Showing results: 871 - 885 of 897 items found.
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AEP Technology
AEP Technology offers several ASTM, ISO DIN compliant friction and wear tester models optimized for various applications. The modular design allows it to run on one platform (rotary, linear reciprocating, linear, block-to-ring, etc.), and to ensure high repeatability, during the testing process our downward force friction and wear testing machine controls several standard tests. High-end electronics, multi-core 64-bit processor that allows it to use multiple in-situ sensing technologies (recording friction, wear, displacement, force, volume, temperature, humidity, position, speed, etc., during testing) with high resolution Embedded powerful platform imaging head (sections of atomic force microscopes, etc.). Ease of use and robust unique design make AEP Technology a powerful tool in friction and wear testing machine development and production environments.
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Ceres T 1280 Series -
Xenics
The Ceres T 1280 series is based upon the Dione 1280 OEM thermal imaging core with 1280×1024 pixels and 12 µm pixel pitch and NETD of less than 50 mK. The camera offers superior on-board thermographic performance (accuracy, stability) in the temperature range up to 400 °C.The Ceres T 1280 camera outputs full frame images at 60 Hz via either a CameraLink or at 45 Hz via GigE Vision interface – all GenICam compliant.The compact size and excellent thermographic stability and accuracy, and GenICam compliant interfacing allow for easy integration in demanding industrial thermography applications.The camera offers one standard option of lens and thermal calibration pack.Benefits & Features• Compact and high-resolution• Superior on-board thermographic performance (stability, accuracy)• GenICam compliant• Uncooled operation
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787457-01 -
NI
The PXIe-1487 combines the Maxim Integrated Gigabit Multimedia Serial Link™ (GMSL™) interface with the Xilinx FPGA for high-throughput vision and imaging applications. This module provides a high-speed digital interface for using and testing modern advanced driver assistance systems (ADAS) and autonomous drive (AD) camera sensors and electronic control units (ECUs). Additionally, the PXIe-1487 makes use of a combination of GMSL™ serializers and deserializers with a Xilinx FPGA to provide a high-throughput and customizable GMSL™ interface on PXI. The included FlexRIO driver, with LabVIEW FPGA examples, provides access and control for power-over-coax, I²C back-channel communication, and general-purpose input/output (GPIO) communication on the GMSL™ channels. The PXIe-1487 is ideal for applications such as in-vehicle data logging, lab-based playback, or hardware-in-the-loop (HIL). GMSL is a trademark of Maxim Integrated Products, Inc.
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787456-01 -
NI
The PXIe-1487 combines the Maxim Integrated Gigabit Multimedia Serial Link™ (GMSL™) interface with the Xilinx FPGA for high-throughput vision and imaging applications. This module provides a … high-speed digital interface for using and testing modern advanced driver assistance systems (ADAS) and autonomous drive (AD) camera sensors and electronic control units (ECUs). Additionally, the PXIe-1487 makes use of a combination of GMSL™ serializers and deserializers with a Xilinx FPGA to provide a high-throughput and customizable GMSL™ interface on PXI. The included FlexRIO driver, with LabVIEW FPGA examples, provides access and control for power-over-coax, I²C back-channel communication, and general-purpose input/output (GPIO) communication on the GMSL™ channels. The PXIe-1487 is ideal for applications such as in-vehicle data logging, lab-based playback, or hardware-in-the-loop (HIL). GMSL is a trademark of Maxim Integrated Products, Inc.
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787458-01 -
NI
The PXIe-1487 combines the Maxim Integrated Gigabit Multimedia Serial Link™ (GMSL™) interface with the Xilinx FPGA for high-throughput vision and imaging applications. This module provides a high-speed digital interface for using and testing modern advanced driver assistance systems (ADAS) and autonomous drive (AD) camera sensors and electronic control units (ECUs). Additionally, the PXIe-1487 makes use of a combination of GMSL™ serializers and deserializers with a Xilinx FPGA to provide a high-throughput and customizable GMSL™ interface on PXI. The included FlexRIO driver, with LabVIEW FPGA examples, provides access and control for power-over-coax, I²C back-channel communication, and general-purpose input/output (GPIO) communication on the GMSL™ channels. The PXIe-1487 is ideal for applications such as in-vehicle data logging, lab-based playback, or hardware-in-the-loop (HIL). GMSL is a trademark of Maxim Integrated Products, Inc.
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Q7B301 -
Axiomtek Co., Ltd.
The Q7B301 is an ultra-compact Qseven reference carrier board which measures only 100 x 72 mm - the size is slightly bigger than a credit card. The Q7B301 is perfect for small box applications such as those found in the latest digital signs, kiosks and traffic control system. This Qseven application board offers various I/O connectors and flexible expansion features to reduce the design effort to the minimum. The Q7B301 also has an extended industrial grade operating temperature range of -40ºC to +85ºC to withstand the rigors of harsh environments. Axiomtek’s new Qseven Rev. 2.1 application board, Q7B301, is compatible with Qseven module – Q7M311 which is powered by the Intel® Pentium® Processor N4200 and Celeron® Processor N3350. Customers can emulate required functions on Q7M301 as a reference design board or integrate the Q7M301 directly into their product as the application board. Its minimum footprint also enables the maximum potential. The Q7M301 is especially suited for industrial IoT applications such as industrial control, medical imaging, digital signage, gaming machines, military, and networking. The Q7B301 comes with two PCI Express Mini Card slots and one SIM card slot for wireless communication (3G/4G, GPS, Wi-Fi and Bluetooth). For enhanced or high-definition audiovisual devices, the Qseven reference carrier board supports one HDMI and LVDS interfaces as well as HD audio and 4-channel digital I/O. More I/O interfaces include two Gigabit LANs with Intel® i211AT Ethernet controller, two RS-232/422/485, one USB 2.0, two USB 3.0, one SMBus, and one I2C. Furthermore, it has one SATA-600 interface for storage requirements.
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CEM312 -
Axiomtek Co., Ltd.
The CEM312 supports Intel® Atom® x5 and x7 processors in a board size of 95 x 95 mm. It has two 204-pin DDR3L-1600 SO-DIMMs with up to 8GB of system memory and an optional eMMC for a maximum of 64GB memory. The COM Express Type 6 module is integrated with Intel® Gen 9 graphics and supported with DX12.0, OCL 2.0 and OGL 4.3 for immersive graphics and media performance with a resolution up to 4K. Moreover, the industrial grade system on module can operate under wide temperature ranging from -40 to 85°C (-40°F to 185°F). The Intel® Atom®-based computer module also offers diverse comprehensive I/O interfaces to meet requirements for a variety of industrial applications. The CEM312 can serve as an excellent solution for graphics-intensive, industrial IoT applications such as industrial control, medical imaging, digital signage, gaming, military, and networking.
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CVS Trevista X4 -
STEMMER IMAGING Ltd.
The fourth generation of CVS Trevista Surface, Cylinder and Multiline surface inspection systems from Stemmer Imaging features brighter illumination to enable faster image acquisition and have a larger measuring field. The new Trevista X4 models utilize a 2.5-D process, called "Shape from Shading," and are especially suited to the examination of components with shiny and diffusely scattering surfaces. Surface defects such as scratches, burrs, dents, discoloration or grinding marks, even if only a few micrometers deep, can be detected with significantly greater certainty with this process than with conventional image processing systems, according to the manufacturer. The X4 generation offers structured, diffuse dome illumination that is brighter by a factor of 2.5 compared with the previous models, enabling faster image acquisition. For a typical image size of four megapixels, evaluation using the Trevista algorithm takes place around 20% faster than before, which results in potentially lower cycle times.
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Razor Express 12 CompuScope - PCIe -
GaGe
Available in 4-CH and 2-CH models featuring 17 software selectable A/D sampling rates from minimum 1 kS/s to maximum 200 MS/s per channel with input bandwidth of 125 MHz. ADC data can be captured in quad, dual, or single channel modes. Full-featured front-end with software selectable DC/AC coupling and 50Ω / 1MΩ inputs. Ease of integration with External or Reference Clock In & Clock Out. External Trigger In & Trigger Out with advanced triggering operations. PCIe Gen2 x8 data streaming rates at 1.6 GB/s. Programming-free operation with GaGeScope PC oscilloscope software. Software Development Kits available for C/C#, LabVIEW and MATLAB for custom application development. Ideal for applications such as Automatic Test Equipment (ATE), Wideband RF Signal Analysis & Recording, RADAR, Electronic Warfare (EW), Ultrasonic Non-Destructive Testing (NDT), LIDAR, Communications, Spectroscopy, High-Performance Imaging, Time of Flight (TOF), Life Sciences, Particle Physics, and more.
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Oscar Express 16 CompuScope - PCIe -
GaGe
Available in 4-CH and 2-CH models featuring 16 software selectable A/D sampling rates from minimum 1 kS/s to maximum 100 MS/s per channel with input bandwidth of 65 MHz. ADC data can be captured in quad, dual, or single channel modes. Full-featured front-end with software selectable DC/AC coupling and 50Ω / 1MΩ inputs. Ease of integration with External or Reference Clock In & Clock Out. External Trigger In & Trigger Out with advanced triggering operations. PCIe Gen2 x8 data streaming rates at 800 MB/s. Programming-free operation with GaGeScope PC oscilloscope software. Software Development Kits available for C/C#, LabVIEW and MATLAB for custom application development. Ideal for applications such as Automatic Test Equipment (ATE), Wideband RF Signal Analysis & Recording, RADAR, Electronic Warfare (EW), Ultrasonic Non-Destructive Testing (NDT), LIDAR, Communications, Spectroscopy, High-Performance Imaging, Time of Flight (TOF), Life Sciences, Particle Physics, and more.
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Bruker Corporation
rom the very compact FTIR spectrometer to the world’s highest resolution: Bruker offers the industry's largest selection for demanding routine and High End FTIR research application including the new and unique verTera cw THz functionality.Process monitoring with FTIR / FT-NIR process spectrometers.A complete line of Near Infrared Spectrometers to fit all your needs, including Process Monitoring.FTIR Microscopy and Raman Microscopy and Spectral Imaging for high sensitivity at high spatial resolution.High spectral resolution, high performance Raman and FT-Raman spectrometers for advanced routine solutions.FTIR Gas Analyzers for the fully automated and high precision real-time monitoring of gas compoundsImaging Remote Sensing systems for analysis of gases, liquids and solids.CryoSAS semiconductor material quality control for photovoltaic and electronics industry.OPUS, the "all-in-one" IR and Raman spectroscopy software consists of a suite of software packages that cover both standard and specialized applications.ONET, software for the setup, administration and control of large FT-NIR spectrometer networks.
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Ceres T 640 Series -
Xenics
The Ceres T 640 series is based upon the Dione 640 OEM thermal imaging core with 640×480 pixels and 12 µm pixel pitch and NETD of less than 50 mK. The camera offers superior on-board thermographic performance (accuracy, stability) in the temperature range up to 400 °C.The Ceres T 640 camera outputs full frame images at 60 Hz via either a CameraLink or GigE Vision interface – all GenICam compliant.The compact size and excellent thermographic stability and accuracy, and GenICam compliant interfacing allow for easy integration in demanding industrial thermography applications.The camera offers one standard option of lens and thermal calibration pack.The compact Ceres T 640 series find application in process monitoring, medical and scientific and advanced research.Benefits & Features• Compact size and high-performance• Superior on-board thermographic performance (stability, accuracy)• GenICam compliant• Uncooled operation
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KLA-Tencor Corp
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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FLIR T865 -
Teledyne FLIR
The FLIR T865 thermal imaging camera is a non-contact inspection tool with 180° rotating optical block that allows users to safely and comfortably assess the condition of critical electrical and mechanical equipment in utility and manufacturing applications. With advanced features including unmatched temperature measurements down to -40°C, accuracy as good as 1°C/1%, 1-Touch Level/Span contrast enhancement, and laser–assisted autofocus, you'll get highly accurate temperature measurements every time. Pair the T865 with a 6 FOV IR lens to perform inspections on small targets from long distances. The on-board Inspection Route system helps you record temperature data and imagery in a logical sequence for faster troubleshooting and repair. The T865 also features FLIR Ignite for automatic uploading of images directly from the camera to the cloud for easy, secure storage and sharing. Adding a FLIR T865 camera to a condition monitoring/predictive maintenance program can help reduce maintenance costs, improve system efficiency and reliability, and prevent downtime due to outages.
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CEM500 -
Axiomtek Co., Ltd.
The CEM500, a COM Express Type 6 basic module, is based on the 14 nm Intel® Xeon® processor E3-1505M v5 and 6th generation Intel® Core™ i7/i5/i3 processor (codename: Skylake-H) with Intel® CM236/QM170/HM170 chipset. The outstanding Intel® Gen 9 HD Graphics enables the CEM500 driving multiple 4K displays without the need of a discrete graphics card. Two DDR4-2133 SO-DIMM supporting up to 32 GB system memory capacity and four SATA-600 with RAID 0, 1, 5, and 10 are available. Additionally, the rugged COM Express computer-on-module Type 6 supports an industrial operating temperature range of -40°C to 85°C for applications in extreme harsh environment. With its full solid, outstanding computing performance and low power consumption design, the CEM500 is targeted at telecommunication, medical imaging, digital signage, gaming machines, military, human machine interface, industrial automation controllers and IIoT applications.
