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Asynchronous System Level Test Platform
Titan
The Titan System Level Test (SLT) platform delivers maximum flexibility, scalability and density in semiconductor test environments that require the highest levels of system performance testing. Titan is Teradyne’s solution for high-volume mobile application processor SLT requirements.
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Systems Integration for Circuit Card Assembly
Teledyne Advanced Electronic Solutions integrates CCAs and other sub-assemblies, cables and fabricated parts into system modules shipped directly to customers for integration into their products.- Box Build: custom built to order system solutions- High complexity box assemblies and subsystems- High frequency RF box assemblies and subsystems- Full functional RF testing up to 26 GHz (K band)- Multi-level systems integration – build and test modules and CCAs and integrate into higher level assemblies- Custom cell design for customer subsystems- Special bonding processes including thermal management and vibration- Robust torque and FOD control programs- System level testing including functional, vibration and thermal- Complex harness fabrication and integration- Fiber-Optic and RF waveguide integration and testing- Large system capacity in excess of 200 lbs.- Configure to order – Integrate different options, firmware, configurations, etc across a single order as required
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ECM PCB Tester
MS 1105
*Used for testing of DAWN RWR PCBs in Jaguar Aircraft*19” Rack mountable with built-in wide range of IO signals *Used in 4th line servicing of PCBs*Used in LRU and system level testing*Detects 100% fault coverage including track faults*Adaptability with off-the-shelf instruments
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Motion Simulator For Test Systems
Metis
METIS is a motion simulator for sensor and end system level testing. Configurable design allows you to create system you need! - 1-axis rate table for gyro testing - 2-axis unit for 6DOF accelerometer and gyroscope testing - 3-axis Gimbal system for simultaneus Yaw, Pitch and Roll stimulus.
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System Level Test
SLT
As technology nodes continue to evolve and with a more aggressive time to market to bring devices to their end applications, full test coverage of such chips is possible only with System Level Testing.
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Distributed Test Manager
DTM
The Distributed Test Manager (DTM) is a Windows™ application which enables many different types of system level testing by simulating multiple devices in a system. DTM is a system level simulator that is unique compared to other Triangle MicroWorks tools which test the communications of a single device. DTM is a highly extensible tool with multiple options for configuring devices, creating test cases, and simulating data in the system.
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Test & Test Development for Circuit Card Assembly
Teledyne Advanced Electronic Solutions performs comprehensive testing at the CCA and system level assembly. Teledyne AES can perform testing developed by the customer or develop a complete test strategy for the customer’s products.- Bed of Nails FixtureIn-Circuit Test (Bed of Nails) or Flying Probe Testing for rapid feedback on CCAs- Functional testing of CCAs or complete systems- Environmental testing to include vibration, thermal cycling, HASS, etc.- CCA and system level test development- High frequency testing – currently to 40 GHz- High power system testing – currently to 4kW
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DRAM Module Test
We provide our customers with Automated SLT (System Level Test) Solutions for DRAM Module HVM test. Our solution gives our customers the best possible combination of technologies for the best performances and manufacturing effiencies - increasing yield, reducing cost of ownership and accelerating time-to-market.
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SLT Socket
Mobile Phone, Tablet, TV Board, Set-top box etc.LEENO can provide a System Level Test solution on various types of packages.
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System Level Test and Burn-in Solutions
System Level Test (SLT) is a paradigm shift from traditional structural and functional testing. The device is tested in a complete, integrated system to evaluate its compliance against specified requirements. The system approach allows for higher and more cost-effective test coverage especially for multi-function and non-deterministic devices. It also brings new integration and test challenges like: ..Designing test fixtures on Burn-in Boards with system components ...
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±6 kV ANSI/ESDA/JEDEC HBM Test System
HBM-TS10-A
High Power Pulse Instruments GmbH
*±6 kV Human-Body-Model (HBM) tester according ANSI/ESDA/JEDEC JS-001 standard with C = 100 pF, R = 1.5 kΩ discharge network*Wafer, package and system level HBM testing*True HBM: the classical discharge network of the HBM-S1-A according the standard ensures compliant waveforms for all load conditions*No trailing pulses*Integrated 10 kΩ charge removal resistor*Integrated DUT HBM current sensor for real time transient current monitoring with 1V/A output sensitivity into 50 Ω digital oscilloscope input*Integrated DUT HBM voltage sensor for real time transient voltage monitoring with 1/200V/V output sensitivity into 50 Ω digital oscilloscope input*Integrated overvoltage protection of the DUT voltage sensor, DUTcurrentsensor and DC test interface for efficient overload protection of the digital oscilloscope and SMU during high voltage HBM testing*Integrated DC test DUT switch with automatic switch control*Integrated 50 Ω precision hardware trigger output for high speed digital oscilloscopes*Fast HBM measurements, typically 0.5s per pulse including one-point DC measurement between pulses*Eficient sofware for system control and waveform data management (fully compatible with TLP measurement data)*The sofware can control automatic probers for fast measurements of complete wafers*Compact size 145 mm x 82.5 mm x 44 mm of the integrated HBM pulse generator probehead*System controller size 483 mm x 487 mm x 133 mm*High performance and high quality components*Optionally available hardware upgrades to all HPPI fully integrated HBM/HMM/TLP/VF-TLP test systems TLP-3010C, 4010C, 8010A, and 8010C
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Device Testing
S-TEST Lab
SPEKTRA Schwingungstechnik und Akustik GmbH Dresden
S-TEST Lab solutions have been tailored for system level testing in development and lab environments. The core component is the S-TEST desk system. It combines a compact design with the full test interface, that enables the developer to react flexible on changing requirements already in early project phases and to also verify product performance parameters.
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Semiconductor Test
Smiths Interconnect’s test socket and probe card solutions utilize IDI contact technology to ensure superior quality and reliability in semiconductor test applications. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms.
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Standalone Bench Test System for FCT, ICT, ISP and Boundary Scan
LEON Bench
The LEONBench test system is a flexible and scalable test system that features an excellent signal integrity and a high-quality fixture interface. This is achieved by combining a cableless connection from ABex modules to Virginia panel interface connectors. The system is optimized for high pin count test applications. Furthermore, it can be equipped with vacuum and pneumatic. Support for multi-level contact fixtures enables separate contact levels for FCT and ICT. The Konrad ITA (Interchangeable Test Adapter) frame allows various fixture houses all over the world to build custom fixtures for the LEONBench. Up to 15U additional rack space allows adding a bunch of high-performance measurement devices from various manufactures. An integrated power distribution unit takes care about power on and off sequencing.As part of the LEON Family, LEONBench is based on the ABex platform which directly incorporates Konrad analog bus technology and PXI/PXIe in one chassis.
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Automated Test Systems
WinSoft designs, develops and integrates automated functional test systems for use in aerospace, military, high tech and commercial applications
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Mixed Signal Battery Test System
The Mixed-Signal Battery-Test System is an automated test platform designed to meet today’s advanced battery test requirements. The platform is ideal for testing a range of battery cells and packs, and can be used in applications such as research and design, quality control, and end-of-line manufacturing. Its distributed architecture provides a scalable solution with configurable system components to accommodate specific applications.
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Other Test Systems
Your business challenges do not fit the typical mold. Your test requirements are different. Ball Systems has more than 50 years of experience in multiple industries that has exposed our team to a wide variety of testing applications. As a result, we’ve likely created a solution for a challenge similar to yours.
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Scienlab Battery Test System – Pack Level, 110 KW Compact Version
SL1710A
Compact solution for testing Battery Packs with output power up to 110 kW and voltage range up to 1500 V
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Semiconductor Test System
TS-960e
The GENASYS Semi TS-960e PXI Express Semiconductor Test System is an integrated test platform that offers comparable system features and capabilities found in proprietary ATE systems. Available as a bench top system or with an integrated manipulator, the TS-960e takes full advantage of the PXI architecture to achieve a cost-effective and full-featured test solution for device, SoC and SiP test applications.
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Compact & Flexible Test Systems for FCT,ICT, ISP and Boundary Scan Designed for Easy Integration
LEON Rack
The LEONRack test system is a flexible test system that could be installed in automation or handling solutions. It is highly flexible and available in three different chassis sizes from low pin count to high pin count test systems. As part of the LEON Family, LEONRack is based on the ABex platform which directly incorporates Konrad analog bus technology and PXI/PXIe in one chassis.
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Eagle Test Systems
ETS-200T
The ETS-364 is a general-purpose precision analog and mixed-signal test platform designed for high volume production testing of integrated circuits; optimized for high throughput applications with a fully integrated multisite software and hardware architecture.
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PXI Semiconductor/IC Test System
A high-density 100MHz PXIe digital IO card designed for characterizing, validating, and testing a variety of digital and mixed-signal ICs. Each IO card consists of a Sequencer Pattern Generator (SQPG) and 32 channels of full ATE-like features. The 33010 IO card is expandable up to 256 channels. Some unique features of the 33010 include an on-board SQPG, per pin timing/levels/ PMU/TFMU, multiple time domains, and multithreaded testing for complex IC testing. Each channel is also equipped with 64M vector memory, 16 timing sets with on-the-fly timing change, and per pin timing and frequency measurements up to 400 MHz.
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VLSI Test System
3380
The 3380 VSLI test system equipped with a maximum of 1280 I/O channels, 256 VI sources, flexable architecture and comprehensive optional function boards (ADDA/Hi-voltage DPS) can meet the high parallel multi-test tendency.
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Universal Test System
LEON System
A universal ICT, FCT, ISP and Boundary Scan platform.Based on the ABex platform, which directly integrates Konrad analog bus technology and PXI/PXIe in one chassis, the LEON platform can be configured to solve various test challenges. Due to this architecture only one system provides the complete test flow combining ICT, ISP, Boundary Scan and FCT.Various form factors and configurations allow a perfect combination between cost, speed and test coverage. The modular architecture provides the possibility to reconfigure or upgrade the systems based on your test needs.The LEON System software provides a powerful development and test execution environment which directly supports NI TestStand. All systems and components could be integrated into third party software using supplied APIs.
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EMI Test System
TS9975
The R&S®TS9975 is the base system for conducted and radiated EMI measurements. Due to its modular design, it covers a wide range of applications and can be very easily adapted to the measurement task at hand. Any configuration is possible – from conducted measurements and the small precompliance system with a compact test cell to the accredited test system for large equipment under test. Combinations of different applications or incremental expansion are easily possible.
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Build-to-Print for Test Systems
Built-to-print / test system replication addresses your internal capacity and capability constraints. Ball Systems has perfected quoting, procurement, planning, assembly, testing, quality, delivery and installation to ensure your testers are on-time and on-budget, and meet design and production standards while keeping open and transparent communication.
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Test System Optimized for High Volume Production Testing of Integrated Circuits
ETS-364 / ETS-600
The ETS-364 is a general-purpose precision analog and mixed-signal test platform designed for high volume production testing of integrated circuits; optimized for high throughput applications with a fully integrated multisite software and hardware architecture. The test system offers separate floating resources for each site, improving site isolation and measurement accuracy coupled with digital instrumentation enabling the most efficient, high-volume testing available. The system supports up to 240 analog pin channels, and offers 133 MVPS digital vector rate with up to 128 digital pin channels. Eagle's scalability includes the ability to double the capacity of an ETS-364, providing more than 480 analog pin channels and up to 256 digital I/O pin channels with the ETS-600.
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Test System
BMS HIL
The BMS Hardware-in-the-Loop (HIL) Test System is a high performance platform providing all necessary input signals used for battery pack simulation. A real-time operating system executes complex cell and pack models commonly used for BMS algorithm development and firmware regression testing.
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Regenerative Battery Pack Test System
17020E
Charge/discharge modes (CC, CV, CP)Power Range: 10kW / 20kW per channelVoltage Range: 60V/ 100VCurrent Range: 100A/200A/300A/400A/ 500A/600A/700A/800A per channelRegenerative battery energy discharge, efficiency 85%Channels paralleled for higher currentsDriving cycle simulationFast current conversion without current interruptHigh precision measurementSmooth current without over shootTest data analysis functionData recovery protection (after power failure)Independent protection of multi-channel
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In-Circuit Test
TestStation LH
The TestStation LH in-circuit test system is a lower-cost, small footprint, feature scalable version of Teradyne's popular, award winning TestStation product family. TestStation LH features SafeTest protection technologies for accurate, reliable, and safe testing of the latest low-voltage technologies.
