CSP Test Sockets
More Info| Related Searches: | Burn-In Boards, Burn-In Sockets, Contactors, PLCC, QFN, QFP, SOIC, Test Heads, TSOP, TSSOP, uBGA |
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µHELIX® Test Probes AlphaTest Corp. Contact Info Send To Colleague Test Probes for fine-pitch applications: CSP, BGA, SiP, SoC, flex-circuits, micro pcb, sub-mm center-to-center spacing, half mm, quarter mm spacing. Excellent for use in sockets, fixtures, and contactors for semiconductor testing and in coaxial installations. ...more -
Wafer Level CSP PROBE CARD Leeno Industrial Inc. Contact Info Send To Colleague Pitch : 0.25 ~ 0.5mm Planarity : < 20 ㎛ Accuracy : ± 10 ㎛ Spring Force : 6g/pin ~ 30g/pin Resistance : < 0.5 Ω Characteristic Impedance : 50 Ω ± 5 Application CSP or WLCSP type wafer level test Socket Part Name 152WLPC-0.25-D2 132WLPC-0.3-D1 64WLPC-0.5-G1 ...more -
CSP Sockets Loranger International Corporation Contact Info Send To Colleague Designed to Connect to Packages for Burn-in and Test. Accommodating Variations in Package Thicknesses. Direct-Contact Sockets Join Package Solder Balls to Surface Mount Pads on Board ...more
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Definition: Test connector assemblies that mate with the pads on an integrated circuit's chip size packaging. |