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EDGE

Wireless service using TDMA, based on GSM standard operating at 384Kbps on broadband.


Showing results: 661 - 675 of 724 items found.

  • USAF Targets

    Applied Image, Inc.

    These targets conform to MIL-STD-150A. Frequencies change by the 6th root of 2. This target is also available in custom sizes and contrasts. This test target meets requirements as specified in MIL-STD-150A for resolving power tests. The target consists of a series of Elements having two sets of lines at right angles. Each set of lines consists of three lines separated by spaces equal to the line width. Each bar has a length to width ratio of 5:1. (Line width is equal to one half of line pitch, which is the inverse of line frequency.) Elements are arranged in groups of six each and Groups are arranged in pairs. Even numbered Groups occupy the left side and bottom right corner and contain a square feature having and edge length equal to the line length of Element 2 in that group. Odd numbered Groups occupy the top right corner and side. Groups and Elements are labeled and differentiated by numbering adjacent to their features. Frequencies in cycles/mm (c/mm) increase between each Element by the sixth root of two (approximately 12.25% per step). The general formula for the line frequency of any target Element can be expressed as 2Group+(Element-1)/6.

  • Mobile Network Emulator

    Qosmotec Software Solutions GmbH

    QPER Mobile Network Emulator enables engineers to simulate handover scenarios in mobile networks without a fully-fledged test lab. Based on Qosmotec’s QPER technology, it allows to test UE and SIM-Card behaviour in a completely emulated mobile network: Cells can be configured with all relevant cell parameters (MCC, MNC, LAC, CI, etc.), SIMs can be added to the HLR, and UEs can use standard circuit switched and packed switched services. Thus, the QPER Mobile Network Emulator emulates the all components of a mobile network – consisting of core and radio functionality – and creates RF signals. It supports GSM, GPRS and EDGE (900 MHz, 1800 MHz) as well as UMTS (2100 MHz).

  • Digital I/O with Per Channel Timing, Programmable Logic Levels and PMU PXI Card

    GX5296 - Terotest Systems Ltd.

    The GX5296 offers the most performance and features of any 3U PXI dynamic digital I/O board on the market today. The 32-channel, GX5296 offers timing per pin, multiple time sets, data formatting, and an advanced sequencer – providing users with the capability emulate and test complex digital busses for system, board or device test applications. Offering 1 ns edge placement resolution per pin and a PMU per pin, the GX5296 has the ability to perform both DC and AC parametric testing. Each digital channel can be individually programmed for a drive hi, drive lo, sense hi, sense lo, and load value (with commutation voltage level).

  • PXI-6624, Isolated 48 VDC, 8-Channel PXI Counter/Timer Module

    778975-01 - NI

    Isolated 48 VDC, 8-Channel PXI Counter/Timer Module—The PXI‑6624 performs a wide variety of counter/timer tasks, including event counting, time period/frequency measurement, quadrature encoder position measurement, pulse-width measurement, pulse generation, and pulse-train generation. It features 48 VDC channel‑to‑channel isolated I/O with eight counter/timers, 26 digital inputs, and eight digital outputs. Example applications also include the generation of retriggerable pulses, two-signal edge separation measurements, continuous buffered event counting, and continuous buffered pulse-train measurements. The PXI‑6624 offers superior industrially rugged features for a wide array of applications such as automotive/aerospace, industrial/motion control, and manufacturing test.

  • PCIe Adapters

    Teledyne LeCroy

    Teledyne LeCroy offers a broad spectrum of PCI Express protocol analyzer platforms (Summit T516, Summit T54, Summit M5x, Summit™ T416, Summit T48, Summit™ T3-16, Summit T3-8, Summit T34, Summit T28, and Summit T24). The Summit T516, T54 and M5x are Teledyne LeCroy’s leading edge products supporting PCIe 5.0 and CXL specifications. The Summit T416, T48, T34, T3-16 and T3-16 are Teledyne LeCroys midrange protocol analyzers. These protocol analyzers are at the forefront of SSD and computer storage analysis, test and compliance. The Summit T28 and T24 are entry level protocol analysis tools for development and test at PCIe 2.0.

  • Fracture Mechanics Clip-On Gages

    Model 3541 - Jinan Testing Equipment IE Corporation

    The Model 3541 is designed for determination of fracture mechanics parameters such as JIC, KIC, R-curve, fatigue crack growth rate (da/dN), and testing to standards such as E1820, E399, E647, etc. These COD gages conform to the requirements of E1820 (the replacement for E813 and E1737) for JIC and R-curve determination. Special configurations are available to meet the requirements of ASTM E399 for fracture toughness (please consult the factory for these configurations). In addition, the modified groove design complies with E1820 tests where greater stability and accuracy results from the sharper groove root. Clip-on gages are used for a variety of fracture mechanics tests, including compact tension, arc shaped, disk shaped, bend specimens or other specimen geometries in compliance with ASTM and other standards organization’s test methods. Clip-on gages can be used directly on test specimens where the knife edges are integral with the test specimen or, alternately, with optional bolt-on knife edges mounted on the test specimen.The Model 3541 extensometers are strain gaged devices, making them compatible with any electronics designed for strain gaged transducers. Most often they are connected to a test machine controller. The signal conditioning electronics for the extensometer is typically included with the test machine controller or may often be added. In this case the extensometer is shipped with the proper connector and wiring to plug directly into the electronics. For systems lacking the required electronics, Epsilon can provide a variety of solutions, allowing the extensometer output to be connected to data acquisition boards, chart recorders or other equipment.

  • Image Processing and Analysis Software

    ENVI - L3Harris Geospatial Solutions, Inc

    ENVI is the industry standard for image processing and analysis software. It is used by image analysts, GIS professionals and scientists to extract timely, reliable and accurate information from geospatial imagery. It is scientifically proven, easy to use and tightly integrated with Esri’s ArcGIS platform.ENVI has remained on the cutting edge of innovation for more than three decades due in part to its support of all types of data including multispectral, hyperspectral, thermal, LiDAR and SAR. ENVI makes deep learning accessible to people through intuitive tools and workflows that don’t require programming. ENVI geospatial image analysis can also be customized through an API and visual programming environment to meet specific project requirements.

  • Combination Board Tester

    Qmax Test Technologies Pvt. Ltd.

    Combination Board Tester capable of testing highly complex and dense PCBs employing various test techniques on a single platform. It can perform Board Level Functional Test through edge connectors of a PCB, and guided probe diagnostics utility to reliably repair Digital/Analog and Mixed Signal PCBs of various complexities and conventional PCBs. An In –Circuit device test by configuring Pin Drivers to High Current Pin Driver mode and interface to the UUT either through Clips / Probes or nail bed and on board clock disable HW feature are the all time favorite . The in-built high frequency 14bit Analog Driver / sensors synchronized with digital drivers for covering analog / mixed signal devices with high degree of accuracy.

  • Mobile PCI Express Module with NVIDIA® Quadro® Embedded P2000

    EGX-MXM-P2000 - ADLINK Technology Inc.

    The EGX-MXM-P2000 features advanced NVIDIA Quadro GPU with NVIDIA Pascal™ Architecture technology in MXM 3.1 Type A form factor. The EGX-MXM-P2000 has 768 NVIDIA CUDA cores and a peak single-precision floating-point performance of 2.3 TFLOPS. The EGX-MXM-P2000 has 4GB of GDDR5 memory and supports NVIDIA GPUDirect™ RDMA which helps increase data throughput by up to 80% and consequently system responsiveness by up to 60%*. Additionally, 4 UHD display outputs and an extended operating temperature range of -40°C to 85°C are supported. The embedded graphics product is suitable for mission-critical harshenvironment edge computing applications with size, weight, and power (SWaP) and network connectivity constraints.

  • Mobile PCI Express Module with NVIDIA® Quadro® Embedded P1000

    EGX-MXM-P1000 - ADLINK Technology Inc.

    The EGX-MXM-P1000 features advanced NVIDIA Quadro GPU with NVIDIA Pascal™ Architecture technology in MXM 3.1 Type A form factor. The EGX-MXM-P1000 has 512 NVIDIA CUDA cores and a peak single-precision floating-point performance of 1.8 TFLOPS. The EGX-MXM-P1000 has 4GB of GDDR5 memory and supports NVIDIA GPUDirect™ RDMA which helps increase data throughput by up to 80% and consequently system responsiveness by up to 60%*. Additionally, 4 UHD display outputs and an extended operating temperature range of -40°C to 85°C are supported. The embedded graphics product is suitable for mission-critical harsh-environment edge computing applications with size, weight, and power (SWaP) and network connectivity constraints.

  • 3.5" Single Board Computer

    RSB-4810 - Advantech Co. Ltd.

    Advantech’s RSB-4810 is an Arm-based 3.5" single board computer (SBC) powered by Rockchip RK3568 SOC. It leverages 4 x Arm Cortex-A55 cores, a 1.0 TOPs NPU, and a Mali-G52 graphics engine. RSB-4810 provides USB 3.0, PCIE 3.0, SATA 3.0, 2 x Gigabit Ethernet ports, a single channel LVDS (shared with MIPI-DSI), 6 x UART, and 2 x CAN for embedded applications. RSB-4810 also features Mini-PCIe, M.2 E-Key, and SIM card slot for Wi-Fi 6, BT, 5G/LTE, and AI acceleration modules. These features make Advantech’s RSB-4810 an ideal solution for entry level edge AI computing in AIoT applications.

  • Fixed-Mount Thermal Imaging Camera for Condition Monitoring and Early Fire Detection

    FLIR A500f/A700f Advanced Smart Sensor - Teledyne FLIR

    FLIR A500f and A700f Advanced Smart Sensor Thermal Cameras are ideal for users who want built-in, on-camera analytics and alarm capabilities for outdoor condition monitoring and early fire detection applications. These cameras can help companies protect assets, improve safety, maximize uptime, and minimize maintenance costs. Featuring a protective housing designed to withstand harsh environmental conditions, FLIR A500f/A700f cameras combine unmatched thermal imaging with edge computing and industrial internet of things (IIoT) for simplified inclusion in new or existing networks. For VMS integrations, thermal and visible streams can be viewed independently or simultaneously. The cameras are easy to add, set up, and operate in HMI/SCADA systems, offering automation system solution providers a running start.

  • CompactPCI

    3U PMC Carrier - PCI EmbeddedComputer Systems

    This conduction cooled 3U CompactPCI single slot PMC provides an active interface between the CompactPCI bus (backplane) and a PCI Mezzanine Card (PMC). This product addresses the needs of aerospace, military, and rugged applications. It contains a thermal heat frame made of aluminum that fits together with conduction cooled PMC modules. Conduction cooling conducts heat away from the hot spots of the board and transfers the heat to the card edges and to the system chassis. No active ventilation is necessary inside of the system, which means the boards are sealed from the environmental influences found outside of the chassis. The heat frame and integrated wedge locks for the conduction cooling stiffens carrier and PMC module enabling the board to resist high shock and vibration.

  • CompactPCI

    6U PMC Carrier - PCI EmbeddedComputer Systems

    This conduction cooled 6U CompactPCI dual slot PMC provides an active interface between the CompactPCI bus (backplane) and a PCI Mezzanine Card (PMC). This product addresses the needs of aerospace, military, and rugged applications. It contains a thermal heat frame made of aluminum that fits together with conduction cooled PMC modules. Conduction cooling conducts heat away from the hot spots of the board and transfers the heat to the card edges and to the system chassis. No active ventilation is necessary inside of the system, which means the boards are sealed from the environmental influences found outside of the chassis. The heat frame and integrated wedge locks for the conduction cooling stiffens the carrier and PMC module enabling the board to resist high shock and vibration.

  • Combination Board Tester

    V250 / V250PXI - Qmax Test Technologies Pvt. Ltd.

    V250 / V250PXI is designed as a Combination Board Tester capable of testing highly complex and dense PCBs employing various test techniques on a single platform. It can perform Board Level Functional Test through edge connectors of a PCB, and guided probe diagnostics utility to reliably repair Digital/Analog and Mixed Signal PCBs of various complexities and conventional PCBs. An In –Circuit device test by configuring Pin Drivers to High Current Pin Driver mode and interface to the UUT either through Clips / Probes or nail bed and on board clock disable HW feature are the all time favorite . The in-built high frequency 14bit Analog Driver / sensors synchronized with digital drivers for covering analog / mixed signal devices with high degree of accuracy.

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