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Imaging

Perceives and captures visual representations of matter.

See Also: Hyperspectral Imaging, Confocal, Observation, Cameras, Imagers, Scanning


Showing results: 886 - 897 of 897 items found.

  • 3D Guidance®

    Northern Digital Inc.

    The 3D Guidance® electromagnetic tracking solution delivers exceptional performance and value for OEM image-guided interventional and therapy systems and medical trainers that require real-time navigation tracking capabilities. The 3D Guidance solution tracks 6DOF sensors that can be embedded into OEM instruments such as ultrasound probes, rigid and flexible scopes, and laparoscopic tools. Continuous in-vivo tracking is maintained through difficult anatomy, even when sensors are out of sight. Low latency and fast update rates ensure the most subtle tool movements are instantly tracked and visualized within the OEM host interface. The 3D Guidance solution is available in the driveBAY™ and trakSTAR™ configurations, as based on the Electronics Unit. The trakSTAR is a standalone desktop unit that connects to a direct power source. The smaller driveBAY fits inside the drive bay of a computer, OEM imaging cart, or medical trainer/simulator, using the host’s power supply. Both share the same tracking accuracy and reliability. The ready-to-use configuration facilitates cost-effective integration and speeds time to market.

  • Video Distribution Systems

    VDU-100 Series - Systems Engineering & Management

    SEMCO'S tactical military products have been developed in response to the requirement for near real-time, high-quality, encrypted video and sensor data capture, transmission and distribution in support of covert and overt military operations. These products provide for unprecedented audio-video and data communications from warrior-to-warrior as well as from warrior-to-command. Transmission modes include tactical and handheld radios, wireless and wired LAN, SATCOM, wireless Mesh, and Cellular, with full motion video capability in as low as 125 Kbps bandwidth. Video resolution, bandwidth and frame rates are adjustable, with high quality video frames capable of being transmitted in bandwidths as low as 9 Kbps. These products include video recording, with both local and remote download capability, as well as remote video enhancement, pan, tilt and zoom control, and multiple NTSC/PAL camera and imaging device interfaces. With administrative and password control, these products provide for unlimited remote viewing on PCs, Androids, iPhones and iPads anywhere in the world.

  • 3.5” Embedded SBC With AMD® RYZEN™ Embedded V1807B/V1605B APU, DisplayPort, 2 HDMI, LVDS And 4 GbE LAN

    CAPA13R - Axiomtek Co., Ltd.

    The CAPA13R is powered by the onboard AMD RYZEN™ Embedded V1807B/V1605B processor with Radeon™ Vega graphics. The 4K embedded board is well-suited for graphics-intensive applications such as medical imaging, video surveillance, 3D simulators, optical quality control, digital signage, kiosks/POI, thin clients, and more. The integrated AMD RadeonTM RX Vega graphics with support of DirectX 12 and OpenGL 4.5 marks the cutting edge of embedded graphics. The CAPA13R can deliver truly impressive user experiences and outstanding 3D graphics quality through two HDMI, one DisplayPort and one LVDS interfaces. Its onboard CPU is attached on the rear side of the board, which can aid with heat dissipation and offers flexibility for easy system integration and minimum maintenance. Moreover, the CAPA13R offers multiple expansion interfaces with one M.2 Key E slot for wireless modules and one M.2 key B slot for storage cards. One 260-pin SO-DIMM socket on the CAPA13R supports up to 16GB of DDR4-2400 (V1605B) and DDR4-3200 (V1807B) memory. The system has a +12V DC power input.

  • COM Express Type 6 Basic Module With Intel® Xeon® E3/7th Gen Intel® Core™ I7/i5/i3 Processors And Intel® CM238/QM175/HM175

    CEM510 - Axiomtek Co., Ltd.

    The CEM510 is based on the Intel® Xeon® E3 and 7th generation Intel® Core™ i7/i5/i3 processors with Intel® CM238/QM175/HM175 chipset. The 125 x 95 mm system-on-module was designed for graphics-intensive applications over the Industrial IoT, including industrial control, medical imaging, digital signage, and gaming machines. The embedded module is equipped with dual 260-pin DDR4-2133 SO-DIMM slots with up to 32GB system memory. Its wide operating temperature range of -40°C to +85°C strengthens the adaptability of various harsh conditions. For evaluation and development purposes, Axiomtek also has the CEB94011, a carrier board designed to operate with the CEM510 for additional I/O and expansions interfaces. Integrated with Intel® Gen 9 graphics, and with the support of DX12.0, OCL 2.0 and OGL 4.3, the module presents excellent graphics performance with resolution up to 4K (3840 x 2160 @ 30 Hz). Three independent displays are supported through LVDS and three DDI ports supporting HDMI, DisplayPort, and DVI (one DDI supporting optional VGA).

  • Isolated LVDS

    Analog Devices Inc.

    Isolated LVDS (low voltage differential signaling) devices couple differential signals applied to the LVDS receiver inputs across the isolation barrier to the outputs on the other side and re-transmits the bit stream or clock as LVDS. Analog Devices' drop-in LVDS isolators offer designers robust, high speed differential signaling for point-to-point and multidrop applications. Extending iCoupler® chip scale transformer technology for ultrahigh speed data encoding, these LVDS isolators support a a data rate of up to 2.5 Gigabits per channel for a total bandwidth of 10 Gbps. In contrast to expensive fiber implementations, deserialized links over standard digital isolators or optocouplers, and design-intensive bespoke solutions using transformers or high voltage capacitors, ADI Gigabit Digital LVDS isolators offer the only integrated comprehensive, high performance isolation at 10 Gbps. High performance galvanic isolation for applications include analog front-end (AFE), processor to processor serial communication, or video and imaging data (such as HDMI isolators) as well as isolation between boards, or at a cable interface for LVDS or CML signal chains.

  • Scientific Cameras

    Thorlabs, Inc.

    Thorlabs' Scientific-Grade Cameras are specifically designed for microscopy and other demanding applications. The Zelux™ CMOS cameras have small footprints and provide cost-effective solutions for general-purpose imaging applications. Kiralux® cameras have CMOS sensors with high quantum efficiency in a compact housing and are offered in monochrome, color, NIR-enhanced, and polarization-sensitive versions. Our polarization-sensitive CMOS camera is ideal for materials inspection, flaw detection, and other advanced techniques using polarization. The Quantalux® monochrome sCMOS cameras are fast frame rate imagers that combine high dynamic range with extremely low read noise for low-light applications. They are available in either a passively cooled compact housing or a hermetically sealed TE-cooled housing. We also offer scientific CCD cameras with a variety of features, including versions optimized for operation at UV, visible, or NIR wavelengths; fast-frame-rate cameras; TE-cooled or non-cooled housings; and versions with the sensor face plate removed. An intuitive software package, API and SDK for developers, and third-party software support provide options for custom system control and image acquisition.

  • Professional Thermal Camera

    FLIR T560 - Teledyne FLIR

    Troubleshoot hot spots, find hidden faults, and confirm repairs quickly with the ergonomic, high-resolution FLIR T560. This 640 × 480 (307,200 pixel) thermal imaging camera has a bright 4" LCD and a 180° rotating lens platform, so you can easily and comfortably diagnose electrical or mechanical issues, even in hard-to-reach areas. Advanced on-camera measurement tools such as 1-Touch Level/Span, plus laser-assisted autofocus, ensure you’ll record accurate temperature measurements every time. With on-board FLIR Inspection Route mode, you can download and run survey plans to your camera from FLIR Thermal Studio Pro (with FLIR Route Creator plugin). Together these systems will help you record temperature data and imagery in a logical sequence for faster troubleshooting and repair. The T560 also features FLIR Ignite for automatic uploading of images directly from the camera to the cloud for easy, secure storage and sharing. The purchase of a T560 camera includes a 3-month subscription to FLIR Thermal Studio Pro and FLIR Route Creator.

  • COM Express Type 6 Compact Module With 7th Gen Intel® Core™ & Celeron® Processor

    CEM511 - Axiomtek Co., Ltd.

    The CEM511, a new COM Express Type 6 Compact form factor module, is powered by the latest 7th generation Intel® Core™ i7/i5/i3 processor (Kabylake-U) for high-performance applications. The palm-sized CEM511 is packed with a variety of rich features including low power consumption, industrial wide temperature range support and impressive graphic processing capability. The COM Express® Type 6 Compact module supports two DDR4-2133 SO-DIMM sockets with a maximum system memory capacity of up to 32GB. It has a rugged design with an extended operating temperature range from -40°C to +85°C (-40°F to +185°F) to satisfy different harsh environment demands. The system on module also delivers outstanding computing, graphics and media performance through its Intel® Gen 9 graphics engine, DirectX 12.0, OCL 2.0, OGL4.3 features and 4K resolution (4096 x 2160 @ 30 Hz) support. Therefore, the power efficient CEM511 is designed for graphics-intensive applications over the Industrial IoT, including industrial control system, medical imaging, digital signage, gaming machines, military, and networking.

  • COM Express Type 6 Compact Module With 8th Gen Intel® Core™ & Celeron® Processor

    CEM521 - Axiomtek Co., Ltd.

    The CEM521 is powered by the latest 8th generation Intel® Core™ i7/i5/i3 processor or Intel® Celeron® processor 4305UE (codename: Whiskey Lake-U). It is suitable for harsh operating conditions with an extended operating temperature range of -40°C to +85°C (-40°F to +185°F). The 4K-ready system on module was designed for graphics-intensive Industrial IoT applications including industrial control system, medical imaging, digital signage, gaming machines, military, and networking. The palm-sized CEM521 is packed with a variety of rich features including low power consumption, industrial temperature support and high graphic processing capability. The COM Express Type 6 compact module supports two DDR4-2400 SO-DIMM sockets for up to 64GB of system memory. The power-efficient CEM521 is also integrated with Intel® Gen 9 graphics and supported with DX12.0, OCL 2.0 and OGL 4.3 for excellent graphics performance with a resolution of up to 4K (4096 x 2160 @ 30 Hz). It offers three independent display support through one LVDS, one VGA and one DDI ports for HDMI/DisplayPort.

  • Optical Fiber Cable Testing Equipment

    Torontech Group

    Optical fiber consists of a core and a cladding layer, selected for total internal reflection due to the difference in the refractive index between the two. In practical fibers, the cladding is usually coated with a layer of acrylate polymer or polyimide. This coating protects the fiber from damage but does not contribute to its optical waveguide properties. Individual coated fibers then have a tough resin buffer layer and/or core tube(s) extruded around them to form the cable core. Several layers of protective sheathing, depending on the application, are added to form the cable. Rigid fiber assemblies sometimes put light-absorbing ("dark") glass between the fibers, to prevent light that leaks out of one fiber from entering another. This reduces cross-talk between the fibers, or reduces flare in fiber bundle imaging applications Optical fibers are very strong, but the strength is drastically reduced by unavoidable microscopic surface flaws inherent in the manufacturing process. The initial fiber strength, as well as its change with time, must be considered relative to the stress imposed on the fiber during handling, cabling, and installation for a given set of environmental conditions. There are three basic scenarios that can lead to strength degradation and failure by inducing flaw growth: dynamic fatigue, static fatigues, and zero-stress aging.

  • FPGA Image Processing (IP) Development Kit

    ProcVision - Gidel

    Gidel’s Vision Pro Development Kit is an optimal solution for developing,validating, demonstrating and evaluating Image Processing (IP) andpipeline designs on FPGA.The suite is designed to provide a complete and convenient envelop enablingthe developer to focus strictly on the proprietary image processingdesign. The entire Vision Pro flow is within a single FPGA, independentof the final target application(s). The Vision Pro flow is composedof a pipeline that streams simulated data to the user image processingdesign under test (DUT) and then captures the design’s output streamfor displaying, storing, analysis and/or co-processing on host software.The entire process is performed on a single FPGA without the need foradditional peripheral connectivity or tools.Vision Pro suite is plug-and-play enabling the developer to begin at oncethe IP design development and validation. A simple design example providesthe developer immediate hands-on familiarization with the systemflow and supporting tools. The final design can be ported to any IntelFPGA device or other vendors’ devices (FPGA or ASIC) by replacing basiclibraries. To significantly reduce compilation time, initial design developmentmay be on a small FPGA device and later compiled for the targetdevice(s). The target implementation may use any FPGA board. For a fullImaging/Vision system solution, Gidel offers a number of off-the-shelfgrabbers and FPGA accelerators that are designed to utilize these imageprocessing blocks and Gidel Imaging Library (GIL).

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