System-on Chip
A complete computer "System on a Chip".
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Product
Chip Resistor Array
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
Capacitors - Binary Chip
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Macom Technology Solutions Holdings Inc.
MACOM’s BOO and BSP Series Capacitors are designed to facilitate bread-boarding or to use where a trimming capability is required. These devices feature the same dielectric layer and bonding surfaces as our 9000 and 9100 Series chip capacitors. By connecting the pads in parallel, the capacitance values are additive, so many combinations are possible.
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Product
Battery Management Chip Module
Sentinel
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The first single system on chip module. Measures cell voltage, cell internal temperature and cell impedance.
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Product
Chip Inductors AECQ200 Compliant
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Bourns products include surface-mount chip inductors, power chokes, chip beads, chip bead arrays, as well as radial-leaded and axial-leaded inductors. These components are used in computer, communication, instrumentation, industrial, and medical applications.
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Chip Rings
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Panasonic Industrial Devices Sales Company of America
Extremely robust Chip Rings for signal measuring terminals featuring a metal sheet structure for high reliability.
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Product
High Temperature Chip Resistors
ERJ-Hxx Series
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Panasonic Industrial Devices Sales Company of America
Panasonic’s ERJ-Hxx Series Automotive Grade Thick Film Chip Resistors feature a maximum Category Temperature of 175°C and a maximum Rated Operating Temperature of 105°C. The ERJ-Hxx Series is AEC-Q200 compliant, ensuring strict quality control standards are in place to enforce optimal quality and reliability. The ERJ-Hxx Series Resistors offer a small size, higher power Resistor alternative that provides enhanced flexibility of PCB design by reducing solder-joint crack risk. This series is ideal for use in automotive, ICT, general industrial applications, and more.
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Product
Memory Interface Chips
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Providing memory bandwidth and capacity to unleash the power of multicore processors
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Product
Chip Obsolescence Solutions
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Solve component obsolescence problems with an Ironwood adapter and an alternate device. Adapters convert the pinout of an alternate device to maintain compatibility with an existing footprint – no need to redesign a new circuit board. Very often, these adapters (called Package Converters) are a simple 1:1 pin mapping from the new package to the old. Here are a few examples of package converters and how they can solve chip obsolescence issues.
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Product
Qseven Module with 4th Generation Intel Atom® Processor E3800 Series SoC (formerly codename: BayTrail)
Q7-BT
Computer on Module
The Q7-BT Computer-On-Module (COM) combines the Qseven® 2.0 standard with the Intel® Atom™ E3800 series System-on-Chip (SoC), providing an ideal solution for mid-range power and high, pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Product
UltraZed PCIe Carrier Card for UltraZed-EG System-on-Module
AES-ZU-PCIECC-G
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The UltraZed PCIe Carrier Card supports the UltraZed-EG System-on-Module (SOM), providing easy access to the full 180 user I/O, 26 PS MIO, and 4 PS GTR transceivers available from the UltraZed-EG SOM via three Micro Headers. Two 140-pin Micro Headers on the carrier card mate with the UltraZed-EG SOM, connecting 180 of the UltraZed-EG Programmable Logic (PL) I/O to 2 Digilent Pmod™ compatible interfaces, FMC LPC slot, LVDS Touch Panel interface, push button switches, DIP switches, LEDs, Xilinx SYSMON, and clock oscillator.
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Product
Chip Test Adapter
RAMCHECK Sync
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The RAMCHECK Sync Chip Adapter tests popular TSOP SDRAM memory chips in sizes of 16Mx16, 4Mx16, 32Mx8, 8Mx8, 64Mx4, 16Mx4 and more. Picture above shows the adapter with all optional sockets for 54, 50 and 44-pin.
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Product
6 Chip Detection and Burn Channels
CD1
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The CD1 provides 6 Chip Detect and Fuzz Burn interface(s). A Chip Detector (CD) is a magnetic-electrical device that provides a reliable method of detecting impending failure of bearings and gears.
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Product
Metal Glazed High Voltage Chip Resistors, Anti-Sulfuration
SMG Series
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*Flameproof UL94VO molded package, resistance to sulfuration, heat and humidity.*Special design for automatic surface mounting.*Metal-glaze elements provide high stable performance against environmental conditions and overload.Excellent mechanical strength & electrical stability.*Reducing assembly costs.
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Product
Anti-Surge High Power Thick Film Chip Resistors
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Panasonic Industrial Devices Sales Company of America
Anti-Surge High Power Thick Film Chip Resistors by Panasonic
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Product
32GB DDR4-3200 2GbX8 1.2V Samsung Chip
AQD-D4U32GN32-SB
Memory Module
32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
Metal Alloy Low Resistance Chip Resistor
MR
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*Low Resistance / TCR / Inductance*Excellent long term stability*RoHS compliant and halogen free*Lead free*High precision current sensing and voltage division
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Product
8G DDR3-1600 240Pin 512MX8 1.35V Unbuffered Samsung Chip
AQD-D3L8GN16-SG1
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DDR3 1600Mhz Unbuffered DIMM, 30μ" gold plating thickness, 1.35V power consumption, Samsung original chip.
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Product
Chip Tester
TL2000
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ficonTEC’s series of testing machines is focused on automated electro-optical characterization ofsemiconductor chips. The ficonTEC TL2000 is a fully automated test and inspection system for unmountedlaser diode bars, single chips and chips on submounts.
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Product
High Voltage Thick Film Chip Resistors
HVTK (HVR)
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*Highly reliable multilayer electrode construction*Higher component and equipment reliability*Excellent performance at high voltage*Reduced size of final equipment
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Product
8G SO-DDR3-1600 204Pin 512MX8 1.35V ECC Samsung Chip
AQD-SD3L8GE16-SG
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DDR3-1600 ECC SO-DIMM, 204-Pin, 512MX8,Samsung Chip,
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Product
8 Bit IO Port Chip
PCF 8574
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The Philips PCF 8574 is an easy to use 8 bit IO port chip. An advantage over many more recent chips is 5V operation, that give you far more drive.
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Product
16GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-SD4U16GE32-SE
Memory Module
16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
16GB DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-D4U16GN32-SE
Memory Module
16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
Precision Shunt Chip Resistors
SMV
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*5W permanent power at 65C*High pulse power rating*Mounting: Reflow and wave-soldering
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Product
32GB DDR5-5600 288Pin 2GX8 1.1V Unbuffered Hynix Chip
AQD-D5V32GN56-HB
Memory Module
Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
4G DDR3-1600 240Pin 512MX8 1.35V ECC Samsung Chip
AQD-D3L4GE16-SG
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DDR3-1600 ECC, 240-Pin, Samsung Chip.
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Product
Anti-Sulfurated Chip Resistor Array
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
-
Product
8GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-SD4U8GE32-SE
Memory Module
8GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
32G DDR5-4800 288Pin 2GX8 1.1V Registered Samsung Chip
AQD-D5V32GR48-SB
Memory Module
Samsung Original Chip, Increased Banks and Burst Length. DDR5 4.8GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
