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Product
1U 19” Edge Computing Platform with Intel® Xeon® D Processor
MECS-6120
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- 1x Intel® Xeon® D-17XX Series family processor- 3x DDR4-2666 RDIMM ECC REG up to 192GB- 2x 2.5” SATA bays and 2x M.2 M Key interfaces- 420mm depth 1U 19” rackmount form factor- Built-in Intel® QAT: SSL (20G), Compression (15G)- Intel® eASIC by card for FEC acceleration- EMC grade: Class B & Advanced chassis management, IPMI v2.0 compliant
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Radisys Management System
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The Radisys Management System is a carrier-grade management solution built to scale as your network evolves while maintaining high-performance levels.
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Radio Frequency, Communications, & Navigation Test Systems
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Reduce testing time and costs with the Astronics radio test sets for use in military, avionics, and civil security industries.Available in commercial and military grades, these integrated test systems make it easy to develop test program sets and leverage them securely and instantly across all deployed testers at the factory, depot, and operational levels.
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Value Family 9th Generation Intel® Core™ i7/i5/i3 & 8th Gen Celeron® Processor-Based Embedded Fanless Computer
MVP-5100 Series
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ADLINK MVP-5100 Series of fanless embedded computing platforms, incorporating the 9th Generation Intel® Core™ processor, is optimized for edge computing applications. The MVP-5100 Series consolidates high performance computing, scalable function and I/lO enhancements, and industrial-grade reliability onto a compact fanless platform, providing reliable long-time operation for performance-critical applications in industrial automation, logistics, transportation, and smart city segments.
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Systems
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In addition to our ISO 9001:2008 certification, we are proud to have the highest possible score for delivery-on-time and QA rating - 100% - from all the major aerospace companies.
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PICMG 1.0 Half-Size Single Board Computers
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PICMG 1.0 half-size Single Board Computers (SBC) suit multiple single board computer requirements. The slot SBC cards offer high speed and wide bandwidth computing platforms, with plug & play, providing flexibility in various industrial applications.
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OSM Size-L Module With NXP® I.MX8M Plus Series
OSM-IMX8MP
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The OSM-IMX8MP is an OSM R1.1 Size-L module featuring NXP® i.MX 8M Pluss series processor with 4-core Arm Cortex-A53 and M7, up to 8GB LPDDR4L memory and up to 128GB eMMC storage. With its in-SoC 2.3 TOPS NPU and Vivante GC7000UL graphics, the module is made for edge solutions needing on-device AI processing at ultra-low power.
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Medical Computer Equipped With MXM Graphics Module Supporting NVIDIA Quadro® GPU With 8th/9th Generation Intel® Core™ I7/i5/i3 In LGA1151 Socket. Compliant With IEC 60601-1/IEC 60601-1-2
MLB-3000
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- Medical grade computer compliant with IEC 60601-1:2005 + A1:2012 + A2:2020 (3.2 edition) / IEC 60601-1-2:2014 + A1:2020 (4.1 edition)- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT
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Qseven® Standard Size Module With Intel® 6th Gen. Atom® X6000 Processors (Formerly Elkhart Lake)
Q7-EL
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The ADLINK Q7-EL is a Qseven module that supports Intel Atom® x6000 (x6425RE, x6414RE, x6413E) processors (formerly Elkhart Lake) with integrated Intel® UHD graphics and high-speed interfaces. With mechanical dimensions of 70mm width, 70mm length, and 2.3mm of overall height, Qseven ranks as one of the smallest COM standards currently available. Q7-EL modules support up 16GB LPDDR4 memory, up to 256GB eMMC storage and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
Image Sensor Testing
IP750Ex-HD Family
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The IP750EX-HD has been the test platform that has enabled the industry to manufacture high quality CCD and CMOS image sensors, and it is the most economical platform to meet the needs of newer technologies such as Time of Flight (ToF) sensors. When you use a smartphone, high performance digital still camera, or in-home security and surveillance system, these applications have image sensors most likely tested by Teradyne’s IP750ExHD.
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Product
Modular Breakout System 160-Pin Plugin Module
95-190B-003
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The 95-190B-003 Plugin Breakout Module is designed to be fitted to a PXI 40-190B Fault Insertion Switch as part of the Pickering MBoS. The Modular Breakout System is designed to Simplify HILS (Hardware In the Loop Simulation) Applications.
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COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™, Xeon® and Celeron® Processors (formerly codename: Skylake)
Express-SL/SLE
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The Express-SL/SLE is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 6th Generation Intel® Core™ and Xeon® E3-and Celeron® processors (codename "Skylake-H") with IntelR QM170, HM170, CM236 Chipset.
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Data Acquisition and Control System
DAQ 7000
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data acquisition and control system that provides connectivity, signal conditioning and modular I/O for variety of sensors or signals, and it is an ideal DAQ for field deployment.
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HTOL Test Systems
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Our IOL & Power-Cycling systems increase measurement quality & throughput while simultaneously reducing the Total Cost of Test (TCoT) of an open platform. We focus on complete monitoring and precise temperature control for each device under test.
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VIP Inflight Entertainment Systems
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Astronics can outfit your entire cabin with the perfect A/V system to match your needs. From a custom monitor to a robust speaker system, Astronics' integrations will improve your inflight entertainment experience.
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Communications Test System for Frontline Diagnostics
CTS-2750
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The CTS-2750 is designed using Astronics Test Systems’ proven Synthetic Instrumentation architecture. Featuring 23instruments, and both Automated and Standalone modes to test, record, and diagnose faults, the unit provides complete RF, Analog and Digital capabilities. The field-upgradeable, software-defined architecture features easy-to-use graphical user interfaces and enables testing with minimal operator intervention. Test Program Sets can be created easily using the included TestEZ® software suite.
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Product
Image Sensor Test System
IP750
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Teradyne's IP750 series dominates the image sensor tester market with its superior performance and low cost of test. The IP750 delivers high throughput and high parallel test efficiency, broad device test coverage from CCD and CIS, analog and digital capture, and concurrent image sensor and logic testing. In addition, Teradyne's IG-XL software environment provides easy, shorter test program development and easy maintenance.
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Product
PXIe System Sync Module, 2 Port
M9032A
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The M9032A has a Soft Front Panel (SFP) that provides a graphical user interface to the system sync module. It allows the user to set up the most commonly used functionalities of the module. The SFP also gives you the ability to check the module's connection status, configure the reference clock and IO settings, and perform firmware udpates.
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Smart Sensing Systems
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The Astronics Smart Aircraft System enables the gathering of information through sensor and IoT technology to help airlines gain the valuable insight needed to increase passenger satisfaction, improve operational efficiency, and lower costs.
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Product
Universal Function Test System for Industrial Electronics
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General functional test system based on LXI instrumentation for high mix / low to medium volume manufacturing. DUTs are tested which are mainly used as communication and measurement modules in power plant technology, grid management and electrical drives.The system has a Virginia Panel adapter interface to which various desk adapters can be docked, including automated contacting of the DUTs. A camera for the verification of light emitting diodes on the test object is integrated in the adapter interface.
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Product
Memory Test System
T5221
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The T5521 is a memory test system that supports wafer test and wafer burn-in test of non-volatile memory devices such as NAND flash, housed within a multi-wafer prober to reduce test floor footprint.
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Extreme Rugged PC/104 Single Board Computer with Intel® Atom™ Processor System-on-Chip
CM1-BT1
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The CMx-BTx is a PC/104-based, Single Board Computer (SBC), fully compliant with the PCI-104 Specification, Version 1.1 and partially compliant with the PC/104 Specification, Version 2.6. PC/104 SBCs are very compact and highly integrated computers. This SBC features the 22nm, Intel® Bay Trail SoC. The board provides a DDR3L SO-DIMM socket, a PC/104 connector, a PCI-104 connector, two USB 2.0 ports, one USB 3.0 port, up to two Gigabit Ethernet ports, up to two SATA 3 Gb/s ports, one dedicated HD-Audio panel connector, one VGA port, one LVDS port, up to four COM ports, one mini-PCIe slot (with one USB 2.0 port included). The CMx-BTx can be run with only 5 volts and is capable of running operating systems like DOS, Windows XP/7/8 in either 32-bit or 64-bit configuration, Linux, VxWorks, and others. Another feature included on the board is a fail safe BIOS that enables the user to start the module even if the original BIOS is corrupted.
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Product
Battery Cell Formation System
17000 series
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Chroma 17000 series is specifically designed for the formation of Lithium Ion and Lithium Polymer secondary batteries. The 17000 series is a complete turn-key system, including carrier trays, robust battery probe contacts, high quality charge/discharge modules and intuitive software all under computer control. Patented Battery Voltage Tracking (BVT) DC-DC conversion power modules minimize power consumption in battery charging, and Energy Recycle Modules (ERM) recycle the discharged energy directly back to the DC power system for increased power efficiency. These power saving designs provide a planet friendly solution along with cost savings by reducing energy consumption. The intuitive software provides a flexible selection in the charge/ discharge channel, current rating, and modules under test. These features allow the Series 17000 to be used for final cell development, pilot line production, high volume production and ongoing reliability monitoring/quality control.
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Product
NI Semiconductor Test Systems
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The STS delivers the openness and flexibility of the NI PXI platform to the semiconductor production environment. For easy integration into the production test cell, the STS comes with features such as handler/prober integration, spring probe device under test interfacing, STDF data reporting, and system calibration.
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Scienlab Battery Test System – Pack Level, 110 KW Extendable Version
SL1720A
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Keysight’s SL1700A Scienlab Battery Test System – Pack Level Series allows to realistically emulate the environment of the future battery pack application in order to test the high-power battery pack comprehensively and improve its functions and safety. The growing demand of e-mobility increases the need of vast battery test labs for EV battery development.
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Product
In-Line Test System
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With an Averna in-line test system, clients boost production/yields, catch defects invisible to the human eye, reduce equipment downtime, and ensure repeatable results.
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Product
Benchtop Communication Test System
ATS3000A
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The ATS3000A is designed using Astronics Test Systems’ proven Synthetic Instrumentation architecture. Featuring 23 instruments, and both Automated and Standalone modes to test, record, and diagnose faults, the unit provides complete RF, Analog and Digital capabilities. The ATS3000A also includes the sophisticated IF and baseband I/Q Digital Signal Processing required for modern radios. The fieldupgradeable, software-defined architecture features easy-touse graphical user interfaces and enables testing with minimal operator intervention. Test Program Sets areavailable for a full range of tactical radios, or you can create new TPSs easily using the included TestEZ® software suite.
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4U 8-Slot CompactPCI® System with Redundant Power Supplies
cPCIS-6418U
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The cPCIS-6418U Series Subsystem is designed for maximum density and has 8 horizontal slots for 6U cPCI boards with 80mm RTMs. The chassis is 4U in height and standard 19" rack mount width.
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SMARC® Short Size Module with Intel® Atom™ Processor E3800 Series System-on-Chip
LEC-BTS
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- Single, dual or quad-core Intel® Atom™ Processor E3800 Series System-on-Chip- Up to 4 GB DDR3L at 1066/1333 MHz (non-ECC)- HDMI and LVDS- GbE, camera interface- 1x SATA 3Gb/s, 1x USB 3.0, 3x USB 2.0, max. 12x GPIO- Extreme Rugged™ operating temperature: -40°C to +85°C
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Emergency Systems
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Safety and survival products which aid in on-board emergencies, aircraft evacuation, and search and rescue operations.





























