Interconnect Stress Test
accelerated test of PCB pads, lines and thru-holes.
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PCIe 5.0 Test Platform
PXP-500A
The Teledyne LeCroy PXP-500A Test Platform provides a convenient means for testing PCIe 5.0 cards with a self-contained portable and powered passive backplane. The PXP-500A provides power required for both cards under test.
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Scalable Tester System for Functional Testing
UTP6010
The UTP6010 is a scalable tester system for functional testing, comprising an integrated main switching unit, a keyboard drawer and a swivelling monitor. It is the reliable, modular, low priced UTP starter kit. The system is suitable for tester applications, where space-saving devices are required, because its construction height is only 12 HU (excluding keyboard drawer and main switching unit).
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Functional Test
xUTS
Extend test to encompass copious test points and DUT varieties along with real-time, hardware-in-the-loop and other state-of-the-art instrumentation. extendedUTS (xUTS) is a custom product for high complexity functional test. Configured for the unique needs of a class of devices under test (DUTs), the xUTS employs our universal test system approach that combines the best open platform instrumentation and software along with mass interconnect technology.
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Standard for Mass Interconnect Performance
TITAN
TITAN sets the standard for Mass Interconnect performance, configuration modularity and long term reliability. TITAN has been designed to offer exceptional configuration flexibility for use with any ATE platform and offers unparalleled I/O density coupled with the widest selection of contact types available for Mass Interconnect.
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Interconnect Adapter, C-Size, Double Slot, 4 Module Positions
510109118
Interconnect Adapters funnel wiring from modules to a VXI card. The adapter has removable side, top and bottom plates. Connector cover plates and cable clamps are ordered separately.
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Highly Accelerated Stress Screening (HASS) Test
HASS consists of high and low temperature and 3 axis vibration testing performed either individually or in combination.Highly accelerated stress screening is a technique for identifying process flaws in equipment during production. HASS subjects equipment to overstress conditions but at a level which does not affect design life.For assistance in designing a HASS test program contact the laboratory.
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BMS Manufacturing Test System
The Battery Management System (BMS) Manufacturing Test System performs functional testing of product during end-of-line manufacturing. The system hardware includes all instrumentation to test a BMS, including multiple cell simulators, a mass interconnect for quick product transition and bed-of-nail fixtures to ensure less down time, higher throughput, and easy maintenance. The system application easily integrates into manufacturing processes, provides a method to test multiple product types, and optimizes tests to ensure only good product is released from manufacturing.
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Test System for Detecting Exact PCB Short Circuit Locations
QT25
Qmax Test Technologies Pvt. Ltd.
QT25 employs a unique method to detect exact PCB shorts circuit locations and pin down the shorted components and tracks. It is designed in such a manner that it precisely detects exact short circuit locations across VCC - GND or a shorted component connected across a Bus or hair-line shorts between PCB tracks, Which is highly impossible to detect using conventional tools especially when they are connected parallel in circuit. It can also be used in measuring the contact resistance of switches and relays in its milli-ohm mode as a value add.
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H(3)TRB & HTGB Test Systems
SET offers two H(3)TRB and HTGB product lines which differ in the number of test object channels and the range of technical possibilities. The innovative systems are scalable, modular and standardized.
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SAS Protocol Compliance and Stress Test Suite
GRL-SAS-SUITE
GRL’s SAS Protocol Compliance and Stress Test Suite (GRL-SAS-SUITE) is the most complete commercially available SAS conformance test solution, covering up to SAS 12G speeds. A versatile and comprehensive application, GRL-SAS-SUITE automates testing all layers of SAS Protocol in a click of a button, eliminating the time-intensive tasks of validating SAS conformance: writing your own test cases, creating trainer and verification scripts, and proving everything in hardware. GRL-SAS-SUITE is compatible with the popular Teledyne LeCroy Sierra SAS Protocol Analyzer & Exerciser, runs on any Windows 7 or Windows 8 PC and addresses all areas of the SAS-1, SAS-2, and SAS-3 protocol specifications.
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EFT Module for Teststand
The Electronics Functional Test (EFT) Module for TestStand provides out-of-the-box tools to speed up development of automated tests for electronic assemblies including PCBAs, subassemblies and final assemblies. Test engineers can develop, deploy and execute test sequences quickly and efficiently with minimal custom code development for a shorter time-to-solution.
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Flying Prober Test System
QTOUCH1404C
Qmax Test Technologies Pvt. Ltd.
The Prober Test System is capable of movement in XYZ directions with fixed angle (θ) and dual probe heads (further expandable up to 4 ) . The system has in-built high resolution Vision Camera for easy monitoring of probe needle contact. The prober supports automatic fiduciary recognition. The system has built –in linear encoders to achieve higher precision.
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Cable Assemblies for Interconnect Solutions
High quality connectors are just the beginning. Circuit Assembly (CA) also has over three decades of experience in producing a wide variety of cable assemblies for various applications. CA has the technical and manufacturing capabilities to provide customers with high-quality and cost-effective cable assemblies tailored to meet their needs. Circuit Assembly utilizes a quality process recognized by ISO 9001, and CA's cable assemblies are UL/CSA certified.
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Bottom Electrode SMD Test Fixture
16197A
The 16197A is designed for impedance evaluations of bottom electrode SMDs. It achieves stable frequency characteristics up to 3 GHz and provides highly repeatable measurements. The Keysight 16197A supports various SMD sizes, as small as 1005 (mm)/0402 (inch) and as large as 3225 (mm)/1210 (inch). Accommodation of the 0603 (mm)/0201 (inch) size is available with option 001.
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ESS Environment stress screening
Temperature adaptability test under the condition of rapid change, or gradient for electrical, electronic, instruments and other products or spareparts, particularly applies to environmental stress screening test（ESS）
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True Concurrent Test
TestStation Duo
The TestStation Duo is a true concurrent test system with independent test modules providing fast in-circuit test throughput and lowering high-volume production costs.It effectively doubles the test throughput of conventional in-circuit test systems, without doubling capital equipment costs or increasing manufacturing floor space, by combining two complete and independent test modules inside a single tester frame.
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Stress Analysis Strain Gages
Bondable foil strain gages (strain gauges) available in thousands of possible pattern designs and combinations of grid alloys, backing materials, resistances, and options.
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ARINC 818 Tester
iWave 3U VPX High-Speed Video/Data Processing Card is a rugged standalone module in the 3U VPX form factor, aimed for the high-speed data, video processing, and display applications is ideal for military, defense, and aerospace applications requiring an optimal balance of performance and power efficiency. iWave 3U VPX High-Speed Video/Data Processing Card is implemented using Xilinx Kintex-7 device architecture and has I/O interfaces including High speed 16 channels of transceiver interfaces capable of operating up to 6 Gbps data rate, Gigabit Ethernet, RS232, RS422, PCIe interface, Built-in health monitoring circuits, HDMI input, and output interfaces
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Bottom Electrode SMD Test Fixture
16198A
Designed for impedance evaluations of bottom electrode SMDs and supports 201 (mm) and 402 (mm) sizes
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Molded Interconnect Subtrate
A substrate interposes between an IC chip and a motherboard to enable the IC chip to communicate with the motherboard effectively. Typically, the IC chip is attached onto the substrate and assembled into an IC package before connecting to the motherboard. It is an essential part of the IC package and is responsible for a successful packaging process. Also, it plays an important role in making the IC chip to become a real product and a real solution for end customers. In the past years, semiconductor technologies were highly driven by PC applications which follow Moore’s law in technology migration. In recent years, the emergence of mobile applications increasingly, become the main driver in the semiconductor industry. These mobile applications requires a new kind of substrate that have ability for making IC packages with smaller form factor, thin profile, better thermal, mechanical and electrical performance.
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Advanced SoC/Analog Test System
3650-EX
Chroma 3650-EX is specifically designed for high-throughput and high parallel test capabilities to provide the most cost effective solution for fabless, IDM and testing houses.
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Heat Stress
Our lineup of heat stress meters include the WBGT (Wet Bulb Globe Temperature) meters, which provides the most accurate determination of the heat stress index based on the cumulative effect of air temperature, air movement, relative humidity, and radiant heat.
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Ethernet and Fibre Channel Test Platform
SierraNet M1288
The SierraNet M1288 Ethernet and Fibre Channel test platform provides best in class analysis, jamming and generation for traffic capture and manipulation for testing application and link characteristics. SierraNet M1288 is the latest in the line of industry leading test and measurement tools from Teledyne LeCroy, designed for today’s high-speed storage and communications fabrics. SierraNet M1288 supports examination and modification of Ethernet and Fibre Channel links utilizing both Pulse Amplitude Modulation 4 (PAM4) and legacy Non-Return to Zero (NRZ) technologies.
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Dynamic Test Systems
H3TRB | HTGB (HTGS) | RTGB (RTGS)
Durability and reliability of wide-bandgap materials such as SiC and GaN are an important topic. The focus here is on new failure mechanisms whose effects are not visible with traditional H(3)TRB/HTGS – but which nevertheless have an influence on the real application.
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PAM analysis upgrade for Signal Integrity Studio, WavePulser 40iX High-Speed Interconnect Analyzer
WAVEPULSER-SI-STUDIO-UPG-PAM
Signal Integrity (SI) Studio uses SDA Expert (SDAX) serial data analysis software options to simplify NRZ or PAM serial data jitter, eye diagram, noise and crosstalk measurement and analysis setup.
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PXI Digital Test Instrument
PXIe-6943
Conduct pattern-based digital tests incorporating the latest parallel, digital, serial, and bus protocols with the PXIe-6943 digital test instrument.This instrument is TPS-compatible with the legacy VXI digital test instrument from Astronics as well as other instrument vendors.
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Test Fixture Kits
More then ten years of experience in special, customized engineering and manufacturing brought us to the highest level of creating reliable, flexible and robust Test Fixtures. Currently our HQ is located in Vecsés, Hungary together with our R&D. Equip Group has Test Fixture Kit manufacturing plant in Serbia, focusing on supplying competitive, high – quality and high – volume products for the global market.With more then 180 employees, Equip – Test is able to offer our customers turnkey solutions in fixturing with test program generation. No matter if you have a simple or complex, high-density PCB (Printed Circuit Boards), or if you have DUT (Device Under Test) already assembled into metal or plastic housing, we can offer you a very stable technical solution.
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Material Testing & Physical Testing
Meeting the specifications put out by testing equipment manufacturers is critical when conducting quality control testing. We carry a wide variety of materials testing and physical testing products that are ideal for quality control testing along with research applications, letting you evaluate and test materials such as plastics, coatings, and chemicals. Physical properties testing products range from force and torque instruments, to hardness and thickness gauges, to viscometers and spectrometers.
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Automated Thermal Stress System
ATSS Series
Thermotron's Automated Thermal Stress Systems (ATSS) facilitate extremely rapid product temperature change rates in a space-saving, self-contained design that accelerate a Thermal Stress test. Thermotron's ATSS chambers meet the latest MIL-STD 883E and MIL-STD 202F thermal shock specifications as well as JEDEC and IPC test methods. ATSS chambers are capable of the following: Rapid thermal shocking, Accelerated product stressing, Controlled thermal cycling in a self-contained, compact design. With separate hot and cold zones, the Automated Thermal Stress System was designed with a patented retractable product transfer carrier that makes full use of the available working volume in both temperature zones for increased product loading and throughput. The product transfer carrier reduces the overall height requirements of the chamber and is made as light as possible to minimize thermal loading restraints. Thermotron ATSS chambers can be used as part of most commercial reliability and quality control programs, helping to determine:
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Test Sockets
BGA/LGA
There are a lot of options when it comes to bench test sockets. Save yourself and your lab time, money and frustration by working with Ardent for truly customized test socket solutions to meet your needs and do the job with high performance, reliability and quick turnaround that you need and deserve.
