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Imaging

Perceives and captures visual representations of matter.

See Also: Hyperspectral Imaging, Confocal, Observation, Cameras, Imagers, Scanning


Showing results: 841 - 855 of 900 items found.

  • Analytical Services

    Park Systems Corp.

    Atomic Force Microscopy (AFM) allows for sub nanometer resolution imaging of surface topography and is able to quantify surface roughness at the angstrom scale. Our team can give you highly accurate measurements such as surface topography, dopant distribution, magnetic domain features, and a wide variety of other sample properties to give you the information you need to do great work.Park can provide measurements in the following areas:● Topography (surface roughness, grain size, step height, etc.)● Mechanical Properties (stiffness, etc.)● Electrical properties (capacitance, conductivity, etc.)● Thermal properties ● Magnetic properties These properties can be measured in air or liquid, depending on your needs.

  • Building Inspection System with Moisture Hygrometer & MSX® IR Camera

    FLIR MR277 - Teledyne FLIR

    The MR277 is the first FLIR building inspection system to combine the advantages of Infrared Guided Measurement (IGM) and our patented Multi-Spectral Dynamic Imaging (MSX) with advanced environmental sensors to help you quickly locate, clearly identify, and easily document problems. IGM technology and a laser pointer isolate the area where you can use the integrated pinless moisture sensor for non-invasive readings or external pin probe for invasive measurements. With automatically calculated environmental readings and a field-replaceable humidity/temperature sensor, the MR277 lets you finish the job and minimize downtime. Connect to external devices with METERLiNK® and use FLIR Tools® to enhance troubleshooting and reports.

  • Custom solutions

    NOVACAM Technologies, Inc.

    Novacam develops custom interferometric solutions to address particular inspection and imaging needs of specialized applications and OEM markets. Our modular interferometer components offer a superior and cost-effective platform for developing high-performance systems and assemblies. We will collaborate with your application experts to devise the optimal combination of inteferometric (OCT) hardware, non-contact fiber-based sensor probes, and system software.As needed, Novacam engineers: develop customized optical probes and inspection stations develop inline probe fixtures for production environments adapt Novacam standard interferometer component modules to suit your application help integrate Novacam systems or components with third-party tools write customized software

  • Smart Camera

    NI

    Smart Cameras combine powerful onboard processors and imaging sensors into an all-in-one vision system. Smart Camera digital I/O includes optoisolated digital inputs, optoisolated digital outputs, a RS232 serial port, and Gigabit Ethernet ports. Smart Cameras also can include built-in digital I/O and industrial communication options for dynamic, real-time communication and integration with industrial automation devices including programmable logic controllers (PLCs), human machine interfaces (HMIs), robotics, sensors, and industrial machinery. You can configure Smart Cameras with the included Vision Builder for Automated Inspection (AI) software and program the camera with the LabVIEW Real-Time Module and the Vision Development Module.

  • Microbolometer Sensors

    Calibir GX Family - Teledyne DALSA

    The Calibir GX camera family features our latest microbolometer sensor, designed, fabricated, and packaged in our own foundry. With great sensitivity in longwave infrared range (8-12 µm), it features both shutter and shutterless operation and rapid image output on power up while delivering uniform response over the entire operating temperature range, making it an ideal component for thermal imaging systems requiring uninterrupted image acquisition. The GX series also offers our own advanced 21-bit ADC design for unparalleled intra-scene dynamic range without the need for a gain reduction, allowing for the best possible NETD over a vast range of temperature (>600C).

  • Versatile quality control testing system

    QuickSun® 550Ei - Endeas Oy

    QuickSun 550Ei is a versatile testing system for qualifying of PV modules with dimensions up to 105 x 205 cm2. Basic set up includes a top class solar simulator which measures modules in sunny side up position enabling e.g. soiling simulations. Several additional measurement methods can be integrated to the same system including high resolution EL imaging with analysis software from one of the most recognized EL system suppliers. Also hot spot revealing IR images can be recorded by applying either forward or reverse bias current, and true nA scale leakage current measurements can be performed with sensitive enough instruments.

  • High-Performance Industrial Controller

    GEVA 1000 - Teledyne DALSA

    GEVA is a high-performance industrial controller that offers excellent cost savings for multi-camera vision applications, such as final inspection of large assemblies. As the name implies, GEVA provides expandable Gigabit Ethernet camera interfaces that significantly drive down system cost.At the heart of GEVA is a powerful dual core processor, equipped with high-speed memory resources to tackle the most demanding applications. Two dedicated camera ports are provided, each with enough bandwidth to easily support eight 640x480 mono cameras imaging parts at 60 per second. The camera ports are compatible with a wide range of mono or color, area and line scan GigE cameras in a range of resolutions.

  • Osram High Power Blue Violet Laser Diodes (450-488nm)

    The Optoelectronics Company Ltd

    OSRAM Opto Semiconductors is a key player in the field of visible InGaN (Indium Gallium Nitride) lasers. OSRAM Opto Semiconductors offer leading product performance and innovative packaging. Thanks to their excellent beam quality, OSRAM laser diodes are ideally suited for the optical imaging of light. Not only that, but their small package size is particularly beneficial to highly compact systems, such as pico projectors. OSRAM laser diodes offer high efficiency and long lifetime: due to their excellent efficiency (ratio of light produced compared to electric power consumed), the temperature increase experienced by blue InGaN lasers during operation is kept to an absolute minimum, allowing them to deliver a long life – up to 10,000 hours at 40 °C.

  • Clock Drivers

    Pulse Instruments

    Multiple timing signals ("clocks") are required by CCDs, IR FPAs, and some CMOS image sensors to transport electrical charge across the array to a sense amplifier for conversion into image data. Pulse Instruments offers a line of "clock drivers" for generating these timing signals. The parameters of these clocks (clock rate, pulse width, pulse amplitude, rise- and fall-times, etc.) greatly influence the behavior and performance of the imaging device. Our products take logic-level inputs from a pattern generator and allow the user to adjust the output parameters to suit their device and testing requirements. Clocks can be "tweaked" in real-time to determine optimal operating parameters for a particular device, or else programmed in accordance with a test plan for automated production test.

  • High Performance Embedded Development Kit

    TySOM EDK - Aldec, Inc.

    The TySOM™ Embedded Development Kit is for the embedded designers who need a high-performance RTL simulator/debugger for their embedded applications such as IoT, Automotive, Factory automation, UAV and Robotics. The kit includes Riviera-PRO™ Advanced Verification Platform and a TySOM development/prototyping board. TySOM boards come with either a Zynq 7000 chip (FPGA + Dual ARM® Cortex™-A9) or with a Zynq® UltraScale+™ MPSoC device. These boards include memories, and various communication and multimedia interfaces in addition to FMC connectors for peripheral expansion. Reference designs for application such as IoT, ADAS, 4K UltraHD imaging and Robotics and a complete reference design, which contains the SW (Linux) and all the hardware blocks required to support the peripherals on the board, are provided.

  • Fanless Embedded System With LGA1151 Socket 7th/6th Gen Intel® Core™ & Celeron® Processor, Intel® H110, HDMI, DisplayPort, VGA, 6 USB, 4 COM, PCI Express Mini Card Slot And 10 To 30 VDC

    eBOX640-500-FL - Axiomtek Co., Ltd.

    The eBOX640-500-FL is powered by the 7th generation Intel® Core™ i7/i5/i3 and Celeron® processor families. It features dual DDR4-2133 DIMM sockets with up to 32GB of system memory, and provides a wide choice of front-accessible I/O interfaces for easy cabling and maintenance. It supports an extended operating temperature ranging from -10°C to +55°C, a wide voltage range DC power input from 10 to 30 VDC with power protection, and up to 2G vibration endurance, enabling a reliable and stable operation in harsh environment. The superior Intel® Kaby Lake-based fanless embedded box PC can support three independent high resolution displays and 4K resolution, offering high quality imaging.

  • Image Analysis & Stage Micrometers

    Applied Image, Inc.

    The APPLIED IMAGE series of Image Analysis and Stage micrometers are ideally suited for calibrating optical, imaging, video, and reticle-based measurement systems. Designed for ease of use and manufactured for durability, the SM Series has both English and Metric scales in one or two axis configurations. Both types of micrometers come with NIST traceable calibration standards and are available on multiples substrates to perfectly fit your needs. The experience APPLIED IMAGE has in manufacturing precision imaged optical components makes us the trusted source for standards for magnification system microscopy and vision applications. Should you need to alter feature patterns, size, or substrate, fill out our Custom Optical Components and Standards form to start the conversation.

  • Engineering

    Lynred USA

    As a pioneer in infrared imaging solutions, our engineers have an unsurpassed level of proficiency in prototype design, customization and system integration. Our expertise is multifaceted ranging from advanced infrared sensor signal processing, calibration techniques, radiometry, optics, embedded software development, PC application software development, industrial and mechanical design and production tooling. Our goal is your successful project; one that utilizes the correct components and is completed on time and within budget. This is accomplished through our Concept to Solution approach which allows for the use of technically advanced components, group collaboration, quick responses and final products tested to spec. Whatever level of integration you choose and support you need, know our engineering team is there to assist.

  • Vision Systems

    ADLINK Technology Inc.

    Embedded vision systems, also referred to as compact vision systems, offer an alternative to Smart cameras and computer-based systems. The ADLINK EOS series is a complete embedded system that offers image acquisition, processing, archiving, and display capabilities. It is equipped with a multi-core CPU, ideal for applications requiring high computing power and multi-camera imaging, such as 3D vision and robotics guidance. Featuring rich I/O connectivity with factory-floor networks, including RS-232/422/485, USB, and isolated digital I/O, as well as onboard storage, ADLINK’s embedded vision system is ready to deploy. A system monitoring feature, feeding back temperature and voltage data, combines with a watchdog timer to maximize robustness and reliability of the ADLINK EOS series in mission critical applications.

  • Sensor

    Lepton - Pure Engineering, llc

    The FLIR Lepton™ is the most compact longwave infrared (LWIR) sensor available as an OEM product. It packs a resolution of 80 × 60 or 160x120 pixels into a camera body that is smaller than a dime. This revolutionary camera core is poised to equip a new generation of mobile and handheld devices, as well as small fixed-mount camera systems, with thermal imaging capabilities never seen before. Lepton contains a breakthrough lens fabricated in wafer form, along with a microbolometer focal plane array (FPA) and advanced thermal image processing. In order to support the lepton and make it easy to use, we have developed a breakout board to support the module along with example source code. Please see the Lepton Thermal Camera Breakout Datasheet for more information.

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