System-on Chip
A complete computer "System on a Chip".
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Product
Chip Manufacturing
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KLA’s advanced process control and process enabling solutions support integrated circuit manufacturing. Using KLA’s comprehensive portfolio of defect inspection, review, metrology, patterning simulation, in situ process monitoring and data analytics systems, IC manufacturers can manage yield and reliability throughout the chip fabrication process - from research and development to final volume production. SPTS provides deposition process solutions for insulating materials and conducting metals that cover a range of chip manufacturing process steps. IC manufacturers use KLA's array of products and solutions to help accelerate their development and production ramp cycles, to achieve higher semiconductor die yield and improved IC quality, and to improve overall profitability in the IC manufacturing process.
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Product
Chip Inspection System
GEN3000T
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GEN3000T is an inspection system that performs automatic inspection of individual semiconductor chips.This revolutionary chip surface inspection system was achieved by combining the chip handling technology cultivated by Toray with the inspection algorithm used in the "INSPECTRA®" wafer defect inspection system.
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Product
ISDN Chip Set
Emutel Symphony
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Emutel Symphony is a convenient and flexible Basic Rate ISDN, Primary Rate ISDN and Analog PSTN network simulator. With support for S, U, E1, T1 and PSTN analog interfaces you can use the Emutel Symphony to test and develop a full range of ISDN(E1/T BRIS BRIU) and PSTN analog (FXS) equipment.
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Product
Memory Interface Chips
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Providing memory bandwidth and capacity to unleash the power of multicore processors
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Product
Chip Tester
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Chip aging test is a very important task. It simulates various environmental and stress conditions of the chip during long-term use, evaluates its reliability and life, and provides effective reference and guidance for chip product design and manufacturing. It is necessary to select high-quality chip testers to ensure accurate test data, thereby further improving the reliability and life of chip products.
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Product
Chip Resistors
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Panasonic Industrial Devices Sales Company of America
Panasonic offers a wide range of Chip Resistors including conventional Thick Film Chip Resistors, Specialized Resistors such as Thin Film, Current Sense, Anti-Sulfur, Anti-Surge and Metal Film Chip Resistors.Panasonic’s standard Thick Film Chip Resistors are offered in cases sizes from 01005 to 2512.
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Product
OBD Chips
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STNxxxx OBD-II to UART Interpreter ICs are developed by our in-house engineering team at OBD Solutions. STNxxxx chips combine ELM327 compatibility with advanced hardware at an unbeatable price. We utilize STN11xx technology in all of our OBDLink scan tools.
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Product
Chip Resistor Networks
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Panasonic Industrial Devices Sales Company of America
Chip Resistor Networks by Panasonic
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Product
90μm Ceramic Interdigitated Electrode Chip
CIC1
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Ceramic IDE chip with a 90μm gap designed for gas sensing, humidity monitoring, biosensor development, and capacitive sensing.
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Product
Chip Obsolescence Solutions
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Solve component obsolescence problems with an Ironwood adapter and an alternate device. Adapters convert the pinout of an alternate device to maintain compatibility with an existing footprint – no need to redesign a new circuit board. Very often, these adapters (called Package Converters) are a simple 1:1 pin mapping from the new package to the old. Here are a few examples of package converters and how they can solve chip obsolescence issues.
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Product
20μm Silicon Interdigitated Electrode Chip
SBC1
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High-stability 20μm silicon IDE chip for MEMS, gas sensing, biosensing, and photoelectric applications.
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Product
UltraZed PCIe Carrier Card for UltraZed-EG System-on-Module
AES-ZU-PCIECC-G
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The UltraZed PCIe Carrier Card supports the UltraZed-EG System-on-Module (SOM), providing easy access to the full 180 user I/O, 26 PS MIO, and 4 PS GTR transceivers available from the UltraZed-EG SOM via three Micro Headers. Two 140-pin Micro Headers on the carrier card mate with the UltraZed-EG SOM, connecting 180 of the UltraZed-EG Programmable Logic (PL) I/O to 2 Digilent Pmod™ compatible interfaces, FMC LPC slot, LVDS Touch Panel interface, push button switches, DIP switches, LEDs, Xilinx SYSMON, and clock oscillator.
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Product
Wafer Chip Inspection System
7940
System
Chroma 7940 wafer chip inspection system is an automated inspection system for postdiced wafer chip inspection.
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Product
300μm Ceramic Interdigitated Electrode Chip
CIA1
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The CIA1 300um Ceramic Interdigitated Electrode Chip is designed for gas sensing, humidity sensing, biosensing, impedance measurement, and MEMS-related electrochemical or electrical detection research.
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Product
10G DFB Laser Diode Chips
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Guilin GLsun Science and Tech Group Co., LTD
10G DFB Laser Diode Chips by GLSN
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Product
Chips and Diodes
NC100/200/300/400 Series
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Noisecom's noise diodes are the fundamental building blocks for analog noise systems. They are sorted for performance characteristics that enhance their broadband noise output and flat spectral response. All Noisecom noise diodes can deliver symmetrical white Gaussian noise and flat output power versus frequency
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Product
100μm Flexible PET IDE Sensor Chip
FPI1
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100μm flexible PET interdigitated electrode (IDE) sensor chip for gas sensing, humidity monitoring, biosensing, and capacitive sensing research. The electrode geometry is designed for repeatable response, compact sample volumes and easy integration with potentiostats or custom fixtures.
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Product
100μm Flexible Gold Interdigitated Electrode Chip (PI)
FIG1
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Flexible gold IDE chip on a polyimide (PI) substrate for humidity, gas sensing, and optoelectronic research.
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Product
16GB DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-D4U16GE32-SE
Memory Module
16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
10μm Transparent Quartz IDE Chip
TID1
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The TID1 10um Transparent Quartz IDE Chip is an interdigitated electrode chip designed for gas sensing, humidity sensing, biosensing, impedance measurement, and MEMS-related electrochemical or electrical detection research. The 10 um transparent electrode geometry provides a defined interdigitated pattern for surface-functionalized sensing experiments. The quartz glass substrate supports optical access, transparent sensing, and photoelectric detection, while the IDE layout helps improve interaction between the electrode fingers and the target film, electrolyte, vapor, or biological interface.
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Product
LED Tester For Chip And Wafer
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Electrical Testing: Forward：VF,DVF,VFDReverse：VZ,IROptical Testing: can test LOP in cd/mcd/W/mW/lm... from different optical componentsWavelength λp,λd,λc,hw,purity,(x,y),CCT,CRIFour-wire measurement and contact resistance in case of deviation.Auto polarity identification and preheat function.Compatible mechanical interface.Optional ESD static test system or polycrystalline test system
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Product
200μm Flexible PET Interdigitated Electrode Chip
FPL1
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200μm flexible PET IDE chip designed for biosensing, gas sensing, and humidity monitoring applications.
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Product
100μm Large Ceramic IDE Sensor Chip
LSC1
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100 μm large-size ceramic interdigitated electrode (IDE) sensor chip with a 10 × 20 mm sensing area. Designed for gas sensing, humidity monitoring, biosensing, and capacitive sensor research.
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Product
10μm Quartz Interdigitated Electrode Chip
BAP1
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Transparent quartz IDE chip with a 10μm gap for gas sensing, biosensing, and photoelectric applications.
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Product
Metal Foil Llow Resistance Chip Resistor
MFR (Metal foil)
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*Low Resistance / TCR / EMF 9only FOR MnCu) / Inductance*Excellent long term stability*RoHS compliant and halogen free.*Lead free.* High precision current sensing and voltage division.
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Product
High Voltage Thick Film Chip Resistors
HVTK (HVR)
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*Highly reliable multilayer electrode construction*Higher component and equipment reliability*Excellent performance at high voltage*Reduced size of final equipment
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Product
Thick Film Chip Resistors
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
8GB SO-DIMM DDR5-5600 262Pin 1GX16 1.1V Unbuffered Hynix Chip
AQD-SD5V8GN56-HC
Memory Module
Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
Chip Inductors AECQ200 Compliant
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Bourns products include surface-mount chip inductors, power chokes, chip beads, chip bead arrays, as well as radial-leaded and axial-leaded inductors. These components are used in computer, communication, instrumentation, industrial, and medical applications.
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