BGA
Surface mount chip package, which uses solder balls for its connectors.
-
Product
BGA Sockets
-
Our BGA socket platform takes advantage of the H-Pin®, a high-performance stamped spring probe pin, to provide a pure vertical contact system that meets all BGA design challenges at an enabling cost.
-
Product
DDR4 BGA Interposers, DDR4 DRAM X16 Packages
N2115A
-
The N2115A DDR4 BGA Interposers are soldered in between the DRAM and PC board or DIMM raw card where the DRAM would normally be soldered. They are designed with the PCB or DIMM foot print on the bottom side and the DRAM footprint on the top side. The signals from the memory controller chip and DRAM are then passed directly to the top side of the BGA probe adapter where they can be accessed with the oscilloscope probes.
-
Product
Open Top BGA Sockets
-
Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
-
Product
Optical BGA Inspection
-
Imaging hidden solder joints of BGA, IBGA, FlipChip, CSP, CGA and SMD components
-
Product
BGA Interposer, LPDDR4 200-ball, 2-wing For Logic Analyzer, Connects To 61-pin ZIF
W6601A
-
The W6601A LPDDR4 2-wing BGA interposer for LPDDR4 200-ball BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A logic analyzer module it is compatible with. The W6601A is the smallest BGA interposer for LPDDR4 200-ball DRAM capable of capturing simultaneous read and write traffic at data rates in excess of 3.2 Gb/s. U4208A and U4209A probe/cables connect W6601A LPDDR4 BGA interposer directly into the U4164A logic analyzer module from 61-pin high density zero insertion force (ZIF) connectors that attach to the W6601A BGA interposer wings. Refer to the W6601A data sheet for complete list of LPDDR4 signals probed with the W6601A.
-
Product
DDR4 X16, 2-Wing, Small KOV, BGA Interposer For Logic Analyzers
W4636A
-
The W4636A DDR4 x16 – 2 wing BGA interposer for 96 ball DDR4 DRAM is designed for data rates up to and including 2.4 Gb/s. The W4636A probes all ADD/CMD/CNTRL and partial DQ/DQS, and it is designed for minimal KOV for space limited systems under test. The W4636A is the least expensive DDR4 BGA interposer for a logic analyzer.
-
Product
BGA Rework Station
PDR IR-D3 Discovery
-
The system is tool free, gas free, instantly/precisely controllable, clean, modular, upgradeable and produces 100% yield BGA rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs, QFNs, Flipchips and is ready for 0201 and lead-free applications.
-
Product
DDR5 X4/x8 78-ball BGA Interposer For Use With U4164A Logic Analyzers
W5643A
-
The W5643A DDR5 2-wing BGA interposer for DDR5 x4/x8 BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A. The W5643A is the smallest BGA interposers for DDR5 x4/x8 DRAM capable of capturing simultaneous read and write traffic at data rates exceeding up to 5GT/s for protocol analysis and up to 4Gb/s for DQ capture. U4208A and U4209A probe/cables connect any W5643A DDR5 BGA interposer directly into the U4164A logic analyzer module using 61-pin high density zero insertion force (ZIF) connectors that attach to the W5643A BGA interposer wings.
-
Product
DDR4 BGA Interposers, DDR4 DRAM X4/x8 Packages
N2114A
-
The N2114A DDR4 BGA interposers provide signal access to the clock, strobe, data, address and command signals to the DDR4 BGA package for making electrical and timing measurements with an Infiniium oscilloscope. With the DDR4 JEDEC specification defined at the DRAM ballout, the BGA probe adapter provides direct signal access to BGA package for true compliance testing.
-
Product
BGA Socket Adapter Systems
-
Advanced Interconnections Corp.
BGA Socket Adapter Systems convert surface mount device packages to through hole (pinned) assemblies, making it easy to plug and unplug SMT devices whether you are planning for future device upgrades, field programming at point of use, or need the ability to quickly swap out device packages in the field or the test lab. Protects valuable PC boards and saves time by eliminating the need to desolder packages during device removal.
-
Product
BGA SMT Adapters
Giga-snaP™
-
Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
-
Product
DDR3 X16 Non-Stacked DRAM BGA Interposer For Logic Analyzers
W3636A
-
The W3636A DDR4 x16 BGA interposer allows you to gain signal access to the DDR3 signals critical to your debug and validation effort through a logic analyzer. The probe works in existing designs and eliminates the need for up-front planning or redesign. The probe connects directly to the balls of the DDR3 x16 non-stacked DRAM or with an optional 3rd party socket (not provided) enabling operation and acquisition of high-speed DDR3 signals without impacting the performance of your design.
-
Product
Digital Demultiplexers
-
Advanced Science and Novel Technology, Co., Inc.
24:48 digital demultiplexer (DMUX) with SSTL1.5 input and output interfaces.Supports data rates from 1.0Mbps to 2.0Gbps.User-controllable independent internal delays for data and clock signals.1.5V I2C control interface with a user-defined 3-bit chip address.Preset function for synchronization of multiple parallel devices.Full-rate output copy of external high-speed clock input signal.Two pairs of clock divided-by-2 and synchronous clock enable outputs for supporting the tree-type demultiplexation structure.Additional synchronous clock divided-by-4 output.Dual power supply of +3.0V and +1.5V.Industrial temperature range.Low power consumption of 2.1W at 2.0Gbps.Available in custom 256-pin BGA package (13mm x 13mm x 2.5mm).
-
Product
Soldering Inspection Video Microscope
MS-1000
-
The MS-1000 is a highly portable microscope for exclusive use with BGA, CSP, and QFP. It is highly efficient in inspecting portions which cannot be inspected by the X-ray inspection method.Specifically, it is efficient for inspecting the following conditions: fillets of soldered balls, melted condition of soldered parts, cracks, defective soldering, etc.
-
Product
HDMI/DVI Receivers
-
HDMI® receivers and DVI receivers remain in high demand for professional, consumer, and automotive video applications, with HDMI nodes constantly increasing. Analog Devices offers a range of HDMI/DVI receivers that enable high quality conversion of digital video data to formats such as HDMI, MIPI, and TTL. Applications include video distribution, gaming, and HDMI/DVI consumer device connectivity for automotive infotainment systems. Our portfolio of HDMI receivers and DVI receivers offers competitive advantages such as automotive qualification, superior HDMI/DVI equalizer performance, comprehensive audio extraction, and small packages (6 mm × 6 mm, 0.5 mm pitch BGA).
-
Product
Test Socket Based Elastomeric Matrix Connectors
-
Z-Axis offers a wide range of high performance test sockets, which are based on our elastomeric matrix connectors, for wide range of IC packages (BGA sockets, LGA sockets, etc.), coaxical, and wafer level; and for testing high speed, digital, analog, and RF signals etc.
-
Product
Silver Button Sockets
-
For BGA, QFN, or LGA applications, GTP contact technology provides >94 GHz signal speed and can additionally be used in high cycle life applications such as ATE. These sockets support pitches from 0.2 mm to 1.27 mm. Ironwood's GT sockets are ideal for prototyping and testing almost any BGA device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 94GHz) and supports BGA packages with pitches down to 0.2mm was utilized in these sockets. GT BGA sockets are mechanically mounted over a target system's BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint).
-
Product
BGA Rework Station
PDR IR-E3 Evolution
-
The PDR IR-E3 SMT/BGA rework system, using PDR’s patented Focused IR technology, has been specifically designed to cope with the challenges of repairing today’s PCB assemblies.
-
Product
Circuit Card Assembly
-
Teledyne Advanced Electronic Solutions assembles and tests a variety of complex circuit card assemblies (CCAs) using leading edge, advanced technology assembly automation. We specialize in low-volume, high-mix assembly of highly complex CCAs.- RF, analog, high-speed and digital circuits on rigid-flex and Cu core substrates- Typical lot sizes from 3 to 300 pieces- 4 high speed, flexible SMT lines- Production processes for components from 0201 chips to large grid-array components and connectors- 100% solder paste, automated optical, and x-ray inspection- Forced air convection reflow with inert atmosphere option- Special processes for RF assemblies (filters, shields, etc)- BGA underfill, conformal coating, etc.- Selective and wave solder pin-thru-hole processes- CCA and component bonding processes
-
Product
Labelling Systems
8000BL
-
The Model 8000BL is a high volume labelling system for tray-borne devices. Equipped with tray stackers and a Zebra 90XiII label printer, the 8000BL can apply labels safely, accurately and quickly to BGAs, QFPs, TSOPs, PGAs, etc.
-
Product
Inspection Solutions
-
Entire range of optical inspection systems. From the SPI machine (SPI inspection) for checking solder paste printing, to an inline AOI for THT or SMD-assembled PCBA, to AXI machine for BGA x ray inspection. And furthermore, GÖPEL electronic's AOI PCB inspection can be used for conformal coating inspection (CCI) of various protective coatings applied to boards.
-
Product
Low-power, High-performance FPGA
iCE40 LP/HX
-
*Available in three series with LUTs ranging from 384 to 7680: Low power (LP) and high performance (HX)*Integrated hard I2C and SPI cores that enable flexible device configuration through SPI*Match your preferred display to your application processor with interfaces such as RGB, 7:1 LVDS and MIPI DPI/DBI*Multi-source your image sensors by implementing flexible bridges supporting common interfaces such as HiSPi, subLVDS, LVDS and Parallel LVCMOS*Up to 128 kbits sysMEM™ Embedded Block RAM*Industry’s broadest range of 0.35 mm - 0.40 mm pitch BGAs fit in space-constrained applications
-
Product
9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXE-5600 Series
-
- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 BGA processor and Mobile Intel® CM246 Chipset- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0- Rich storage: 2x 2.5" SATA 6 Gb/s, CFast, M.2 2280
-
Product
Get Flexible, Get FlexiFLASH
LatticeXP2
-
*Up to 885 Kbits sysMEM™ embedded block RAM and up to 83 Kbits distributed RAM*sysCLOCK™ PLLs up to four analog PLLs per device that enable clock multiply, divide and phase shifting*Three to eight sysDSP blocks for high performance multiply and accumulate.*Pre-engineered source synchronous IOs for DDR/DDR2 up to 200 MHz and 7:1 LVDS interface support up to 600 Mbps*Available in csBGA, TQFP, PQFP and BGA packaging
-
Product
Thermal Test Vehicles
TTV
-
Thermal Engineering Associates, Inc.
Using the TTC-1002 Thermal Test Chip as a basis, TEA offers TTVs in flip-chip, bare die, BGA packages for a variety of thermal simulation, reliability, qualification, heat sink characterization, and TIM characterization activities. Selective unused balls are sequentially connected together for daisy-chain applications.
-
Product
Low Power FPGA Featuring Hardened MIPI D-PHY, LVDS, SLVS, SubLVDS, & Open LDI Bridging
CrossLink
-
*Two 4-lane MIPI D-PHY transceivers at 6 Gbps per PHY*15 programmable source synchronous I/O pairs for camera and display interfacing*Available in amazingly small 2.46 mm x 2.46 mm WLCSP packages and BGA packages with 0.4 mm, 0.5 mm and 0.65 mm pitch
-
Product
Grypper "Y"
-
Ironwood Electronics Grypper Y contact is design to work with BGA devices with solder balls/bumps with no equator or small exposure where the standard Grypper cannot reliably hold on to the solder ball. The Y shape, working with the sliding lid, allows reliable contact and ensures device retention in high vibration application. Lower forces, <25 grams, makes insertion easier too and the less aggressive contacting allows 40+ insertions of the same device. The Sliding Lid can be configured to include heat sinking. The Y contact designs cover BGA devices from 0.35mm pitch and larger and the short electrical length has superior electrical performance.
-
Product
Adapters
-
- Pluggable BGA adapter system (Giga-snaP™) – Surface mount package emulators – Package convertors & Fix adapters – Prototype, probe & analysis adapters – Receptacles, extenders, rotators and socket plugs– Electronic modules
-
Product
Ultra High Speed Pick & Place
MC889
-
The MC889 is specially designed for the fast and highly precise loading of large batch sizes. This pick and place machine is equipped with an optical centering, "Vision on the Fly" system that guarantees the best possible measurement of SMD components (such as 0201, SOIC, PLCC, BGA, µBGA, CSP & QFP, as well as odd-shaped components) while completing placement at rates of 20,000 CPH.
-
Product
X-Ray Inspection System
MX1
-
Manncorp’s new MX1 is a high-performance x-ray inspection system designed for real time imaging of multilayer PCBs and dense metal BGAs, μBGAs, and chip scale packages. Its high voltage (80kV), computer-controlled x-ray tube and 35 μm focal spot provide the power necessary for detection of a variety of defects including bridging, voids, and missing balls. The MX1’s standard camera features continuous zoom magnification from 4X to 50X and variable angle viewing up to 45°, and an upgrade to the x-ray tube can boost magnification to 225X.
