3U OpenVPX XMC carrier

MIC-6131 is a 3U OpenVPX XMC carrier. MIC-6131 complies with the MOD3-PER-1F-16.3.2-3 profile, and the VITA 46.0, 46.4, 46.9 and VITA 48 specification. The MIC-6131 Data Plane has the PCIe Gen 3. Input, up to x8 lanes, and provides the optional PCIe gen. 3 output with another x8 lanes. With this design, MIC-6131 is able to support the most powerful XMC with the 75W power consumption*, and doesn’t sacrifice the full fabric bandwidth from the main board. For the XMC pin out, MIC-6131 has the X24S X8D X12D pin field on the VPX connector P2, and enables the vast capability of customization of the customer.

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3U VPX

Advantech Co. Ltd.

Advantech 3U VPX CPU blades are OpenVPX-complaint and provide high speed, low latency, and scalable interconnectivity with flexible developer tools.

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3U OpenVPX PCIe/ SATA M.2 carrier

MIC-6130 - Advantech Co. Ltd.

MIC-6130 is a 3U OpenVPX M.2 carrier. MIC-6110 complies with the MOD3-PER-1F-16.3.2-3 profile, and the newest PCI Express M.2 Specification Revision 1.1. Advantech provides MIC-6130 with either the PCIE Gen.3 interface or SATA III interface, and various physical device sizes for the different usages.

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3U OpenVPX PCIe/ Ethernet Hybrid Switch

MIC-6030 - Advantech Co. Ltd.

The MIC-6030 is a ruggedized single-slot 3U OpenVPX switch providing high-speed, low-latency interconnects between VPX blades connected to PCI Express and Ethernet backplane fabrics. An ExpressLane™ PEX8733 PCIe Gen3 switch connects to six PCIe Gen3 x4 ports enabling non-transparent and transparent bridging of processor blades for highly flexible multi-host and legacy configurations. A Marvell® Link Street® 88E6390X Ethernet layer 2 switch with VLAN support switches gigabit Ethernet traffic between VPX blades connected to the Ethernet fabric enabling a linerate control plane. When configured with optional Mellanox ConnectX®-4 Multi-Host™ Technology and drivers, the MIC-6030 enables high speed communication of up to 10Gbps bandwidth between up to 4 processor VPX blades VPX by transforming the PCIe bus into a programmable network interface, facilitating the development of data communication between boards and eliminating the need to program a more complex DMA interface. The onboard BMC firmware based on Advantech’s IPMI core technology brings an advanced set of system management features and can be customized when unique features are required. Lightweight switch management is available via the BMC, supporting tagged and untagged VLANs, port-based VLAN, and port status reporting. Advantech offers standard designs with either convection or conduction-cooling. A conduction-cooled heatsink ensures operation in harsher environments, providing a reliable solution for operation in extended temperatures, and where extreme shock and vibration requirements must be met. The MIC-6030 is compact, light and robust, meeting stringent size, weight, and power (SWAP) demands.

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3U OpenVPX CPU Blade with Intel® Xeon® Processor E3v5 and E3v6 family

MIC-6330 - Advantech Co. Ltd.

Based on the Intel® Xeon® E3 Lv5 and Lv6 embedded platform, the MIC-6330 builds on the success of Advantech’s 6U VPX boards, and is the first 3U VPX product launched by Advantech. Together with the Intel® processor, the MIC-6330 offers intense computational ability in a very compact form factor. The MIC-6330 provides configurable connectivity (up to four ports) of PCI Express via the backplane to the highest performance mainstream peripherals and I/O cards, and vast I/O functions for extended interconnectivity and controllability. The MIC-6330 meets various computing needs, including vPro™ and workstation capabilities, by using the Intel® CM236/CM238 PCH. The MIC-6330 offers high storage capacity at up to SATA 6Gbps transfer speed. Four USB2.0 ports and one USB 3.0 port to the backplane fulfill requirements for extra I/O ports or storage, up to 5Gbps data rate. Four GbE ports (two ports configurable as SERDES) support system level IP connectivity, and the UART interfaces (RS-232/422/485 selectable) can be leveraged as an interface to legacy devices and consoles. Like Advantech’s 6U VPX products, the MIC-6330 supports multiple displays, and the maximum resolution of the MIC-6330 is 4K, empowered by the Intel® integrated graphics engine. The MIC-6330 also offers a High Definition Audio to the backplane interface for media demands. With the standard ruggedized convection cooled heatsink or the optional air-cooled heatsink, the MIC-6330 is tailored for harsh environmental applications and adaptable to various chassis designs. The industrial NAND Flash, and the soldered onboard DDR4 ECC memory chips are appropriate for a variety of vehicle applications for the maximum reliability. The MIC-6330 is sophisticated and suitable for various purposes. An onboard X8D XMC site with PCIE x8 gen.3 connectivity can host high speed offload or I/O mezzanines for project-specific applications. For applications that need the maximum expandability, the XMC interface can be modified to add another DisplayPort and the 2 more UART. The optional front I/O module facilitates the development and qualification process, and also enables the possibility of the front panel access.

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3U OpenVPX XMC carrier

Topics

3U VPX

3U OpenVPX PCIe/ SATA M.2 carrier

3U OpenVPX PCIe/ Ethernet Hybrid Switch

3U OpenVPX CPU Blade with Intel® Xeon® Processor E3v5 and E3v6 family

3U VPX