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Silicon
atomic number 14 tetravalent metalloid chemical element.
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Fully Automatic 4 Point Probe System for Silicon Wafer
WS-8800
*Measurement of resistivity, thickness, conductivity(P/N) and temperature*Tester self-test function, wide measuring range*Thickness, measurement position and temperature correction function for silicon resistivity*Number of cassette station can be changed by customers request*Host (CIM) communication and SMIF or FOUP compatible
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3-5 Watt Power Amplifiers
CCM1095 and CCM2096
The CCM1095 and CCM2096 are power amplifiers that use current efficient Silicon Carbide output semi-conductors to achieve +35 to +38 dBm output power. An internal sequencing circuit is included to provide for safe operation of the output power device.
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Humidification Systems
The Humidity bottles are made from type 316 stainless steel. Swagelok fittings for gas inputs and outputs are welded into the bottle. Nafion tubing inserted into a type 316 stainless steel spring for support is coiled in the bottle to provide dew-point humidity level for the gas passing through the tubing. The bottle is insulated and heated using a silicone rubber flex-pad.
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Spectroscopic Ellipsometers
SENresearch 4.0
The SENresearch 4.0 is the new SENTECH spectroscopic ellipsometer. Every individual SENresearch 4.0 spectroscopic ellipsometer is a customer-specific configuration of spectral range, options and field upgradable accessories. SENresearch 4.0 uses fast FTIR ellipsometry for the NIR up to 2,500 nm or 3,500 nm, respectively. It provides broadest spectral range with best S/N ratio and highest, selectable spectral resolution. Silicon films up to 200 µm thickness can be measured. The measurement speed of FTIR ellipsometry compares to diode array configurations, which are also selectable up to 1,700 nm. The new motorized Pyramid Goniometer features an angle range from 20 deg to 100 deg. Optical encoders ensure highest precision and long term stability of angle settings. The spectroscopic ellipsometer arms can be moved independently for scatterometry and angle resolved transmission measurements.
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Kelvin Clips
129141
Comprising of a Red/Grey & a Black/Grey Kelvin Crocodile Clip lead using low loss 1mm²multistranded ( 7/36/0.071. ) double skin silicone cables terminating in 4mm ...
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Silicon Oscillators
Analog Devices silicon oscillators are frequency programmable via pin-strapping, or through the resistor connection or serial interface (SPI or I2C). These solid-state clocks are well-suited for general-purpose usage, such as PGAs, ASICS, microprocessors, or UARTS, and they operate from 1 kHz to 170 MHz. Silicon oscillators are also ideal switching regulator clocks as they provide synchronization and EMI reduction (via spread spectrum).
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256-Element Active Antenna Innovator’s Kit
AWA-0142
The AWA-0142 is an active array for 5G wireless applications developed using planar antenna technology resulting in a very low profile, lightweight unit. The surface mount assembled antenna board is based on Anokiwave’s AWMF-0135 Silicon Quad Core IC and demonstrates the performance achievable using low power silicon integration and efficient antenna layout and design. Using the AWMF-0135, the antenna provides +60dBmi (1000 W) of EIRP. The electronic 2D beam steering is achieved using analog RF beam forming, with independent phase and gain control in both Tx and Rx operating modes. The AWA-0142 antenna leads the way in showing how 5G coverage can be rolled out by network operators using the mmW bands, with low power footprint and high energy efficiency, while meeting key operating specifications for data rate, latency, coverage, and reliability.
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Probes
SHOCONA Probes are designed for non-vibrating, contact mode applications and are compatible with most commercially available SPMs/AFMs. These probes are nanofabricated using highly doped single crystal silicon with unparalleled reproducibility, robustness and sharpness for consistent high resolution imaging capabilities. This is a box of 10 probes.
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Substrate Manufacturing
KLA’s substrate manufacturing portfolio includes defect inspection and review, metrology and data management systems that help substrate manufacturers manage quality throughout the wafer fabrication process. Specialized wafer inspection and review tools assess wafer surface quality and detect, count and bin defects during production and as a critical part of outgoing wafer qualification. Wafer geometry systems ensure the wafer shape is extremely flat and uniform in thickness, with precisely controlled wafer shape topography. Data analysis and management systems proactively identify substrate fabrication process excursions that can lead to yield loss. KLA’s substrate manufacturing systems support process development, production monitoring and final quality check of a broad range of substrate types and sizes including silicon, prime silicon, SOI, sapphire, glass, GaAs, SiC, GaN, InP, GaSb, Ge, LiTaO3, LiNBO3, and epitaxial wafers.
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Digitizer
761 Family
The 761 is the family of CAEN Waveform Digitizer with the highest sampling rate Flash ADC (10 bit @ 4GS/s). It can record fast signals from fast organic, inorganic and liquid scintillators coupled to PMTs or Silicon Photomultipliers, Diamond detectors and others, and save them with high efficiency and precision for advanced timing analysis. The acquisition can be externally vetoed/gated. Multiple boards can be synchronized to build up complex systems.
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64 Channel 16 bit 125 MS/s Digitizer
V2745
The V2745 Digitizer is a 64-channel digital signal processor for radiation detectors in a VME64X form factor. It offers not only waveform digitization and recording but also Multi-Channel Analysis for nuclear spectroscopy using Silicon strip, segmented HPGe, Scintillation detector with PMTs, Wire Chambers, and others.
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Silicon Detectors
Through the photovoltaic effect, detectors provide a means of transforming light energy to an electrical current. The root of the theory behind this phenomenon is a small energy gap between the valence and conduction bands of the detector. When light, with enough energy to excite an electron from the valence to the conduction band, is incident upon the detector, the resulting accumulation of charge leads to a flow of current in an external circuit. Since light is not the only source of energy that can excite an electron, detectors will have some amount of current that is not representative of incident light. For example, fluctuations in thermal energy can easily be mistaken for light intensity changes. A variety of these "non-light" contributions are present and, when summed up, make up the total noise within the detector.
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64 Channel 16 bit 125 MS/s Digitizer
VX2745
The VX2745 Digitizer is a 64-channel digital signal processor for radiation detectors in a VME64X form factor. It offers not only waveform digitization and recording but also Multi-Channel Analysis for nuclear spectroscopy using Silicon strip, segmented HPGe, Scintillation detector with PMTs, Wire Chambers, and others.
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Pressure Sensors
ST’s tiny silicon pressure sensors use innovative MEMS technology to ensure extremely high-pressure resolution in ultra-compact and thin packages. The devices implement proprietary technology for the fabrication of pressure sensors on monolithic silicon chips, which eliminates wafer-to-wafer bonding and maximizes reliability.
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Data Communications
Renesas' MIL-STD-883-compliant CMOS Manchester Encoder-Decoder (MED) is a high-speed, low power device manufactured using self-aligned silicon gate technology. The device is intended for use in serial data communication, and can be operated in either of two modes, a converter mode or repeater mode. This device is qualified to QML Class Q military standards.
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Wafer Lifetime Measurement with Photoluminescence Detector
WCT-120PL
Measure the calibrated carrier-recombination lifetime of a silicon wafer using both the standard method and the photoluminescence meth
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Switches-SP5T
Macom Technology Solutions Holdings Inc.
At MACOM we offer an extensive collection of switches covering multiple commercial and aerospace and defense markets. Our product portfolio has a broad frequency spectrum from DC to 70 GHz. Our silicon Heterolithic Microwave Integrated Circuit (HMIC) PIN diode process is ideal for high power and broadband switches operating from 50 MHz to 26 GHz. Our AlGaAs PIN diode process can extend the upper frequency range of our switch die beyond 70 GHz and is ideal for instrumentation and radar applications. Our GaAs pHEMT and MESFET technology is ideal for fast switching and low control voltage switches optimized for both narrow band and broadband applications. Our 75 Ohm absorptive switches are designed specifically for demanding CATV, FTTx and DBS Infrastructure and CPE applications.
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Cameras
Active Silicon offers a range of autofocus-zoom block cameras. Camera features include multiple output options, compact size, global shutter, powerful zoom and our own range of Harrier cost-effective block cameras.
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Silicon Diodes
DT-670 Series
DT-670 Series silicon diodes offer better accuracy over a wider temperature range than any previously marketed silicon diodes. Conforming to the Curve DT-670 standard voltage versus temperature response curve, sensors within the DT-670 series are interchangeable and, for many applications, do not require individual calibration. DT-670 sensors in the SD package are available in four tolerance bands—three for general cryogenic use across the 1.4 K to 500 K temperature range and one that offers superior accuracy for applications from 30 K to room temperature. DT-670 sensors also come in a seventh tolerance band, B and E, which are available only as bare die. For applications requiring greater accuracy, DT-670-SD diodes are available with calibration across the full 1.4 K to 500 K temperature range.
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Switches-SPST
Macom Technology Solutions Holdings Inc.
At MACOM we offer an extensive collection of switches covering multiple commercial and aerospace and defense markets. Our product portfolio has a broad frequency spectrum from DC to 70 GHz. Our silicon Heterolithic Microwave Integrated Circuit (HMIC) PIN diode process is ideal for high power and broadband switches operating from 50 MHz to 26 GHz. Our AlGaAs PIN diode process can extend the upper frequency range of our switch die beyond 70 GHz and is ideal for instrumentation and radar applications. Our GaAs pHEMT and MESFET technology is ideal for fast switching and low control voltage switches optimized for both narrow band and broadband applications. Our 75 Ohm absorptive switches are designed specifically for demanding CATV, FTTx and DBS Infrastructure and CPE applications.
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Temperature & Humidity Sensor Breakout Board
Si7021
Sensor for Silicon labs has ± 3% relative humidity measurements with a range of 0–80% RH, and ±0.4 °C temperature accuracy at a range of -10 to +85 °C. Great for all of your environmental sensing projects. It uses I2C for data transfer so it works with a wide range of microcontrollers.
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Interference Lithography Gratings
Interference lithography is an optical nanolithography technology for the fabrication of extensive periodic nanostructures. Critical dimensions of less than 50 nm can be realized. At AMO two interference lithography tools are installed. One setup for extensive, high quality gratings with fixed periods, the other more flexible tool allows quick prototyping. We offer grating fabrication on silicon, silicon dioxide and other substrates with tailored pitch, etch depth and size.
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BGA Sockets
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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Automotive
The UNH-IOL is taking the lead on providing testing solutions for silicon vendors and Tier 1 automotive suppliers in an environment where connectivity is of growing importance to end users. Our testing helps customers ensure their products work seamlessly with other products in the marketplace.
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Diode Arrays
a silicon diode with minimal packaging overhead. The small signal 0603, 1005 and 1206 Chip Diodes are lead free with Cu/Ni/Au plated terminations while the other packages (SMA, SMB, SMC, 1408, 1607, 2010, 2419, 8L NSOIC, 16L NSOIC, SOT23, SOT23-6, 16L WSOIC) use 100 % Tin terminations. All Bourns® diodes are compatible with lead free manufacturing processes, conforming to many industry and government regulations on lead free components.
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Silicon heavy-doped Tweezer Tester
HS-MRTT
Mini resistivity tweezer tester is used to check heavy-dope silicon. adaptable for little granular material, little broken IC Wafer and other little silicon material. When the resistivity is lower than the set value, it will make alarm.
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BSDL File Validation
Corelis offers services to validate the accuracy of Boundary-Scan Description Language (BSDL) files that characterize the boundary-scan functionality of semiconductor devices. These services include validation of a device's BSDL file while the chip is still in development and BSDL file accuracy verification against actual silicon.
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SOI Bonding Systems
An accurate wafer bonding process is the key factor in obtaining high quality single crystalline silicon films on insulating substrates. The EVG850 SOI/Direct Wafer Bonding systems are designed to fulfill a wide range of fusion/molecular wafer bonding applications, with main focus on SOI substrates manufacturing. Ultra clean handling of wafers throughout the bonding process assures high-yield and void-free bonds. All essential steps, from cleaning and alignment to pre-bonding and IR-inspection are combined in one high volume production system. EVG850 is the only production bonding system built to operate in high throughput, high-yield environments and guarantees void-free SOI wafers up to 300 mm.The EVG300 series single wafer cleaning systems are designed for efficient removal of particles. In semiconductor processing, efficient cleaning and particles removal prior to critical process steps enables maximum yield. Wafer Bonding is a process which is strongly affected by particles: each particle on the wafer surface produces a void orders of magnitude larger than its diameter, contributing to a dramatic yield loss.
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Pressure Based Waves
5218
Measure pressure based Waves with the Aanderaa Wave Sensors- compact fully integrated sensors for measuring wave and tide conditionsThe 5218 wave sensor is designed to be mounted on the Aanderaa SeaGuard top-end plate or connected to SmartGuard using AiCaP CANbus or in other measurement systems using the RS-232 interface.The 5218R wave sensor sensor is designed for use with long cables by means of RS-422 full duplex interface.Both wave sensors are based on a silicon piezoresistive pressure sensor. The pressure measurements are sampled and temperature compensated by an advanced Digital Signal Processor.The wave sensor application areas are in fixed installations, either deployed in a seabed installation in shallow waters, or mounted onto a fixed structure in the upper water column.
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Pyranometer with Silicon Photodiode
LP471SILICONPYRA
Pyranometer with silicon photodiade for GLOBAL SOLAR IRRADIANCE measurement.
