designed to maximize your test results, regardless of your tri-temp testing objectives! Even if you are not testing outside the temperature limits of standard Contactors and sockets, the robust design of the XT™ Contactor provides additional design margin and certainly satisfies even your roadmap requirements.
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Product
3.5" Embedded SBC With AMD G-Series APU, AMD A50M, LVDS/DisplayPort/VGA, Dual LANs And Audio
CAPA110
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Axiomtek's CAPA110, a high-end graphics 3.5" embedded board is equipped with the latest AMD G-series APU dual core T56N 1.65GHz and AMD FCH A50M chipset, which is a wonderful choice for graphics-intensive applications such as high-end medical imaging, digital signage, kiosks/POI, thin clients, and gaming machines. One SO-DIMM socket on the CAPA110 supports up to 4GB of DDR3 1333 memory. The integrated Radeon™ HD6320 graphics controller delivers unprecedented high definition visual experience and offers outstanding 3D performance with DirectX 11 supported. Dual display capability is supported via the VGA and DisplayPort connections on the coastline, as well as onboard 18-bit/24-bit LVDS interface. Besides, the CAPA110 provides high-bandwidth expansion capability with one PCI Express Mini card for custom system configurations. Moreover, the system only requires +12V DC power input.
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Product
PICMG 1.3 Half-size CPU Card With Intel® Celeron® Processor J1900 (up To 2.42 GHz), SATA2, CFast™, VGA/LVDS And Dual LANs
SHB215
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*Intel® Celeron® Processor J1900 up to 2.42 GHz*1 DDR3L-1333/1600 SO-DIMM, up to 8GB*VGA and LVDS with dual-view supported*1 CFast™ socket onboard
