Showing results: 511 - 525 of 527 items found.
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North Atlantic Industries
NAI designs and manufactures a full line of Commercial Off-the-Shelf (COTS), Modified COTS and Custom Power Supplies - including configurations that meet VME, cPCI and VPX (VITA 62) requirements. All comply with environmental standards designed for harsh environments, including MIL-STD-810G, VITA 47 and MIL-STD-901. NAI’s rugged power supplies also have integrated EMI filters per MIL-STD-461 standards.
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Model 7070-324 -
Pentek, Inc.
The FlexorTM Model 3324 is a multichannel, high-speed data converter FMC. Itis suitable for connection to HF or IF ports of a communications or radar system. It includes four 500 MHz, 16-bit A/Ds, four 2 GHz, 16-bit D/As, programmable clocking, and multi-board synchronization for support of larger high-channel count systems. When combined with a Pentek 3U VPX or a PCIe FMC carrier, the 3324 is available as a FlexorSet, a complete turnkey data acquisition solution.
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VPX6-684 -
Curtiss-Wright Defense Solutions
Curtiss-Wright's VPX6-684 FireBlade provides Systems Integrators with a fast, secure and unified approach to interconnect subsystems, chassis, cards, and compute nodes within any given platform using 1 or 10 Gigabit Ethernet links. Providing up to 24 wirespeed 10/100/1000 Mbps interfaces and up to four 10 Gbps interfaces in a single 6U VPX slot, the VPX6-684 Ethernet Switch is ideal for architecting system-wide Intra-Platform Networks (IPNs).
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Model 6003 -
Pentek, Inc.
- Unique QuartzXM eXpress Module enables deployment in custom form factors- Supports Xilinx Zynq UltraScale+ RFSoC FPGAs- 16 GB of DDR4 SDRAM- Measuring only 2.5 by 4 inches- LVDS connections to the Zynq UltraScale+ FPGA for custom I/O- GTY connections for gigabit serial communication- Ruggedized and conduction-cooled versions available- Includes a complete suite of IP functions and example applications- Model 8257 1-Slot 3U VPX Development Chassis for Quartz Products
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Model 6001 -
Pentek, Inc.
- Now available in RFSoC Gen 3 with the Model 6003- Unique QuartzXM eXpress Module enables deployment in custom form factors- Supports Xilinx Zynq UltraScale+ RFSoC FPGAs- 16 GB of DDR4 SDRAM- Measuring only 2.5 by 4 inches- LVDS connections to the Zynq UltraScale+ FPGA for custom I/O- GTY connections for gigabit serial communication- Ruggedized and conduction-cooled versions available- Includes a complete suite of IP functions and example applications- Model 8257 1-Slot 3U VPX Development Chassis for Quartz Products
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VPX3-534 -
Curtiss-Wright Defense Solutions
The VPX3-534 combines high-speed multi-channel analog IO, user programmable FPGA processing and local processing in a single 3U VPX slot for direct RF wideband processing to 6 Gsps. This card allows for a high performance single slot transceiver with two 6 Gsps 12bit channels, to over 6 GHz instantaneous analog bandwidth, but can also scale to larger system with many channels. An embedded Xilinx Zynq UltraScale+ MPSoC device supports local processing options and well as high level system interfaces.
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MIC-6311 -
Advantech Co. Ltd.
Advantech’s MIC-6311 is a single processor VPX blade based on the 4th generation Intel® Core™ i3/i5/i7 platform. It enables the highest performance available in 6U VPX form factor with two SRIOx4 ports in the VPX data plane and two PCI Express x8 gen. 3 lanes in the VPX expansion plane for workstation and compute intense applications. The two Serial RapidIO ports offer the possibility to interface the MIC-6311 to digital front ends such as DSP and FPGA cards via a high speed, low latency deterministic interconnect. In addition, PCI Express ports with up to 8GB/s throughput offer a high performance interface to mainstream peripherals and IO cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6311 offers the ability to fit harsh environments while maintaining maximum memory throughput and supporting memory expansion using the latest SO DIMM technology. Moreover, the 4th generation Intel® Core™ processors offer increased cache size and efficiency as well as instruction set improvements which make the MIC-6311 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for rugged environments, MIC-6311 has been designed to support ruggedized convection cooled heat sinks. Additionally, it implements an onboard soldered, industrial SSD for maximum reliability. By using the latest powerful PCH (Lynx Point) from Intel®, with its advanced SATA controller advanced storage options are supported such as a 2.5" SATA III HDD/SSD socket offering high storage capacity with up to 6Gbps transfer speed. A CFast socket provides an alternative for implementing a cost efficient, pluggable SSD. An onboard XMC/PMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports in front panel can connect to the external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS232 console (RJ45) and two GbE RJ45 ports, powered by Intel®’s latest Gigabit Ethernet Controiller, the i350. The processor’s integrated enhanced graphics engine Iris offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6311’s VGA front panel port and two Display port / HDMI interfaces on rear transition modules. Audio port support via the backplane interface enhances media support. Three SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to backplane to fulfill the demand for extra IO ports or storage. Two GbE/ SERDES ports support system level IP connectivity and two UART interfaces can be leveraged to interface to legacy devices and consoles.
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MIC-6314 -
Advantech Co. Ltd.
The MIC-6314 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ embedded platform with increased cache size and efficiency, as well as instruction set improvements. The MIC-6314 provides two configurable PCIE x 8 ports in the VPX data plane and two PCI Express ports x8 lanes in the VPX expansion plane to enable the highest performance available in the 6U VPX form factor compute intense applications. These PCIE interfaces offer high speed up to PCIE gen. 2 (5Gb/s) throughput, low latency, scalable, error recoverable deterministic interconnectivity to the mainstream peripherals and I/O cards such as DSP and FPGA cards. The PCIE widths and ports on the data plane and the extension plane of MIC-6314 is user configurable, which make MIC-6314 capable to replace the PCIE switch blade in a small system. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6314 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. Tailored for harsh environments, the MIC-6314 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternated optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a SSD socket is also available for a cost-efficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6314 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The Intel® next generation graphics engine Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using VGA and 2 DVI ports on MIC6314. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. A PCIEinterface is reserved for the optional M.2 high speed storage.Besides the modern M.2 storage, three SATA III one SATA II and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485selectable) can be leveraged to interface to legacy devices and consoles.
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MIC-6330 -
Advantech Co. Ltd.
Based on the Intel® Xeon® E3 Lv5 and Lv6 embedded platform, the MIC-6330 builds on the success of Advantech’s 6U VPX boards, and is the first 3U VPX product launched by Advantech. Together with the Intel® processor, the MIC-6330 offers intense computational ability in a very compact form factor. The MIC-6330 provides configurable connectivity (up to four ports) of PCI Express via the backplane to the highest performance mainstream peripherals and I/O cards, and vast I/O functions for extended interconnectivity and controllability. The MIC-6330 meets various computing needs, including vPro™ and workstation capabilities, by using the Intel® CM236/CM238 PCH. The MIC-6330 offers high storage capacity at up to SATA 6Gbps transfer speed. Four USB2.0 ports and one USB 3.0 port to the backplane fulfill requirements for extra I/O ports or storage, up to 5Gbps data rate. Four GbE ports (two ports configurable as SERDES) support system level IP connectivity, and the UART interfaces (RS-232/422/485 selectable) can be leveraged as an interface to legacy devices and consoles. Like Advantech’s 6U VPX products, the MIC-6330 supports multiple displays, and the maximum resolution of the MIC-6330 is 4K, empowered by the Intel® integrated graphics engine. The MIC-6330 also offers a High Definition Audio to the backplane interface for media demands. With the standard ruggedized convection cooled heatsink or the optional air-cooled heatsink, the MIC-6330 is tailored for harsh environmental applications and adaptable to various chassis designs. The industrial NAND Flash, and the soldered onboard DDR4 ECC memory chips are appropriate for a variety of vehicle applications for the maximum reliability. The MIC-6330 is sophisticated and suitable for various purposes. An onboard X8D XMC site with PCIE x8 gen.3 connectivity can host high speed offload or I/O mezzanines for project-specific applications. For applications that need the maximum expandability, the XMC interface can be modified to add another DisplayPort and the 2 more UART. The optional front I/O module facilitates the development and qualification process, and also enables the possibility of the front panel access.
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MIC-6131 -
Advantech Co. Ltd.
MIC-6131 is a 3U OpenVPX XMC carrier. MIC-6131 complies with the MOD3-PER-1F-16.3.2-3 profile, and the VITA 46.0, 46.4, 46.9 and VITA 48 specification. The MIC-6131 Data Plane has the PCIe Gen 3. Input, up to x8 lanes, and provides the optional PCIe gen. 3 output with another x8 lanes. With this design, MIC-6131 is able to support the most powerful XMC with the 75W power consumption*, and doesn’t sacrifice the full fabric bandwidth from the main board. For the XMC pin out, MIC-6131 has the X24S X8D X12D pin field on the VPX connector P2, and enables the vast capability of customization of the customer.
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MIC-6313 -
Advantech Co. Ltd.
The MIC-6313 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ and Intel® Xeon® Processor E3 Lv4 embedded platform. To enable the highest performance available in the 6U VPX form factor for workstation and compute intense applications, the four Serial RapidIO ports in the VPX data plane offer high speed up to 5Gb/s, low latency, scalable, error recoverable deterministic interconnectivity to digital front ends such as DSP and FPGA cards. In addition, two PCI Express ports x8 lanes in the VPX expansion plane, with up to PCI Express gen. 2 (5Gb/s) throughput offer a high performance interface to mainstream peripherals and I/O cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6313 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. In addition, the 4th/ 5th generation Intel® Core™ and Xeon® E3 Lv4 embedded processors offer increased cache size and efficiency, as well as instruction set improvements, which make the MIC-6313 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for harsh environments, the MIC-6313 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternative optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a CFast/ SSD socket is also available for a costefficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6313 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The next generation graphics engine Intel® Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6313’s DVI front panel port and two DVI interfaces on rear transition modules. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. Four SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485 selectable) can be leveraged to interface to legacy devices and consoles.
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Curtiss-Wright Defense Solutions
Mission computers are the heart of every platform. To ensure your mission success, our embedded computing systems are backed by decades of experience developing C5ISR, vetronics, and program-specific system solutions. Whether you're looking for a modular, small form-factor (SFF) line replaceable unit (LRU) or a scalable VPX system designed to meet your specific requirements, our computing systems are built rugged to perform optimally in the harshest deployed environments on land, in the air, or at sea. Our industry-leading system architects partner with you to meet your system integration and program management requirements. They leverage our comprehensive range of open architecture commercial off-the-shelf (COTS) building blocks or design a unique custom solution when required.
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Model 71751 -
Pentek, Inc.
- Complete radar and software radio interface solution- Supports Xilinx Virtex-7 VXT FPGAs- Two 500 MHz 12-bit A/Ds- Two multiband DDCs (digital downconverters)- Two 800 MHz 16-bit D/As- One DUC (digital upconverter)- Multiboard programmable beamformer- 4 GB of DDR3 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with switched fabric interfacesOptional LVDS connections to the Virtex-7 FPGA for custom I/OAlso available in 3U VPX, 3U & 6U cPCI & PCIeSupports GateXpress® FPGA-PCIe Configuration ManagerSynchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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Model 71762 -
Pentek, Inc.
- Complete radar and software radio interface solution- Supports Xilinx Virtex-7 VXT FPGAs- Four 200 MHz 16-bit A/Ds- Four multiband DDCs- 4 GB of DDR3 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with switched fabric interfaces- Optional user-configurable serial gigabit interfaces- Optional LVDS connections to the Virtex-7 FPGA for custom I/O- Also available in 3U VPX, 3U & 6U cPCI & PCIe- Supports GateXpress® FPGA-PCIe Configuration Manager- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe- See comparable Jade Xilinx Kintex UltraScale FPGA Module: Model 71862
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Model 7053 -
Pentek, Inc.
- Supports Xilinx® Zynq® UltraScale+" RFSoC FPGA- 16 GB of DDR4 SDRAM- On-board GPS receiver- PCI Express (Gen. 1, 2, and 3) interface up to x8- LVDS connections to the Zynq UltraScale+ FPGA for custom I/O- Optional front panel dual optical MPO interface for gigabit serial communication- Unique QuartzXM eXpress Module enables migration to other form factors- Navigator BSP® for software development- Navigator FDK® for custom IP development- Free lifetime applications support- Pentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Synchronize up to eight modules with Model 5903 High-Speed System Synchronization and Distribution Amplifier - 3U VPX- Please refer to the product datasheet for Installed FPGA IP Module details
